المؤلفون: Shu, Ji, Sun, Jiahui, Tao, Mian, Du, Yangming, Lee, Shi-Wei Ricky, Chen, Kevin J.

المصدر: IEEE Transactions on Power Electronics ; page 1-9 ; ISSN 0885-8993 1941-0107

الاتاحة: https://doi.org/10.1109/tpel.2025.3530510
http://xplorestaging.ieee.org/ielx8/63/4359240/10843868.pdf?arnumber=10843868

المؤلفون: Tao, Mian, Lo, Chi-Chuen Jeffery, Tsui, Chi-Ying, Lee, Shi-Wei Ricky

المساهمون: Innovation and Technology Fund

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; page 1-1 ; ISSN 2156-3950 2156-3985

الاتاحة: https://doi.org/10.1109/tcpmt.2025.3531795
http://xplorestaging.ieee.org/ielx8/5503870/5673025/10847717.pdf?arnumber=10847717

المؤلفون: Qiu, Xing, Yu, Qianhang, Cheng, Yuanjie, Lo, Jeffery C. C., Lee, Shi-wei Ricky

المصدر: Polymers (20734360); Jan2025, Vol. 17 Issue 2, p250, 10p

مصطلحات موضوعية: DETERIORATION of materials, LIGHT emitting diodes, REACTIVE oxygen species, PHOTODYNAMIC therapy, POLYDIMETHYLSILOXANE

المؤلفون: Shu, Ji, Sun, Jiahui, Tao, Mian, Du, Yangming, Chen, Tao, Lee, Shi-Wei Ricky, Chen, Kevin J.

المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

الاتاحة: http://dx.doi.org/10.1109/ispsd59661.2024.10579564
http://xplorestaging.ieee.org/ielx8/10579539/10579462/10579564.pdf?arnumber=10579564

المؤلفون: Lee, Shi‐Wei Ricky, Lo, Jeffery C. C., Tao, Mian, Ye, Huaiyu

المصدر: ISBN 9781118881477 9781118881620.

الاتاحة: http://dx.doi.org/10.1002/9781118881620
https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781118881620

المؤلفون: Dai, Ruo Li, Liao, Wei-Hsin, Lin, Chun-Te, Chiang, Kuo-Ning, Lee, Shi-Wei Ricky

المصدر: Nano-Bio- Electronic, Photonic and MEMS Packaging ; page 555-577 ; ISBN 9783030499907 9783030499914

الاتاحة: http://dx.doi.org/10.1007/978-3-030-49991-4_25
http://link.springer.com/content/pdf/10.1007/978-3-030-49991-4_25

المؤلفون: Le, Fuliang, Lee, Shi-Wei Ricky, Tao, Mian, Lo, Jeffery C. C.

المصدر: 2018 20th International Conference on Electronic Materials and Packaging (EMAP) ; page 1-5

الاتاحة: http://dx.doi.org/10.1109/emap.2018.8660884
http://xplorestaging.ieee.org/ielx7/8653641/8660771/08660884.pdf?arnumber=8660884

المؤلفون: Lee, Shi-Wei Ricky, Li, Hing Leung

المصدر: Journal of Intelligent Material Systems and Structures ; volume 10, issue 7, page 530-533 ; ISSN 1045-389X 1530-8138

الاتاحة: https://doi.org/10.1106/f39u-mvcc-nxqb-hixm
https://journals.sagepub.com/doi/pdf/10.1106/F39U-MVCC-NXQB-HIXM

المؤلفون: Zhang, Xiaodong, Lee, Shi-Wei Ricky, Le, Fuliang

المصدر: Materials for Advanced Packaging ; page 923-951 ; ISBN 9783319450971 9783319450988

الاتاحة: http://dx.doi.org/10.1007/978-3-319-45098-8_22
http://link.springer.com/content/pdf/10.1007/978-3-319-45098-8_22

المؤلفون: Xu, Qianwen, Lo, Jeffery Chi Chuen, Lee, Shi-Wei Ricky

المصدر: Applied Sciences (2076-3417); May2020, Vol. 10 Issue 10, p3384, 13p

مصطلحات موضوعية: THREE-dimensional printing, RAPID prototyping, MICROFLUIDIC devices, LIGHT sources, KINEMATICS, METHACRYLATES, GELATION

المؤلفون: Le, Fuliang, Lee, Shi-Wei Ricky, Zhang, Qiming

المساهمون: National Natural Science Foundation of China

المصدر: Journal of Micromechanics and Microengineering ; volume 27, issue 4, page 045012 ; ISSN 0960-1317 1361-6439

الاتاحة: http://dx.doi.org/10.1088/1361-6439/aa5dfc
http://iopscience.iop.org/article/10.1088/1361-6439/aa5dfc
http://stacks.iop.org/0960-1317/27/i=4/a=045012/pdf
http://stacks.iop.org/0960-1317/27/i=4/a=045012?key=crossref.0f9e1ba5e4d4b42a639fb9483866fd0e
http://iopscience.iop.org/article/10.1088/1361-6439/aa5dfc/pdf

