المؤلفون: Sunwu Xu, Yifei Li, Xinyi Jing, Kyung-Wook Paik, Peng He, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 29, Iss , Pp 2272-2278 (2024)

مصطلحات موضوعية: Sn-Bi-In alloy, Low-melting lead-free solder, Microstructure, Strengthening, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424003107; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/8b3e6d6731154d6986373a33ed6199bb

المؤلفون: Shuai Zhang, Hongzhi Zhou, Tianran Ding, Weimin Long, Sujuan Zhong, Kyung-Wook Paik, Peng He, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 28, Iss , Pp 1743-1751 (2024)

مصطلحات موضوعية: Microwave hybrid heating, SAC305 joints, Susceptor, Numerical simulation, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423030879; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/9a7ad443c2ca4478abf5d2e172e79341

المؤلفون: Shaoan Wang, Xiangyu Chen, Keyu Luo, Hongzhi Zhou, Rongqing Li, Peng He, Kyung-Wook Paik, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 5332-5339 (2023)

مصطلحات موضوعية: SAC305/Sn58Bi, IMC morphology, Au/Ni/Cu pad, Au/Pd/Ni/Cu pad, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423028405; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/f2d83c4cb05a4fa18cfc9f33eb76c6ad

المؤلفون: Shuye Zhang, Shaoan Wang, Shang Zhang, Xiangyu Chen, Chen Zeng, Kyung-Wook Paik, Peng He

المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 7094-7099 (2023)

مصطلحات موضوعية: Crystal calculation, Intermetallic property, TEM analysis, ENEPIG, Hybrid solder joining, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423029009; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/e03a51e5016e406285a2615a4b103ab5

المؤلفون: Xinyi Jing, Keyu Luo, Kyung-Wook Paik, Peng He, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 1663-1668 (2023)

مصطلحات موضوعية: Grain orientation, EBSD, Solder joint, Thermal shock test, Nanoindentation, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423018367; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/69b4383ed465427ea62892cd0b77e0ae

المؤلفون: Shuye Zhang, Peng He, Kyung-Wook Paik, Ephraim Suhir, Ning-Cheng Lee

المصدر: Journal of Advanced Joining Processes, Vol 6, Iss , Pp 100126- (2022)

مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666330922000309; https://doaj.org/toc/2666-3309

URL الوصول: https://doaj.org/article/259d02517bdd4b67ab212cd427beccf3

المؤلفون: Shuye Zhang, Ran Duan, Sunwu Xu, Panfei Xue, Chengqian Wang, Jieshi Chen, Kyung-Wook Paik, Peng He

المصدر: Journal of Advanced Joining Processes, Vol 5, Iss , Pp 100076- (2022)

مصطلحات موضوعية: Fan-out wafer-level package, Shear strength, Soldering process, Accelerated reliability, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666330921000364; https://doaj.org/toc/2666-3309

URL الوصول: https://doaj.org/article/3e661cd4f66e4193a51dc52064637b8a

المؤلفون: Shuye Zhang, Junyong Park, Gapyeol Park, Huijin Song, Joungho Kim, Kyung-Wook Paik, Peng He

المصدر: Journal of Advanced Joining Processes, Vol 5, Iss , Pp 100099- (2022)

مصطلحات موضوعية: Coplanar waveguide, High frequency, Solder ACF joints, Flex-on-board application, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S266633092200005X; https://doaj.org/toc/2666-3309

URL الوصول: https://doaj.org/article/56e6665aa5f84a039eb5eaa0e05b9338

المؤلفون: Shuye Zhang, Zhenfeng Li, Hongzhi Zhou, Rongqing Li, Shaoan Wang, Kyung-Wook Paik, Peng He

المصدر: e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 2, Iss , Pp 100052- (2022)

مصطلحات موضوعية: 3D heterogeneous integration, Advanced packaging, Reliability, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2772671122000249; https://doaj.org/toc/2772-6711

URL الوصول: https://doaj.org/article/5ca25ad91b784fc9ab91c27dce2eeded

المؤلفون: Taemin Lee, Joontaek Jung, Sang-Mok Lee, Jongcheol Park, Jae-Hyeong Park, Kyung-Wook Paik, Hyunjoo J. Lee

المصدر: Sensors, Vol 22, Iss 15, p 5557 (2022)

مصطلحات موضوعية: FPCB, composite, ACF, ultrasound transducer, acoustic matching layer, acoustic impedance, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1424-8220/22/15/5557; https://doaj.org/toc/1424-8220

URL الوصول: https://doaj.org/article/951b1c055dae434b8bde6f452b8e61e9

المؤلفون: Shuye Zhang, Ming Yang, Mingliang Jin, Wen-Can Huang, Tiesong Lin, Peng He, Panpan Lin, Kyung-Wook Paik

المصدر: Metals, Vol 8, Iss 1, p 42 (2018)

مصطلحات موضوعية: adhesive thermos-mechanical property, SnBi58 solder joint morphology, flex-on-board assembly, thermal compression bonding, ultrasonic bonding, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.mdpi.com/2075-4701/8/1/42; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/7f8d05c5206343c68815e8df74e5a2e1

