المؤلفون: Seungtaek Jeong, Tae-Wook Kim, Seongsoo Lee, Boogyo Sim, Hyunwook Park, Kyungjune Son, Keeyoung Son, Seongguk Kim, Taein Shin, Young-Cheon Kim, Joungho Kim, Byoung-Joon Kim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1748-1756

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c98ac88a3a3d248567018ea1d7f609d2
https://doi.org/10.1109/tcpmt.2022.3217291

المؤلفون: Joungho Kim, Shinyoung Park, Seungtaek Jeong, Keeyoung Son, Keunwoo Kim, Gapyeol Park, HyunWook Park, Seokwoo Hong, Min-Su Kim, Kyungjune Son, Daehwan Lho, Seongsoo Lee

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:100-110

مصطلحات موضوعية: Computer engineering, Computer science, Scalability, Array data structure, Reinforcement learning, Point (geometry), Signal integrity, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0603eee6d63914755e8524c4a1a8698e
https://doi.org/10.1109/tcpmt.2021.3129502

المؤلفون: HyunWook Park, Daehwan Lho, Kyungjun Cho, Seongguk Kim, Gapyeol Park, Shinyoung Park, Youngwoo Kim, Kyungjune Son, Subin Kim, Seungtaek Jeong, Joungho Kim, Taein Shin

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1955-1970

مصطلحات موضوعية: Interconnection, Hardware_MEMORYSTRUCTURES, Through-silicon via, Computer science, High Bandwidth Memory, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Bandwidth (computing), Electronic engineering, Signal integrity, Electrical and Electronic Engineering, Physical design, Dram, Data transmission

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::524205c6b7cdce0139d0a269443f09df
https://doi.org/10.1109/tcpmt.2021.3117071

المؤلفون: Joungho Kim, Rao Tummala, Kyungjune Son, Pulugurtha Markondeya Raj, Youngwoo Kim, Insu Hwang, Gapyeol Park, Junyong Park, Atom Watanabe, Kyungjun Cho, HyunWook Park, Jihye Kim

المصدر: IEEE Transactions on Electromagnetic Compatibility. 63:1562-1573

مصطلحات موضوعية: Coupling, Materials science, Noise measurement, Acoustics, Electromagnetic shielding, Interposer, Equivalent circuit, Electrical and Electronic Engineering, Condensed Matter Physics, Transfer function, Signal, Noise (electronics), Atomic and Molecular Physics, and Optics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2ed5718fa3146ec94346368bd35b982
https://doi.org/10.1109/temc.2021.3059846

المؤلفون: Daehwan Lho, Hyunwook Park, Keunwoo Kim, Seongguk Kim, Boogyo Sim, Kyungjune Son, Keeyoung Son, Jihun Kim, Seonguk Choi, Joonsang Park, Haeyeon Kim, Kyubong Kong, Joungho Kim

المصدر: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::74893766105bb2b94083f73f7c7e6b87
https://doi.org/10.1109/epeps53828.2022.9947119

المؤلفون: Keunwoo Kim, Junghyun Lee, Seokwoo Hong, Hyunwoo Kim, Boogyo Sim, Kyungjune Son, Taein Shin, Keeyoung Son, Jinyoung Kim, Kyubong Kong, Joungho Kim

المصدر: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b7e3ada9f3965120626325babe277633
https://doi.org/10.1109/epeps53828.2022.9947123

المؤلفون: Kyungjune Son, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Boogyo Sim, Taein Shin, Joonsang Park, Haeyeon Kim, Joungho Kim, Kyubong Gong

المصدر: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9f601cd820e588666383c4ded6fc4ecc
https://doi.org/10.1109/epeps53828.2022.9947197

المؤلفون: Seongtaek Jung, Daehwan Lho, Kyungjun Cho, HyunWook Park, Seongguk Kim, Joungho Kim, Taein Shin, Subin Kim, Shinyoung Park, Kyungjune Son, Gapyeol Park, Kyubong Gong