المؤلفون: Tao, Mian MAE, Feng, Zicheng, Swanson, John, Ganjei, John, Lo, Chi Chuen, Lee, Shi Wei Ricky

Relation: http://repository.ust.hk/ir/Record/1783.1-76249; China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131; https://doi.org/10.1109/SSLCHINA.2013.7177331; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=128&rft.aulast=Tao&rft.aufirst=M.&rft.atitle=Thermal%20characterization%20of%20a%20printed%20circuit%20board%20with%20thermal%20vias%20for%20the%20application%20of%20high%20brightness%20light-emitting%20diodes&rft.title=2013%2010th%20China%20International%20Forum%20on%20Solid%20State%20Lighting,%20ChinaSSL%202013; http://www.scopus.com/record/display.url?eid=2-s2.0-84957868608&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300033

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-76249
https://doi.org/10.1109/SSLCHINA.2013.7177331
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=128&rft.aulast=Tao&rft.aufirst=M.&rft.atitle=Thermal%20characterization%20of%20a%20printed%20circuit%20board%20with%20thermal%20vias%20for%20the%20application%20of%20high%20brightness%20light-emitting%20diodes&rft.title=2013%2010th%20China%20International%20Forum%20on%20Solid%20State%20Lighting,%20ChinaSSL%202013
http://www.scopus.com/record/display.url?eid=2-s2.0-84957868608&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300033

المؤلفون: Liu, Huihua MAE, Lo, Chi Chuen, Lee, Shi-Wei Ricky, Zhao, Huishan

Relation: http://repository.ust.hk/ir/Record/1783.1-66629; 13th International Conference on Electronics Packaging (ICEP2013), Osaka, Japan, 10-12 April 2013; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=&rft.aulast=Liu&rft.aufirst=&rft.atitle=LED%20Wafer%20Level%20Packaging%20with%20a%20Heimisphrical%20Waffle%20Pack%20Remote%20Phosphor%20Layer&rft.title=13th%20International%20Conference%20on%20Electronics%20Packaging%20(ICEP2013),%20Osaka,%20Japan,%2010-12%20April%202013

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-66629
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=&rft.aulast=Liu&rft.aufirst=&rft.atitle=LED%20Wafer%20Level%20Packaging%20with%20a%20Heimisphrical%20Waffle%20Pack%20Remote%20Phosphor%20Layer&rft.title=13th%20International%20Conference%20on%20Electronics%20Packaging%20(ICEP2013),%20Osaka,%20Japan,%2010-12%20April%202013

المؤلفون: Lee, Shi Wei Ricky MAE, Guo, Xungao, Niu, Daoyuan, Lo, Chi Chuen

Relation: http://repository.ust.hk/ir/Record/1783.1-61112; 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567; https://doi.org/10.1109/ECTC.2013.6575629; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=&rft.issue=&rft.date=2013&rft.spage=563&rft.aulast=Lee&rft.aufirst=&rft.atitle=Quasi-conformal%20Phosphor%20Dispensing%20on%20LED%20for%20White%20Light%20Illumination&rft.title=2013%20IEEE%2063rd%20Electronic%20Components%20and%20Technology%20Conference%20(ECTC%202013); http://www.scopus.com/record/display.url?eid=2-s2.0-84883431140&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000332764900087

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-61112
https://doi.org/10.1109/ECTC.2013.6575629
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=&rft.issue=&rft.date=2013&rft.spage=563&rft.aulast=Lee&rft.aufirst=&rft.atitle=Quasi-conformal%20Phosphor%20Dispensing%20on%20LED%20for%20White%20Light%20Illumination&rft.title=2013%20IEEE%2063rd%20Electronic%20Components%20and%20Technology%20Conference%20(ECTC%202013)
http://www.scopus.com/record/display.url?eid=2-s2.0-84883431140&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000332764900087

المؤلفون: Lo, Chi Chuen MAE, Liu, Huihua, Lee, Shi Wei Ricky, Gu, Xungao, Zhao, Huishan

Relation: http://repository.ust.hk/ir/Record/1783.1-58383; 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013; https://doi.org/10.1109/EuroSimE.2013.6529893; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=&rft.aulast=Lo&rft.aufirst=&rft.atitle=Remote%20Phosphor%20Deposition%20on%20LED%20Arrays%20with%20Pre-encapsulated%20Silicone%20Lens&rft.title=2013%2014th%20International%20Conference%20on%20Thermal,%20Mechanical%20and%20Multi-Physics%20Simulation%20and%20Experiments%20in%20Microelectronics%20and%20Microsystems%20(EuroSimE%202013); http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000326869600005; http://www.scopus.com/record/display.url?eid=2-s2.0-84880987327&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-58383
https://doi.org/10.1109/EuroSimE.2013.6529893
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=&rft.aulast=Lo&rft.aufirst=&rft.atitle=Remote%20Phosphor%20Deposition%20on%20LED%20Arrays%20with%20Pre-encapsulated%20Silicone%20Lens&rft.title=2013%2014th%20International%20Conference%20on%20Thermal,%20Mechanical%20and%20Multi-Physics%20Simulation%20and%20Experiments%20in%20Microelectronics%20and%20Microsystems%20(EuroSimE%202013)
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000326869600005
http://www.scopus.com/record/display.url?eid=2-s2.0-84880987327&origin=inward

