المؤلفون: Liu, Jinxu, Gao, Wei, Hu, Zhanyi

مصطلحات موضوعية: Computer Science - Robotics

URL الوصول: http://arxiv.org/abs/2010.11675

المؤلفون: Fang, Zhen, Zhang, Jihua, Liu, Jinxu, Chen, Hongwei, Gao, Libin, Yang, Xiaolin, Li, Wenlei, Cai, Xingzhou, Guo, Huan

المساهمون: Fundamental Research Funds for the Central Universities

المصدر: IEEE Transactions on Microwave Theory and Techniques ; volume 72, issue 1, page 54-63 ; ISSN 0018-9480 1557-9670

الاتاحة: https://doi.org/10.1109/tmtt.2023.3280945
http://xplorestaging.ieee.org/ielx7/22/10388388/10147387.pdf?arnumber=10147387

المؤلفون: Fang, Zhen, Zhang, Jihua, Gao, Libin, Li, Shuqi, Liu, Jinxu, Chen, Hongwei, Yang, Xiaolin, Li, Wenlei, Cai, Xingzhou, Cheng, Yujian

المساهمون: Fundamental Research Funds for the Central Universities

المصدر: IEEE Transactions on Microwave Theory and Techniques ; volume 72, issue 7, page 3908-3919 ; ISSN 0018-9480 1557-9670

الاتاحة: https://doi.org/10.1109/tmtt.2023.3337382
http://xplorestaging.ieee.org/ielx7/22/10581889/10345699.pdf?arnumber=10345699

المؤلفون: Liu, Jinxu, Gao, Wei, Hu, Zhanyi

مصطلحات موضوعية: Computer Science - Robotics

URL الوصول: http://arxiv.org/abs/2002.00195

المؤلفون: Liu, Tianyu, Liu, Xingwei, Wang, Ling, Wang, Kaihua, Li, Shun, Tang, Fawei, Shan, Dongdong, Liu, Jinxu

المصدر: Intermetallics ; volume 178, page 108632 ; ISSN 0966-9795

الاتاحة: https://doi.org/10.1016/j.intermet.2024.108632
https://api.elsevier.com/content/article/PII:S0966979524004515?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0966979524004515?httpAccept=text/plain

المؤلفون: Fang, Zhen, Zhang, Jihua, Liu, Jinxu, Wen, Ding, Gao, Libin, Chen, Hongwei, Cai, Xingzhou, Tao, Zhihua, Zhang, Wanli

المساهمون: Dongguan Key Research and Development Program

المصدر: IEEE Electron Device Letters ; volume 46, issue 1, page 84-87 ; ISSN 0741-3106 1558-0563

الاتاحة: https://doi.org/10.1109/led.2024.3493599
http://xplorestaging.ieee.org/ielx8/55/10819302/10746531.pdf?arnumber=10746531

المؤلفون: Wu, Niannian, Mitoma, Nobuhiko, Mori, Shunsuke, Chiew, Yi Ling, Yu, Xiuzhen, Oshima, Yugo, Wang, Shuxu, Liu, Jinxu, Aida, Takuzo

المساهمون: Core Research for Evolutional Science and Technology, Japan Society for the Promotion of Science

المصدر: Journal of Materials Chemistry C ; volume 13, issue 4, page 1680-1686 ; ISSN 2050-7526 2050-7534

الاتاحة: https://doi.org/10.1039/d4tc03420a
http://pubs.rsc.org/en/content/articlepdf/2025/TC/D4TC03420A

المؤلفون: He, Dan, Zhang, Ying, Liu, Jinxu, Wang, Xiao, Hu, Yunlong, Xu, Weihui, Chen, Wenjing, Fan, Zhenyu, Wang, Zhigang

المصدر: Journal of Applied Microbiology; Dec2024, Vol. 135 Issue 12, p1-10, 10p

مصطلحات موضوعية: MONOSODIUM glutamate, SOLID-state fermentation, WASTE treatment, ASPERGILLUS niger, CANDIDA tropicalis

المؤلفون: Ding, Chao, Niu, Gang, Wang, Enmao, Liu, Jinxu, Gong, Na, Liu, Hongfei, Wang, Yong, Yu, Xinpan, Wang, Xuelin, Shang, Chengjia, Wu, Huibin

المساهمون: School of Materials Science and Engineering

مصطلحات موضوعية: Engineering::Materials, Lath Martensite, Flash Tempering

وصف الملف: application/pdf

Relation: Journal of Materials Research and Technology; Ding, C., Niu, G., Wang, E., Liu, J., Gong, N., Liu, H., Wang, Y., Yu, X., Wang, X., Shang, C. & Wu, H. (2023). Significant efficiency improvement of conventional tempering by a novel flash tempering technique. Journal of Materials Research and Technology, 25, 3551-3560. https://dx.doi.org/10.1016/j.jmrt.2023.06.153; https://hdl.handle.net/10356/171778; 2-s2.0-85163822445; 25; 3551; 3560

الاتاحة: https://hdl.handle.net/10356/171778
https://doi.org/10.1016/j.jmrt.2023.06.153

المؤلفون: Liu, Jinxu, Li, Leilei, Yang, Shanwu, Ding, Chao, Wang, Enmao, Yu, Xinpan, Wu, Huibin, Niu, Gang

المساهمون: Fundamental Research Funds for the Central Universities

المصدر: Journal of Materials Research and Technology ; volume 27, page 2346-2362 ; ISSN 2238-7854

الاتاحة: http://dx.doi.org/10.1016/j.jmrt.2023.10.008
https://api.elsevier.com/content/article/PII:S2238785423024572?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S2238785423024572?httpAccept=text/plain

المؤلفون: Gawande, Dinesh Y., Shelkar, Gajanan P., Narasimhan, Kishore Kumar S., Liu, Jinxu, Dravid, Shashank M.

