المؤلفون: Ramiro Sebastian Vargas Cruz, Viktor Gonda

المصدر: Metals, Vol 15, Iss 1, p 17 (2024)

مصطلحات موضوعية: advanced electronic packaging, finite element analysis, lead-free soldering materials, creep strain energy density, intermetallic compound, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/15/1/17; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/40dcc5645a474c8d9a438b24e1a56244

المؤلفون: Gharaibeh, Mohammad A., Al-Oqla, Faris M.

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 5, pp. 319-330.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-07-2023-0036

المؤلفون: Jian Pang, Lingxin Kong, Bin Yang, Zhicheng Yang, Hai Wu, Wei Zhao, Jiapeng Zhang, Junjie Xu, Baoqiang Xu

المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 6799-6810 (2023)

مصطلحات موضوعية: In–Sn, Kinetic model, Lead-free soldering material, Rate equation, Vacuum volatilization, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423028703; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/fb5322d935524739bbfef81119c2b465

المؤلفون: Sang, Tian, Gharaibeh, Mohammad A., Wentlent, Luke, Wilcox, James R., Pitarresi, James M.

المصدر: Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 4, pp. 244-254.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-03-2023-0012

المؤلفون: Mareška, Aleš, Kordová, Tereza, Havlík Míka, Martin

المصدر: Periodica Polytechnica Transportation Engineering; Vol. 52 No. 2 (2024); 134-141 ; 1587-3811 ; 0303-7800

مصطلحات موضوعية: lead-free soldering, environment, coating, conductors, tin

وصف الملف: application/pdf

Relation: https://pp.bme.hu/tr/article/view/22876/22239; https://pp.bme.hu/tr/article/view/22876

الاتاحة: https://pp.bme.hu/tr/article/view/22876

المؤلفون: D., Arthur Jebastine Sunderraj, D., Ananthapadmanaban, Kathiresan, Arun Vasantha Geethan

المصدر: Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 2, pp. 115-122.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-03-2022-0018

المؤلفون: Zhidai Zhou, Jiahuan Chen, Chen Yu, Yuxin Wang, Yu Zhang

المصدر: Coatings; Volume 13; Issue 3; Pages: 572

مصطلحات موضوعية: finite element modelling, lead-free soldering, PCB solder joint, failure mechanism

وصف الملف: application/pdf

Relation: https://dx.doi.org/10.3390/coatings13030572

الاتاحة: https://doi.org/10.3390/coatings13030572

المؤلفون: Muhammad Sohail Hameed, Aneela Wakeel, Riffat Asim Pasha, Barkat Ullah, Umair Ali

المصدر: Engineering Proceedings, Vol 45, Iss 1, p 18 (2023)

مصطلحات موضوعية: lead-free soldering material, SAC105, UTM, ultimate tensile strength, indium-lead-tin-copper, Engineering machinery, tools, and implements, TA213-215

Relation: https://www.mdpi.com/2673-4591/45/1/18; https://doaj.org/toc/2673-4591; https://doaj.org/article/8d8c741261834bab82a7b4d385c6dd22

الاتاحة: https://doi.org/10.3390/engproc2023045018
https://doaj.org/article/8d8c741261834bab82a7b4d385c6dd22

المؤلفون: Akbari, Saaed, Lövberg, Andreas, Tegehall, Per-Erik, Brinkfeldt, Klas, Andersson, Dag

المصدر: Microelectronics and reliability. 93:61-71

مصطلحات موضوعية: Anisotropy of tin grains, Finite element modelling, Lead-free soldering, Passive components, PCB cracking, Anisotropy, Ceramic materials, Cracks, Creep, Electronics packaging, Finite element method, Mechanical properties, Microelectronics, Printed circuit boards, Resistors, Soldering, Thermal cycling, Accelerated thermal cycling, Microelectronic components, Printed circuit board (PCBs), Thermal and mechanical properties, Thermal cycling reliability, Lead-free solders

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-37331
https://doi.org/10.1016/j.microrel.2019.01.006
https://ri.diva-portal.org/smash/get/diva2:1281554/FULLTEXT01.pdf

المؤلفون: R. Sayyadi, F. Khodabakhshi, N. Shahamat Javid, G. Khatibi

المصدر: Journal of Materials Research and Technology, Vol 9, Iss 4, Pp 8953-8970 (2020)

مصطلحات موضوعية: Sn–Ag–Cu (SAC) alloy, Graphene nanoplatelets (GNPs), Nanocomposite lead-free soldering, Ni-coating, Physical property, Mechanical behavior, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785420314265; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/5b3f944da9774b098783202d2093364d

المؤلفون: Geczy, Attila, Straubinger, Daniel, Kovacs, Andras, Krammer, Oliver, Mach, Pavel, Harsányi, Gábor

المصدر: Soldering & Surface Mount Technology, 2018, Vol. 30, Issue 2, pp. 74-80.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-10-2017-0032

المؤلفون: Tegehall, Per-Erik, Wetter, Göran

المصدر: Microelectronics and reliability. 55(11):2354-2370

مصطلحات موضوعية: Anisotropy of tin grains, BGA components, Laminate cracking, Lead-free soldering, Solder joint reliability

