المؤلفون: Li-Mei Wang, Qi-Hua Yang, Lei Zhang, Sheng-Yun Liu, Pan-Pan Zhang, Xin Zhang, Xiao-Jun Liu, Li-Shuai Han, Tian-Fang Li

المصدر: Rheumatology. 61:3704-3710

مصطلحات موضوعية: Rheumatology, Ferritins, Humans, Immunoglobulins, Intravenous, Pharmacology (medical), Lung Diseases, Interstitial, Prognosis, Dermatomyositis, Autoantibodies, Retrospective Studies

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0995ff86dd32b0ad38ec1f6fd31f3435
https://doi.org/10.1093/rheumatology/keab928

المؤلفون: Li-Mei Wang, Qi-Hua Yang, Lei Zhang, Sheng-Yun Liu, Pan-Pan Zhang, Xin Zhang, Xiao-Jun Liu, Li-Shuai Han, Tian-Fang Li

المصدر: Rheumatology. 61:e284-e285

مصطلحات موضوعية: Rheumatology, Pharmacology (medical)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::282e116f4ef87992003fce2ac137e581
https://doi.org/10.1093/rheumatology/keac122

المؤلفون: Lei, Zhang, Tian-Ge, Wu, Yu-Jie, He, Jin-Yan, Guo, Li-Shuai, Han, Jia-Meng, Lu, Sheng-Yun, Liu, Tian-Fang, Li

المصدر: Clinical rheumatology. 39(7)

مصطلحات موضوعية: Adult, Male, Survival Rate, China, Humans, Female, Polychondritis, Relapsing, Diagnostic Errors, Middle Aged, Retrospective Studies

URL الوصول: https://explore.openaire.eu/search/publication?articleId=pmid________::0bdf4743f440eb89bdc328f81bbc0ab0
https://pubmed.ncbi.nlm.nih.gov/32036586

المؤلفون: Tian-ming Li, Ying Liang, Chunyue Huang, Li-shuai Han, Lu Liangkun, Rui Yin, Gen-xin Huang

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

مصطلحات موضوعية: Materials science, Transmission (telecommunications), HFSS, Acoustics, Load modeling, Path (graph theory), Return loss, Electronic engineering, Inner diameter, Signal integrity, Electromagnetic simulation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::095116ed53542cfab0460dc1201d9fb6
https://doi.org/10.1109/icept.2017.8046508

المؤلفون: Liang Ying, Tian-ming Li, Gen-xin Huang, Rui Yin, Li-shuai Han, Chunyue Huang

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

مصطلحات موضوعية: 010302 applied physics, Materials science, Scale (ratio), business.industry, Stress–strain curve, 02 engineering and technology, Structural engineering, 021001 nanoscience & nanotechnology, 01 natural sciences, Finite element method, Stress (mechanics), Chip-scale package, Soldering, 0103 physical sciences, Random vibration, 0210 nano-technology, business, Joint (geology)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8639488c4035cd7d2569d96625184303
https://doi.org/10.1109/icept.2017.8046533