المصدر: Neurobiology of Disease ; volume 181, page 106117 ; ISSN 0969-9961

الاتاحة: http://dx.doi.org/10.1016/j.nbd.2023.106117
https://api.elsevier.com/content/article/PII:S0969996123001316?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0969996123001316?httpAccept=text/plain

المؤلفون: Liu, Tianyu, Liu, Xingwei, Cao, Jin, Feng, Xinya, Li, Shukui, Liu, Jinxu

المصدر: Materials & Design ; volume 231, page 112010 ; ISSN 0264-1275

الاتاحة: http://dx.doi.org/10.1016/j.matdes.2023.112010
https://api.elsevier.com/content/article/PII:S0264127523004252?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0264127523004252?httpAccept=text/plain

المؤلفون: Wang, Kaihua, Liu, Xingwei, Liu, Tianyu, He, Chuan, Liu, Jinxu

المصدر: Journal of Materials Research and Technology ; volume 25, page 1684-1695 ; ISSN 2238-7854

الاتاحة: http://dx.doi.org/10.1016/j.jmrt.2023.06.054
https://api.elsevier.com/content/article/PII:S2238785423013029?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S2238785423013029?httpAccept=text/plain

المؤلفون: Niu, Gang, Li, Leilei, Chen, Haoxiu, Gu, Chen, Liu, Jinxu, Gong, Na, Wu, Huibin

المساهمون: National Natural Science Foundation of China, China Postdoctoral Science Foundation

المصدر: Journal of Materials Research and Technology ; volume 25, page 4528-4542 ; ISSN 2238-7854

الاتاحة: http://dx.doi.org/10.1016/j.jmrt.2023.06.235
https://api.elsevier.com/content/article/PII:S2238785423014837?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S2238785423014837?httpAccept=text/plain

المؤلفون: Fang, Zhen, Zhang, Jihua, Li, Shuqi, Liu, Jinxu, Gao, Libin, Chen, Hongwei, Cai, Xingzhou, Zhang, Wanli

المصدر: Components, Packaging, and Manufacturing Technology, IEEE Transactions on; December 2024, Vol. 14 Issue: 12 p2300-2308, 9p

المؤلفون: Liu, Jinxu, Zhang, Jihua, Fang, Zhen, Fu, Juefeng, Jili, Xiaobing, Zhang, Baichuan, Li, Jia, Li, Shuang, Liu, Ting, Wang, Dongbin, Gao, Libin, Chen, Hongwei

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) ; page 1-6

الاتاحة: http://dx.doi.org/10.1109/icept63120.2024.10668434
http://xplorestaging.ieee.org/ielx8/10666972/10667660/10668434.pdf?arnumber=10668434

المؤلفون: Fang, Zhen, Shi, Hongbin, Zhang, Jihua, Liu, Jinxu, Wang, Dongbin, Chen, Hongwei

المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) ; page 1-6

الاتاحة: http://dx.doi.org/10.1109/icept63120.2024.10668406
http://xplorestaging.ieee.org/ielx8/10666972/10667660/10668406.pdf?arnumber=10668406

المؤلفون: Zheng, Longyue, Deng, Liangyao, Liu, Jinxu, Ma, Yitao, Cheng, Yongpeng

المصدر: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)

الاتاحة: http://dx.doi.org/10.1109/cstic61820.2024.10531848
http://xplorestaging.ieee.org/ielx7/10531806/10531771/10531848.pdf?arnumber=10531848

المؤلفون: Fan, Bojian, Liu, Xingwei, Si, Shengping, Liu, Shuang, Xie, Ruyue, Liu, Jinxu

المصدر: Journal of Physics: Conference Series ; volume 2355, issue 1, page 012078 ; ISSN 1742-6588 1742-6596

الاتاحة: http://dx.doi.org/10.1088/1742-6596/2355/1/012078
https://iopscience.iop.org/article/10.1088/1742-6596/2355/1/012078
https://iopscience.iop.org/article/10.1088/1742-6596/2355/1/012078/pdf

المؤلفون: Lan, Jia, Liu, Jinxu, Zhang, Song, Xue, Xinying, He, Chuan, Wu, Zhouyang, Yang, Min, Li, Shukui

المصدر: Materials & Design ; volume 224, page 111271 ; ISSN 0264-1275

الاتاحة: https://doi.org/10.1016/j.matdes.2022.111271
https://api.elsevier.com/content/article/PII:S0264127522008930?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0264127522008930?httpAccept=text/plain