المؤلفون: Lu, Dichen, Ye, Yuxin, Liu, Ruiwen, Wu, Mei, Du, Xiangbin, Yu, Lihang, Qiao, Jingping, Liu, Ziyu, Kong, Yanmei, Jiao, Binbin, Ma, Xiaohua, Hao, Yue

المصدر: IEEE Transactions on Electron Devices ; volume 71, issue 1, page 502-509 ; ISSN 0018-9383 1557-9646

الاتاحة: http://dx.doi.org/10.1109/ted.2023.3338586
http://xplorestaging.ieee.org/ielx7/16/10382412/10364726.pdf?arnumber=10364726

المؤلفون: Yu, Lihang, Jiao, Binbin, Ye, Yuxin, Du, Xiangbin, Kong, Yanmei, Liu, Ruiwen, Qiao, Jingping, Yun, Shichang, Wang, Zhiqiang, Li, Wei, Yan, Yingzhan, Lu, Dichen, Liu, Ziyu, Yang, Ronggui

المصدر: Applied Thermal Engineering ; volume 247, page 122953 ; ISSN 1359-4311

الاتاحة: http://dx.doi.org/10.1016/j.applthermaleng.2024.122953
https://api.elsevier.com/content/article/PII:S1359431124006215?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1359431124006215?httpAccept=text/plain

المؤلفون: Qiao, Jingping, Chen, Jingyu, Jiao, Binbin, Liu, Ruiwen, Kong, Yanmei, Ye, Yuxin, Yu, Lihang, Du, Xiangbin, Yun, Shichang, Hao, Qixing, Lu, Dichen, Liu, Ziyu

المصدر: IEEE Sensors Journal; January 2024, Vol. 24 Issue: 2 p1245-1254, 10p

المؤلفون: Du, Xiangbin, Jiao, Binbin, Ye, Yuxin, Kong, Yanmei, Yu, Lihang, Liu, Ruiwen, Yun, Shichang, Lu, Dichen, Qiao, Jingping, Liu, Ziyu, Yang, Ronggui

الاتاحة: http://dx.doi.org/10.2139/ssrn.4606561

المؤلفون: Meng, Xinhao^1,2 (AUTHOR), Jiao, Binbin¹ (AUTHOR) jiaobinb@ime.ac.cn, Ye, Yuxin^1,3 (AUTHOR), Kong, Yanmei¹ (AUTHOR), Liu, Ruiwen¹ (AUTHOR), Yu, Lihang^1,2 (AUTHOR), Qiao, Jingping^1,2 (AUTHOR), Lu, Dichen^1,2 (AUTHOR), Liu, Ziyu^1,2 (AUTHOR)

المصدر: Measurement (02632241). Jan2025:Part C, Vol. 242, pN.PAG-N.PAG. 1p.

مصطلحات موضوعية: *THERMAL interface materials, *MATERIALS testing, *THERMAL conductivity, *THERMOPHYSICAL properties, *THERMAL properties, *THERMAL resistance