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1Academic Journal
المؤلفون: Yelin Ni, Tucker T. Bisel, Md Kamrul Hasan, Donghui Li, Witold K. Fuchs, Scott K. Cooley, Larry Nichols, Matt Pharr, Nathalie Dupuy, Sylvain R. A. Marque, Mark K. Murphy, Suresh D. Pillai, Samuel Dorey, Leonard S. Fifield
المصدر: npj Materials Degradation, Vol 7, Iss 1, Pp 1-9 (2023)
مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2397-2106
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2Academic Journal
المؤلفون: Yelin Ni, Tucker T. Bisel, Md Kamrul Hasan, Donghui Li, Witold K. Fuchs, Scott K. Cooley, Larry Nichols, Matt Pharr, Nathalie Dupuy, Sylvain R. A. Marque, Mark K. Murphy, Suresh D. Pillai, Samuel Dorey, Leonard S. Fifield
المصدر: npj Materials Degradation, Vol 8, Iss 1, Pp 1-1 (2024)
مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2397-2106
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3Academic Journal
المؤلفون: Nina Girard-Perier, Sylvain R. A. Marque, Nathalie Dupuy, Magalie Claeys-Bruno, Fanny Gaston, Samuel Dorey, Leonard S. Fifield, Yelin Ni, Donghui Li, Witold K. Fuchs, Mark K. Murphy, Suresh D. Pillai, Matt Pharr, Larry Nichols
المصدر: Frontiers in Chemistry, Vol 10 (2022)
مصطلحات موضوعية: methionine oxidation, electron spin resonance, liquid chromatography, differential scanning calorimetry, gamma, x-ray, Chemistry, QD1-999
وصف الملف: electronic resource
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4Academic Journal
المؤلفون: Vishal Kumar, Wenbin Kuang, Leonard S. Fifield
المصدر: Materials, Vol 17, Iss 13, p 3265 (2024)
مصطلحات موضوعية: processable thermoset, circular material, dynamic covalent bonds, recyclable polymer, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
Relation: https://www.mdpi.com/1996-1944/17/13/3265; https://doaj.org/toc/1996-1944; https://doaj.org/article/58a4b0a14c2e4626b39c977af7309183
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5
المؤلفون: Ahmed S. Arman, Samuel W. Glass, Leonard S. Fifield, Mohammod Ali
المصدر: IEEE Sensors Letters. 6:1-4
مصطلحات موضوعية: Electrical and Electronic Engineering, Instrumentation
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6
المؤلفون: Ahmed S. Arman, Samuel W. Glass, Leonard S. Fifield, Mohammod Ali
المصدر: IEEE Sensors Journal. 22:11065-11074
مصطلحات موضوعية: Electrical and Electronic Engineering, Instrumentation
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7
المؤلفون: Donghui Li, Aishwarya Sriraman, Yelin Ni, Ikumi Ellis, Mychal P. Spencer, Andy Zwoster, Leonard S. Fifield
المصدر: 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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8
المؤلفون: Aishwarya Sriraman, Leonard S. Fifield, S. W. Glass, Mychal Spencer, Matthew S. Prowant, Anthony Guzman
المصدر: 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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9
المؤلفون: Yelin Ni, Aishwarya Sriraman, Donghui Li, Ikumi Ellis, Leonard S Fifield
المصدر: 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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10
المؤلفون: Mychal P. Spencer, Aishwarya Sriraman, Bill Glass, Leonard S. Fifield
المصدر: 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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11Effect of Semiconducting Layer on Cable Insulation Damage Detection Using Surface Wave Reflectometry
المؤلفون: Ahmed S. Arman, Samuel W. Glass, Leonard S. Fifield, Mohammod Ali
المصدر: 2022 IEEE Electrical Insulation Conference (EIC).
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12
المؤلفون: Mohammod Ali, Md. Nazmul Al Imran, Leonard S. Fifield, Samuel W. Glass
المصدر: IEEE Sensors Journal. 21:812-820
مصطلحات موضوعية: Permittivity, Materials science, 010401 analytical chemistry, 01 natural sciences, Accelerated aging, Capacitance, 0104 chemical sciences, Conductor, Printed circuit board, Backplane, Electrode, Electrical and Electronic Engineering, Composite material, Instrumentation, Electrical conductor
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13
المؤلفون: Yelin Ni, Tucker T Bisel, Mychal P Spencer, Witold K Fuchs, Madhusudhan Reddy Pallaka, Leonard S Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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14
المؤلفون: Donghui Li, Mychal P. Spencer, Yelin Ni, Madhusudhan Reddy Pallaka, Andy Zwoster, Leonard S. Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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15
المؤلفون: Witold K. Fuchs, Mychal P. Spencer, Donghui Li, Yelin Ni, Andy Zwoster, Leonard S. Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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16
المؤلفون: Mychal P. Spencer, Leonard S. Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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17
المؤلفون: Ahmed S. Arman, Mohammod Ali, S. W. Glass, Leonard S. Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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18
المؤلفون: Madhusudhan R. Pallaka, Witold K. Fuchs, Mychal P. Spencer, Ana L. Arteaga, Andy Zwoster, Leonard S. Fifield
المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
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19
المؤلفون: Nina Girard-Perier, Sylvain R. A. Marque, Nathalie Dupuy, Magalie Claeys-Bruno, Fanny Gaston, Samuel Dorey, Leonard S. Fifield, Yelin Ni, Donghui Li, Witold K. Fuchs, Mark K. Murphy, Suresh D. Pillai, Matt Pharr, Larry Nichols
مصطلحات موضوعية: Biochemistry, Environmental Chemistry, Geochemistry, Organic Chemistry, Inorganic Chemistry, Nuclear Chemistry, Medical Biochemistry: Proteins and Peptides (incl. Medical Proteomics), Medical Biochemistry and Metabolomics not elsewhere classified, Food Chemistry and Molecular Gastronomy (excl. Wine), Analytical Biochemistry, Cell Neurochemistry, Enzymes, Electroanalytical Chemistry, Analytical Chemistry not elsewhere classified, Organic Green Chemistry, Physical Organic Chemistry, Catalysis and Mechanisms of Reactions, Environmental Chemistry (incl. Atmospheric Chemistry), methionine oxidation, electron spin resonance, liquid chromatography, differential scanning calorimetry, gamma, x-ray, e-beam irradiation
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20
المؤلفون: Leonard S. Fifield, Samuel W. Glass, Matthew S. Prowant, Aishwarya Sriraman, Mychal P. Spencer
مصطلحات موضوعية: Materials science, business.industry, Frequency domain, Nondestructive testing, Acoustics, Moisture exposure, business, Reflectometry