وصف الملف: electronic

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-13298
https://ri.diva-portal.org/smash/get/diva2:973504/FULLTEXT01.pdf

المؤلفون: Tamás Hurtony, Oliver Krammer, Balázs Illés, Gábor Harsányi, David Bušek, Karel Dušek

المصدر: Materials; Volume 13; Issue 22; Pages: 5251

مصطلحات موضوعية: lead-free soldering, manganese alloying, mechanical testing, hardness testing, structural analysis

وصف الملف: application/pdf

Relation: Corrosion; https://dx.doi.org/10.3390/ma13225251

الاتاحة: https://doi.org/10.3390/ma13225251

المؤلفون: Cosy Muto, Satoshi Kobae, Takashi Fujiki, 小八重 智史, 武藤 浩二, 藤木 卓

المصدر: 電気学会論文誌Ｃ（電子・情報・システム部門誌） / IEEJ Transactions on Electronics, Information and Systems. 2019, 139(5):526

مصطلحات موضوعية: Lead-free soldering, Guidelines

وصف الملف: application/pdf

الاتاحة: http://urn.kb.se/resolve?urn=urn:nbn:se:norden:org:diva-2831

المؤلفون: Novák, Tomáš, Steiner, František

المساهمون: Pihera, Josef, Steiner, František

مصطلحات موضوعية: intermetalické sloučeniny, bezolovnaté pájení, tepelný stres, intermetallic compounds, lead-free soldering, thermal stress

وصف الملف: 5 s.; application/pdf

Relation: Electroscope; Electroscope. 2010, č. 3, EDS 2010.; http://147.228.94.30/images/PDF/Rocnik2010/Cislo3_2010_EDS/r4c3c6.pdf; http://hdl.handle.net/11025/579

الاتاحة: http://hdl.handle.net/11025/579
http://147.228.94.30/images/PDF/Rocnik2010/Cislo3_2010_EDS/r4c3c6.pdf

المؤلفون: Livovský, Ľubomír, Ďurišin, Juraj, Pietriková, Alena

المساهمون: Pihera, Josef, Steiner, František

مصطلحات موضوعية: bezolovnaté pájení, bezolovnaté pájky, kondenzace nasycených par, lead-free soldering, lead free solders, condensation of saturated vapor

وصف الملف: 4 s.; application/pdf

Relation: Electroscope; Electroscope, 2007, č. 2.; http://147.228.94.30/images/PDF/Rocnik2007/spec_cislo_diagnostika07/r0c2c13.pdf; http://hdl.handle.net/11025/444

الاتاحة: http://hdl.handle.net/11025/444
http://147.228.94.30/images/PDF/Rocnik2007/spec_cislo_diagnostika07/r0c2c13.pdf

المؤلفون: Mendes, Luiz Tadeu Freire

Thesis Advisors: Silva, Ana Neilde Rodrigues da

مصطلحات موضوعية: Assembly montage SMD, Electrochemical migration, Electronic soldering, Eletrônica, Eletroquímica, Lead free soldering, SMT, Soldagem elétrica, Solder paste

وصف الملف: application/pdf

الاتاحة: http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/

المؤلفون: Karel Dusek, David Busek, Gábor Harsányi, Tamas Hurtony, Oliver Krammer, Balázs Illés

المصدر: Materials, Vol 13, Iss 5251, p 5251 (2020)
Materials
Volume 13
Issue 22

مصطلحات موضوعية: Materials science, Scanning electron microscope, Shear force, Alloy, Intermetallic, 02 engineering and technology, engineering.material, 01 natural sciences, Indentation hardness, lcsh:Technology, Article, 0103 physical sciences, General Materials Science, structural analysis, Composite material, lcsh:Microscopy, lcsh:QC120-168.85, 010302 applied physics, lcsh:QH201-278.5, lcsh:T, 021001 nanoscience & nanotechnology, lead-free soldering, manganese alloying, hardness testing, mechanical testing, lcsh:TA1-2040, Soldering, Vickers hardness test, engineering, lcsh:Descriptive and experimental mechanics, Tin-silver-copper, lcsh:Electrical engineering. Electronics. Nuclear engineering, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), lcsh:TK1-9971

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::84ae19b63ac086fe51d8ce4d07f75fdd
https://www.mdpi.com/1996-1944/13/22/5251

المؤلفون: Podzemský, Jiří, Urbánek, Jan, Dušek, Karel

المساهمون: Pihera, Josef, Steiner, František

مصطلحات موضوعية: bezolovnaté pájení, povrchové úpravy, cínové whiskery, obrazová analýza, lead-free soldering, surface treatments, tin whiskers, image analysis

وصف الملف: 6 s.; application/pdf

Relation: Electroscope; Electroscope. 2011, č. 1.; http://147.228.94.30/images/PDF/Rocnik2011/Cislo1_2011/r5c1c1.pdf; http://hdl.handle.net/11025/595

الاتاحة: http://hdl.handle.net/11025/595
http://147.228.94.30/images/PDF/Rocnik2011/Cislo1_2011/r5c1c1.pdf