المؤلفون: Qian Wang, Shuye Zhang, Tiesong Lin, Pengzhe Zhang, Peng He, Kyung-Wook Paik

المصدر: Progress in Natural Science: Materials International, Vol 31, Iss 1, Pp 129-140 (2021)

مصطلحات موضوعية: Electronic packaging, Ag paste, Cu–Cu joints, Mechanical property, Joining morphology, Materials of engineering and construction. Mechanics of materials, TA401-492

Relation: http://www.sciencedirect.com/science/article/pii/S1002007120305797; https://doaj.org/toc/1002-0071; https://doaj.org/article/2b56834267854686a4deaab4a6de80d8

الاتاحة: https://doi.org/10.1016/j.pnsc.2020.12.004
https://doaj.org/article/2b56834267854686a4deaab4a6de80d8

المؤلفون: Xionghui Cai, Aixia Zhai, Chenglong Zhou, Kyung-Wook Paik

المصدر: Microelectronics International. 40:166-171

مصطلحات موضوعية: Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d9e6611f8bb064a7c1fd41d43087ae4c
https://doi.org/10.1108/mi-11-2022-0187

المؤلفون: Shuye Zhang, Mingjia Sun, Jianqun Yang, Xingji Li, Peng He, Kyung-Wook Paik

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:26-33

مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::25a5f62ddd1d0048ae5eb650c30cb389
https://doi.org/10.1109/tcpmt.2023.3234908

المؤلفون: Ning Ren, Heng Fang, Dong Wang, Chenyi Hou, Yatao Zhao, Fan Chen, Ye Tian, Kyung-Wook Paik, Yiping Wu

المصدر: Materials; Volume 13; Issue 1; Pages: 252

مصطلحات موضوعية: micro-joints, intermetallic compounds, mechanical properties, failure mechanisms, reliability

وصف الملف: application/pdf

Relation: Manufacturing Processes and Systems; https://dx.doi.org/10.3390/ma13010252

الاتاحة: https://doi.org/10.3390/ma13010252

المؤلفون: Yan Pan, Xiaohui Peng, Pengli Zhu, Rong Sun, Kyung-Wook Paik

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c2bdb354478e2c295729b4af31fe7d4c
https://doi.org/10.1109/icept56209.2022.9873307

المؤلفون: Panfei Xue, Ran Duan, Shuye Zhang, Chengqian Wang, Sunwu Xu, Kyung-Wook Paik, Jieshi Chen, Peng He

المصدر: Journal of Advanced Joining Processes, Vol 5, Iss, Pp 100076-(2022)

مصطلحات موضوعية: Materials science, Accelerated reliability, Mechanical Engineering, Surface finish, Electroless nickel, Printed circuit board, Reliability (semiconductor), Shear strength, Mechanics of Materials, Soldering, Fan-out wafer-level package, TA401-492, Chemical Engineering (miscellaneous), Wafer, Composite material, Engineering (miscellaneous), Materials of engineering and construction. Mechanics of materials, Soldering process, Shrinkage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f44ba9ea8f32b0993e72b1ace5823c10
http://www.sciencedirect.com/science/article/pii/S2666330921000364

المؤلفون: Tiesong Lin, Peng He, Pengzhe Zhang, Qian Wang, Kyung-Wook Paik, Shuye Zhang

المصدر: Journal of Manufacturing Processes. 62:546-554

مصطلحات موضوعية: 0209 industrial biotechnology, Materials science, Strategy and Management, Silver Nano, Sintering, 02 engineering and technology, Direct bonding, Substrate (electronics), Management Science and Operations Research, 021001 nanoscience & nanotechnology, Focused ion beam, Industrial and Manufacturing Engineering, law.invention, 020901 industrial engineering & automation, Chemical engineering, Magazine, Transmission electron microscopy, law, Soldering, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec777da77dd30dcc377005a41556c5ea
https://doi.org/10.1016/j.jmapro.2020.11.043

المؤلفون: Kyung-Wook Paik, Jae-Hyeong Park, Jongcheol Park, Hyunjoo Lee, Sang-Mok Lee

المصدر: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 67:2148-2154

مصطلحات موضوعية: chemistry.chemical_classification, Materials science, Acoustics and Ultrasonics, chemistry.chemical_element, Thermosetting polymer, Epoxy, Polymer, Tungsten, 01 natural sciences, Micrometre, chemistry, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Ultrasonic sensor, Electrical and Electronic Engineering, Composite material, 010301 acoustics, Instrumentation, Electrical impedance, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14ef4f1a7ded359e270a5cc286c18a99
https://doi.org/10.1109/tuffc.2020.2999178

المؤلفون: Ji-Hye Kim, Seung Jin Oh, Kyung-Wook Paik, Yan Pan, Taek-Soo Kim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:941-948

مصطلحات موضوعية: 010302 applied physics, chemistry.chemical_classification, Interconnection, Materials science, Polyacrylonitrile, 02 engineering and technology, Polymer, Bending, Epoxy, 021001 nanoscience & nanotechnology, 01 natural sciences, Polyvinylidene fluoride, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Adhesive, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Material properties

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0b191e2bc59bfeb4bf226377e85648e7
https://doi.org/10.1109/tcpmt.2020.2990404