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1122-1136

مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Computer science, Memristor, Signal, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, law.invention, Power (physics), Neuromorphic engineering, law, Electronic engineering, System on a chip, Signal integrity, Electrical and Electronic Engineering, Power network design, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::be1fb607fd7454866fcc3858553a497e
https://doi.org/10.1109/tcpmt.2021.3092740

المؤلفون: HyunWook Park, Boogyo Sim, Seongguk Kim, Keunwoo Kim, Jin Young Kim, Gapyeol Park, Taein Shin, Kyungjune Son, Daehwan Lho, Hyungmin Kang, Joonsang Park, Joungho Kim, Keeyoung Son

المصدر: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

مصطلحات موضوعية: Reduction (complexity), Cable gland, Crosstalk (biology), law, Computer science, Electronic engineering, Inverse, HDMI, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bb17e28e282c110876d482ecbff5e1dd
https://doi.org/10.1109/epeps51341.2021.9609231

المؤلفون: HyunWook Park, Kyungjune Son, Seongguk Kim, Boogyo Sim, Joungho Kim, Minsu Kim, Taein Shin, Keeyoung Son, Hyungmin Kang, Keunwoo Kim, Daehwan Lho

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Artificial neural network, Computer science, Conductance, 020206 networking & telecommunications, 02 engineering and technology, Circuit modeling, Capacitance, 020202 computer hardware & architecture, law.invention, Data modeling, Inductance, law, Electrical network, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Electrical impedance

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b5163b4c67f22f9a8edec01f4ba6e2dc
https://doi.org/10.1109/edaps50281.2020.9312895

المؤلفون: Joungho Kim, Keunwoo Kim, Minsu Kim, Seonguk Choi, Kyungjune Son, Keeyoung Son, Daehwan Lho, Seongguk Kim, Taein Shin, HyunWook Park

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Optimal design, Through-silicon via, Computer science, 010102 general mathematics, Bandwidth (signal processing), High Bandwidth Memory, 01 natural sciences, 010101 applied mathematics, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Reinforcement learning, Fext, Markov decision process, 0101 mathematics, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::48204135e5b8eae5cf6daba6f369a736
https://doi.org/10.1109/edaps50281.2020.9312906

المؤلفون: Kyungjune Son, Taein Shin, Shinyoung Park, Seoungguk Kim, Daewhan Lho, Keeyoung Son, Minsu Kim, Keunwoo Kim, Gapyeol Park, Joungho Kim, HyunWook Park

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Interconnection, Computer science, Convergence (routing), Reinforcement learning, Array data structure, Signal integrity, Solid modeling, Markov decision process, Power network design, Algorithm

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bb5f03f993823ab704f5b3b37ca69488
https://doi.org/10.1109/edaps50281.2020.9312891

المؤلفون: Seong-Min Choi, Jun Ho Lee, HyunWook Park, Taein Shin, Joungho Kim, Daehwan Lho, Gapyeol Park, Kyungjune Son, Keeyoung Son, Junyong Park, Seongguk Kim, Joonsang Park

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Attenuation-to-crosstalk ratio, Cable gland, Computer science, law, Frequency domain, Electronic engineering, Insertion loss, Signal integrity, Electrical impedance, HDMI, Characteristic impedance, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::97c44095bf250855284dbabd9db9fd1d
https://doi.org/10.1109/edaps50281.2020.9312909

المؤلفون: Seongguk Kim, Kyungjune Son, Keeyoung Son, Subin Kim, Minsu Kim, Joungho Kim, Taein Shin, Hyungmin Kang, Gapyeol Park, Seungtaek Jeong, HyunWook Park, Keunwoo Kim

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Computer science, 05 social sciences, 010501 environmental sciences, Perceptron, Decoupling capacitor, 01 natural sciences, Convolutional neural network, Power (physics), Control theory, 0502 economics and business, Convergence (routing), Reinforcement learning, 050207 economics, 0105 earth and related environmental sciences, Transformer (machine learning model), Network model

