نتائج البحث - "Liao, Yi-Lun"

المساهمون: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology. Research Laboratory of Electronics

المصدر: arXiv

وصف الملف: application/pdf

Relation: 2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR); https://hdl.handle.net/1721.1/143902; Yang, Tien-Ju, Liao, Yi-Lun and Sze, Vivienne. 2021. "NetAdaptV2: Efficient Neural Architecture Search with Fast Super-Network Training and Architecture Optimization." 2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR).

الاتاحة: https://hdl.handle.net/1721.1/143902

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12

Academic Journal

Failure Prediction of an Airfoil-Type Crack in Thermoelectric Coupling Materials.

المؤلفون: Chao, Ching-Kong, Liao, Yi-Lun, Ma, Chien-Ching, Shen, Ming-Ho

المصدر: International Journal of Applied Mechanics; Nov2024, Vol. 16 Issue 9, p1-32, 32p

مصطلحات موضوعية: STRAINS & stresses (Mechanics), POISSON'S ratio, STRUCTURAL failures, THERMAL stress cracking, MECHANICAL loads, THERMAL conductivity, THERMOELECTRIC materials, TRIANGLES

13

Academic Journal

Imbalances in the disposition of estrogen and naphthalene in breast cancer patients: a potential biomarker of breast cancer risk

المؤلفون: Chen, Dar-Ren, Hsieh, Wei-Chung, Liao, Yi-Lun, Lin, Kuo-Juei, Wang, Yu-Fen, Lin, Po-Hsiung

المساهمون: Changhua Christian Hospital, Ministry of Science and Technology, Taiwan

المصدر: Scientific Reports ; volume 10, issue 1 ; ISSN 2045-2322

الاتاحة: http://dx.doi.org/10.1038/s41598-020-68814-5
https://www.nature.com/articles/s41598-020-68814-5.pdf
https://www.nature.com/articles/s41598-020-68814-5

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14

Academic Journal

Thermal stresses for a coated irregularly shaped hole embedded in an infinite substrate subject to a remote uniform heat flow

المؤلفون: Liao, Yi-Lun, Tseng, Shao-Chen, Chao, Ching-Kong

المصدر: Archive of Applied Mechanics ; volume 93, issue 6, page 2511-2531 ; ISSN 0939-1533 1432-0681

الاتاحة: http://dx.doi.org/10.1007/s00419-023-02393-5
https://link.springer.com/content/pdf/10.1007/s00419-023-02393-5.pdf
https://link.springer.com/article/10.1007/s00419-023-02393-5/fulltext.html

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15

Academic Journal

Ameliorative effect of buckwheat polysaccharides on colitis via regulation of the gut microbiota

المؤلفون: Yang, Jhih-Yi, Chen, Sheng-Yi, Wu, Yen-Hsien, Liao, Yi-Lun, Yen, Gow-Chin

المساهمون: Council of Agriculture

المصدر: International Journal of Biological Macromolecules ; volume 227, page 872-883 ; ISSN 0141-8130

الاتاحة: http://dx.doi.org/10.1016/j.ijbiomac.2022.12.155
https://api.elsevier.com/content/article/PII:S014181302203063X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S014181302203063X?httpAccept=text/plain

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16

Electronic Resource

NetAdaptV2: Efficient Neural Architecture Search with Fast Super-Network Training and Architecture Optimization

المؤلفون: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology. Research Laboratory of Electronics, Yang, Tien-Ju, Liao, Yi-Lun, Sze, Vivienne

المصدر: arXiv

مصطلحات الفهرس: Article, http://purl.org/eprint/type/ConferencePaper

URL: https://hdl.handle.net/1721.1/143902
10.1109/CVPR46437.2021.00243
2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

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17

Academic Journal

Interfacial Stresses for a Coated Irregularly Shaped Hole Embedded in an Infinite Solid under Point Heat Singularity.

المؤلفون: Liao, Yi-Lun¹ (AUTHOR), Tseng, Shao-Chen¹ (AUTHOR), Chao, Ching-Kong¹ (AUTHOR) ckchao@mail.ntust.edu.tw

المصدر: Mathematics (2227-7390). Feb2023, Vol. 11 Issue 4, p802. 20p.

مصطلحات موضوعية: *INTERFACIAL stresses, *THERMAL conductivity, *CONFORMAL mapping, *HEAT radiation & absorption, *HEAT capacity, *ANALYTICAL solutions, *HEAT sinks, *EUTECTICS, *ELECTRIC capacity

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18

Academic Journal

Molecular Action Mechanism of Coixol from Soft-Shelled Adlay on Tyrosinase: The Future of Cosmetics.

المؤلفون: Lin, Li-Yun¹ (AUTHOR) lylin@hk.edu.tw, Liao, Yi-Lun² (AUTHOR) liaoyl@tss.gov.tw, Chen, Min-Hung³ (AUTHOR) cmh@mail.afa.gov.tw, Chang, Shih-Feng¹ (AUTHOR) sfchang@hk.edu.tw, Chen, Kuan-Chou^4,5 (AUTHOR) kuanchou@s.tmu.edu.tw, Peng, Robert Y.^4,6 (AUTHOR)