المؤلفون: Nigro, Nicholas J., Zellmer, Benjamin P., Shangguan, Dongkai, Lee, Ping S.

المصدر: International Journal for Numerical Methods in Fluids ; volume 33, issue 6, page 833-846 ; ISSN 0271-2091 1097-0363

الاتاحة: http://dx.doi.org/10.1002/1097-0363(20000730)33:6%3C833::aid-fld33%3E3.0.co%3B2-1
https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2F1097-0363(20000730)33:6%3C833::AID-FLD33%3E3.0.CO%3B2-1
https://onlinelibrary.wiley.com/doi/full/10.1002/1097-0363(20000730)33:6%3C833::AID-FLD33%3E3.0.CO%3B2-1

المؤلفون: Heinrich, Stephen M., Shakya, Shilak, Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Thermal expansion, Elasticity, Temperature, Solders, Dimensions, Relaxation (Physics), Stress, Corners (Structural elements), Finite element analysis, Boundary-value problems, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/89; http://dx.doi.org/10.1115/1.2792279

الاتاحة: https://epublications.marquette.edu/civengin_fac/89
https://doi.org/10.1115/1.2792279

المؤلفون: Heinrich, Stephen M., Shakya, Shilak, Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Solders, Displacement, Thermal energy, Dimensions, Shearing (Deformation), Solder joints, Stiffness, High temperature, Manufacturing, Thermal expansion, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/88; http://dx.doi.org/10.1115/1.2792278

الاتاحة: https://epublications.marquette.edu/civengin_fac/88
https://doi.org/10.1115/1.2792278

المؤلفون: Heinrich, Stephen M., Shakya, Shilak, Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Displacement, Solder joints, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/90; http://dx.doi.org/10.1115/1.2792240

الاتاحة: https://epublications.marquette.edu/civengin_fac/90
https://doi.org/10.1115/1.2792240

المؤلفون: Elkouh, A. F., Ramasubramanian, N., Hsu, T. F., Nigro, Nicholas J., Heinrich, Stephen M., Lee, Ping S., Shangguan, D.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Solders, Geometry, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/91; http://dx.doi.org/10.1115/1.2792248

الاتاحة: https://epublications.marquette.edu/civengin_fac/91
https://doi.org/10.1115/1.2792248

المؤلفون: Heinrich, Stephen M., Shakya, Shilak, Wang, Yanhua, Lee, Ping S., Schroeder, Scott A.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/85; http://dx.doi.org/10.1109/96.496034

الاتاحة: https://epublications.marquette.edu/civengin_fac/85
https://doi.org/10.1109/96.496034

المؤلفون: Nigro, Nicholas J., Zhou, F. J., Heinrich, Stephen M., Elkouh, A. F., Fournelle, Raymond, Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Finite element methods, Shapes, Solder joints, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/86; http://dx.doi.org/10.1115/1.2792144

الاتاحة: https://epublications.marquette.edu/civengin_fac/86
https://doi.org/10.1115/1.2792144

المؤلفون: Heinrich, Stephen M., Schaefer, M., Schroeder, Scott A., Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Solder joints, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/93; http://dx.doi.org/10.1115/1.2792140

الاتاحة: https://epublications.marquette.edu/civengin_fac/93
https://doi.org/10.1115/1.2792140

المؤلفون: Schaefer, Mathew, Laub, Werner, Sabee, Janet M., Fournelle, Raymond A., Lee, Ping S.

المصدر: Journal of Electronic Materials ; volume 25, issue 6, page 992-1003 ; ISSN 0361-5235 1543-186X

الاتاحة: http://dx.doi.org/10.1007/bf02666735
http://link.springer.com/content/pdf/10.1007/BF02666735.pdf
http://link.springer.com/article/10.1007/BF02666735/fulltext.html
http://link.springer.com/content/pdf/10.1007/BF02666735

المؤلفون: Nigro, Nicholas J., Elkouh, A. F., Zou, X., Fournelle, Raymond, Heinrich, Stephen M., Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Equilibrium (Physics), Finite element methods, Shapes, Solder joints, Finite element analysis, Potential energy, Stress, Theorems (Mathematics), Functions, Interpolation, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/94; http://dx.doi.org/10.1115/1.2909309

الاتاحة: https://epublications.marquette.edu/civengin_fac/94
https://doi.org/10.1115/1.2909309

المؤلفون: Heinrich, Stephen M., Elkouh, A. F., Nigro, Nicholas J., Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Solder joints, Surface mount technology, Solders, Dimensions, Shapes, Density, Surface tension, Surface mount packaging, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/98; http://dx.doi.org/10.1115/1.2904369

الاتاحة: https://epublications.marquette.edu/civengin_fac/98
https://doi.org/10.1115/1.2904369

المؤلفون: Heinrich, Stephen M., Nigro, Nicholas J., Elkouh, A. F., Lee, Ping S.

المصدر: Civil and Environmental Engineering Faculty Research and Publications

مصطلحات موضوعية: Design, Solder joints, Surface mount technology, Surface tension, Solders, Dimensions, Surface mount packaging, Density, Civil and Environmental Engineering

Relation: https://epublications.marquette.edu/civengin_fac/97; http://dx.doi.org/10.1115/1.2904370

الاتاحة: https://epublications.marquette.edu/civengin_fac/97
https://doi.org/10.1115/1.2904370

المؤلفون: Nigro, N. J., Heinrich, S. M., Elkouh, A. F., Zou, X., Fournelle, R., Lee, Ping S.

المصدر: Journal of Electronic Packaging; June 1993, Vol. 115 Issue: 2 p141-146, 6p

المؤلفون: Heinrich, S. M., Elkouh, A. F., Nigro, N. J., Lee, Ping S.

المصدر: Journal of Electronic Packaging; September 1990, Vol. 112 Issue: 3 p210-218, 9p

المؤلفون: Taylor, Stanley H., Lee, Ping S., Sharma, Susheel K.

المصدر: American Heart Journal ; volume 116, issue 6, page 1820-1825 ; ISSN 0002-8703

الاتاحة: http://dx.doi.org/10.1016/0002-8703(88)90236-0
https://api.elsevier.com/content/article/PII:0002870388902360?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:0002870388902360?httpAccept=text/plain