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2f1910a5bc48c4a80cd61a68682b7a1f
https://doi.org/10.1109/edaps50281.2020.9312908

المؤلفون: Shinyoung Park, Keeyoung Son, Subin Kim, Taein Shin, Minsu Kim, Gapyeol Park, Kyungjune Son, Keunwoo Kim, Seungtaek Jeong, Joungho Kim, HyunWook Park

المصدر: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Materials science, business.industry, Integrated circuit, High Bandwidth Memory, law.invention, Coolant, Transmission line, law, Heat transfer, Optoelectronics, Junction temperature, System on a chip, Signal integrity, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2f0c7f306be5e9f96c4f92ba28174091
https://doi.org/10.1109/edaps50281.2020.9312897

المؤلفون: Gapyeol Park, Joungho Kim, Taein Shin, Seongguk Kim, Daehwan Lho, Subin Kim, Shinyoung Park, HyunWook Park, Kyungjune Son

المصدر: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

مصطلحات موضوعية: Interconnection, Artificial neural network, business.industry, Computer science, Reliability (computer networking), Memristor, law.invention, law, Multiplication, Signal integrity, Crossbar switch, business, Power network design, Computer hardware

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::71ea5695d91a6b6a2e491cb20a73d589
https://doi.org/10.1109/emcsi38923.2020.9191621

المؤلفون: Seongsoo Lee, Hyunsuk Lee, Subin Kim, Junyong Park, Youngwoo Kim, Jinwook Song, Gapyeol Park, Kyungjun Cho, Joungho Kim, Kyungjune Son

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:107-121

مصطلحات موضوعية: 010302 applied physics, Through-silicon via, Computer science, 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, Industrial and Manufacturing Engineering, Characteristic impedance, Electronic, Optical and Magnetic Materials, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Insertion loss, Equivalent circuit, Redistribution layer, Signal integrity, Electrical and Electronic Engineering, Electrical impedance, Ground plane

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::869e00e70b98ff0ee8f3c95667709b96
https://doi.org/10.1109/tcpmt.2018.2843442

المؤلفون: Kyungjune Son, Michael Bae, Hyesoo Kim, Kyungjun Cho, Dongho Ha, Subin Kim, Junyong Park, Joungho Kim, Seongsoo Lee, Jonghoon J. Kim, Bumhee Bae, Dong-Hyun Kim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:2152-2162

مصطلحات موضوعية: 010302 applied physics, Materials science, Acoustics, High density, 020206 networking & telecommunications, 02 engineering and technology, Solid modeling, Silicone rubber, 01 natural sciences, Electromagnetic simulation, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, High bandwidth, Time domain, Electrical and Electronic Engineering, Coaxial, Electrical impedance

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea728eb21bb74385c0b3a90291c1940e
https://doi.org/10.1109/tcpmt.2018.2828223

المؤلفون: Kyungjune Son, HyunWook Park, Seungtaek Jeong, Seongguk Kim, Joungho Kim, Subin Kim, Kyungjun Cho, Shinyoung Park

المصدر: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Computer science, Electronic engineering, Interposer, Power integrity, Transient response, Voltage regulator, Supercomputer, Chip, Power (physics), Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ddbd9fcebe04a9b019f8dd314cab7426
https://doi.org/10.1109/edaps47854.2019.9011662

المؤلفون: Taein Shin, Seungtaek Jeong, Daehwan Lho, Seongguk Kim, Subin Kim, Joungho Kim, Junyong Park, HyunWook Park, Kyungjune Son, Gapyeol Park, Boogyo Sim, Hyungmin Kang

المصدر: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS).

مصطلحات موضوعية: Fine-tuning, Search engine, Artificial neural network, Computer science, 020204 information systems, 0202 electrical engineering, electronic engineering, information engineering, Extension method, 02 engineering and technology, Signal integrity, Time domain, Reflectometry, Electrical impedance, Algorithm

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bc8ea8df5ab902e9b11a7f316967f9f1
https://doi.org/10.1109/edaps47854.2019.9011677