المؤلفون: Vincent Mevellec, Dominique Suhr, Thierry Mourier, C Ribière, Frédéric Gaillard, Laurianne Religieux, Laurent Vandroux, Frédéric Raynal

المصدر: ECS Transactions. 64:9-22

مصطلحات موضوعية: Materials science, chemistry, Interposer, chemistry.chemical_element, Composite material, Layer (electronics), Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28382acd84710ee93d92916938154083
https://doi.org/10.1149/06440.0009ecst

المؤلفون: Paul Blondeau, Jean-Baptiste Chaumont, Mikailou Thiam, Frédéric Raynal, Dominique Suhr, Vincent Mevellec, Laurianne Religieux

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

مصطلحات موضوعية: Interconnection, Materials science, Copper reduction, business.industry, Metallurgy, Copper interconnect, chemistry.chemical_element, Copper, chemistry, Electronic engineering, Copper plating, Optoelectronics, Node (circuits), business, Layer (electronics), Deposition process

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::806d408ae5230c8b4ca2d386f9c21a14
https://doi.org/10.1109/iitc-amc.2016.7507725

المؤلفون: Frédéric Gaillard, Thierry Mourier, Laurent Vandroux, Laurianne Religieux, Dominique Suhr, Frédéric Raynal, Vincent Mevellec

المصدر: ECS Meeting Abstracts. :1690-1690

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f0e45d7062e8cb818dd63447bc80864
https://doi.org/10.1149/ma2014-02/33/1690