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1Academic Journal
مصطلحات موضوعية: Sintered nanosilver joint, high lead solder joint, power cycling, thermal impedance and microstructures
Relation: https://nottingham-repository.worktribe.com/output/923275; IEEE Transactions on Device and Materials Reliability; Volume 18; Issue 2; Pagination 256-265; https://nottingham-repository.worktribe.com/file/923275/1/Comparative%20Thermal
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2Conference
المؤلفون: Chang, Lu, Chan, Shu Ning, Lee, Hun Wei Joseph
مصطلحات موضوعية: Computational fluid dynamic model, Drinking water, Equilibrium concentration, Lead contamination, Lead-solder joint
Relation: http://repository.ust.hk/ir/Record/1783.1-110638; 22nd Congress of the International Association for Hydro-Environment Engineering and Research-Asia Pacific Division, IAHR-APD 2020: "Creating Resilience to Water-Related Challenges", Yasuyuki Shimizu. IAHR, 2020, Article no.: 3-5-15; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Chang&rft.aufirst=&rft.atitle=Prediction+of+lead+concentration+at+consumer+tap+of+lead+contaminated+water+supply+system+in+high-rise+buildings&rft.title=22nd+Congress+of+the+International+Association+for+Hydro-Environment+Engineering+and+Research-Asia+Pacific+Division,+IAHR-APD+2020%3A+%22Creating+Resilience+to+Water-Related+Challenges%22; http://www.scopus.com/record/display.url?eid=2-s2.0-85104728304&origin=inward
الاتاحة: http://repository.ust.hk/ir/Record/1783.1-110638
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Chang&rft.aufirst=&rft.atitle=Prediction+of+lead+concentration+at+consumer+tap+of+lead+contaminated+water+supply+system+in+high-rise+buildings&rft.title=22nd+Congress+of+the+International+Association+for+Hydro-Environment+Engineering+and+Research-Asia+Pacific+Division,+IAHR-APD+2020%3A+%22Creating+Resilience+to+Water-Related+Challenges%22
http://www.scopus.com/record/display.url?eid=2-s2.0-85104728304&origin=inward -
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مصطلحات موضوعية: 010302 applied physics, business.product_category, Materials science, Thermal resistance, 020208 electrical & electronic engineering, Delamination, 02 engineering and technology, Substrate (electronics), 01 natural sciences, Temperature measurement, Electronic, Optical and Magnetic Materials, Soldering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Power cycling, Die (manufacturing), Power semiconductor device, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, business, Sintered nanosilver joint, high lead solder joint, power cycling, thermal impedance and microstructures
وصف الملف: application/pdf; PDF
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4Electronic Resource
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5Electronic Resource
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6Electronic Resource