المؤلفون: Zou, Sam H.Y., Tao, Mian, Lo, Chi Chuen, Lee, Shi-Wei Ricky

مصطلحات موضوعية: LED packaging, Silicone encapsulant, Adhesion strength, Reliability

Relation: http://repository.ust.hk/ir/Record/1783.1-61152; Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216; https://doi.org/10.1109/ICEPT.2013.6756676; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1212&rft.aulast=Zou&rft.aufirst=S.H.Y.&rft.atitle=Experimental+characterization+of+adhesion+strength+between+the+silicone+encapsulant+and+the+bottom+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100269; http://www.scopus.com/record/display.url?eid=2-s2.0-84898048687&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-61152
https://doi.org/10.1109/ICEPT.2013.6756676
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1212&rft.aulast=Zou&rft.aufirst=S.H.Y.&rft.atitle=Experimental+characterization+of+adhesion+strength+between+the+silicone+encapsulant+and+the+bottom+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100269
http://www.scopus.com/record/display.url?eid=2-s2.0-84898048687&origin=inward

المؤلفون: Zhong, Steven D.L., Zou, Sam H.Y., Lo, Chi Chuen, Lee, Shi-Wei Ricky

مصطلحات موضوعية: Silicone, Delamination, SMD LED, Adhesion strength, Finite element, Stress analysis

Relation: http://repository.ust.hk/ir/Record/1783.1-61139; Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616; https://doi.org/10.1109/ICEPT.2013.6756544; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=612&rft.aulast=Zhong&rft.aufirst=S.D.L.&rft.atitle=Measurement+and+analysis+of+interfacial+adhesion+strength+between+the+silicone+encapsulant+and+the+side+wall+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100137; http://www.scopus.com/record/display.url?eid=2-s2.0-84898045272&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-61139
https://doi.org/10.1109/ICEPT.2013.6756544
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=612&rft.aulast=Zhong&rft.aufirst=S.D.L.&rft.atitle=Measurement+and+analysis+of+interfacial+adhesion+strength+between+the+silicone+encapsulant+and+the+side+wall+of+a+SMD+LED+leadframe+cup&rft.title=Proceedings+-+2013+14th+International+Conference+on+Electronic+Packaging+Technology,+ICEPT+2013
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000349907100137
http://www.scopus.com/record/display.url?eid=2-s2.0-84898045272&origin=inward

المؤلفون: Liu, Huihua, Lo, Jeffery C.C., Lee, Shi Wei Ricky

Relation: http://repository.ust.hk/ir/Record/1783.1-76246; 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146; https://doi.org/10.1109/SSLCHINA.2013.7177334; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=142&rft.aulast=Liu&rft.aufirst=H.&rft.atitle=Optical+characterization+of+a+light+bulb+with+the+waffle+pack+LED+WLP+module&rft.title=2013+10th+China+International+Forum+on+Solid+State+Lighting,+ChinaSSL+2013; http://www.scopus.com/record/display.url?eid=2-s2.0-84957893285&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300036

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-76246
https://doi.org/10.1109/SSLCHINA.2013.7177334
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=142&rft.aulast=Liu&rft.aufirst=H.&rft.atitle=Optical+characterization+of+a+light+bulb+with+the+waffle+pack+LED+WLP+module&rft.title=2013+10th+China+International+Forum+on+Solid+State+Lighting,+ChinaSSL+2013
http://www.scopus.com/record/display.url?eid=2-s2.0-84957893285&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300036

المؤلفون: Zhang, Qiming, Yang, Chaoran, Tao, Mian, Song, Fubin, Lee, Shi Wei Ricky

مصطلحات موضوعية: Ball Pull Test, Cold Pin Pull Test, Pad Crater, Reflow, Test Speed, Thermal Aging

Relation: http://repository.ust.hk/ir/Record/1783.1-61013; Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793; https://doi.org/10.1109/ECTC.2013.6575818; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1788&rft.aulast=Zhang&rft.aufirst=Qiming&rft.atitle=Assessment+of+solder+pad+cratering+strength+using+cold+pin+pull+test+method+with+pre-fabricated+pin+arrays&rft.title=Proceedings+-+Electronic+Components+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-84883423994&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000332764900276

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-61013
https://doi.org/10.1109/ECTC.2013.6575818
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=&rft.issue=&rft.date=2013&rft.spage=1788&rft.aulast=Zhang&rft.aufirst=Qiming&rft.atitle=Assessment+of+solder+pad+cratering+strength+using+cold+pin+pull+test+method+with+pre-fabricated+pin+arrays&rft.title=Proceedings+-+Electronic+Components+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-84883423994&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000332764900276