المؤلفون: Lan, You-Jyun, Wu, Chia-Chien, Hsu, Tsung-Hsien, Chuang, Ricky W., Huang, Cheng-Liang

المصدر: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 1, p1-21, 21p

المؤلفون: Lan, You-Jyun, Wu, Chia-Chien, Hsu, Tsung-Hsien, Chuang, Ricky W., Huang, Cheng-Liang

المساهمون: National Science and Technology Council

المصدر: Journal of Materials Science: Materials in Electronics ; volume 36, issue 1 ; ISSN 0957-4522 1573-482X

الاتاحة: https://doi.org/10.1007/s10854-024-14136-5
https://link.springer.com/content/pdf/10.1007/s10854-024-14136-5.pdf
https://link.springer.com/article/10.1007/s10854-024-14136-5/fulltext.html

المؤلفون: Hsu, Cheng-Liang, Lan, You-Jyun, Hsueh, Han-Ting, Pan, Yen-Liang, Liu, Yi-Hung

المساهمون: National Science and Technology Council

المصدر: Journal of Alloys and Compounds ; volume 978, page 173570 ; ISSN 0925-8388

الاتاحة: http://dx.doi.org/10.1016/j.jallcom.2024.173570
https://api.elsevier.com/content/article/PII:S0925838824001567?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0925838824001567?httpAccept=text/plain

المؤلفون: Hsu, Cheng-Liang, Lan, You-Jyun, Hsueh, Han-Ting, Pan, Yen-Liang, Liu, Yi-Hung

الاتاحة: http://dx.doi.org/10.2139/ssrn.4618266