المؤلفون: Hyun-Goo Jeon, Kyung-Il Ouh, Junekyun Park, Jongwoo Park, Yong-Bum Jo

المصدر: IEEE Transactions on Components and Packaging Technologies. 30:724-730

مصطلحات موضوعية: Void (astronomy), Materials science, Compressive strength, High-temperature operating life, Electronic engineering, Extrusion, Electrical and Electronic Engineering, Composite material, Quad Flat Package, Circuit reliability, Electromigration, Electronic, Optical and Magnetic Materials, Stress concentration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b3f68f6e386d97cf75621b0ecd21d5fe
https://doi.org/10.1109/tcapt.2007.906322

المؤلفون: Junekyun Park, Hyun-Goo Jeon, Sam-Young Kim, Man-Young Shin, Kyung-Il Ouh, Sang-Cheol Shin, Back-Sung Kim, Hyun-Joon Cha, Jongwoo Park, Yong-Bum Jo

المصدر: IEEE Transactions on Components and Packaging Technologies. 30:731-744

مصطلحات موضوعية: Wire bonding, Auger electron spectroscopy, Materials science, Cost effectiveness, Alloy, Metallurgy, Intermetallic, Epoxy, Molding (process), engineering.material, Electronic, Optical and Magnetic Materials, visual_art, visual_art.visual_art_medium, engineering, Surface roughness, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c8ff73e995162b26ee4139f58469a18
https://doi.org/10.1109/tcapt.2007.906318

المؤلفون: Jongwoo Park, Back-Sung Kim, Hyun-Jun Cha, Yong-Bum Jo, Sang-Chul Shin, Gun-Rae Kim, June-Kyun Park, Man-Young Shin, Kyung-Il Ouh, Hyun-Goo Jeon

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings ; page 569-570

الاتاحة: http://dx.doi.org/10.1109/relphy.2004.1315393
http://xplorestaging.ieee.org/ielx5/9182/29131/01315393.pdf?arnumber=1315393

المؤلفون: Soo-Hyung Kim, Seung-Bae Lee, Kyung-Il Ouh, Chae-Bog Rim, Kyoung-Sik Moon, Ho-Gyu Yoon, Tak-Jin Moon

المصدر: IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016) ; volume 1, page 153-156

الاتاحة: http://dx.doi.org/10.1109/isemc.2000.875554
http://xplorestaging.ieee.org/ielx5/7008/18905/00875554.pdf?arnumber=875554

المؤلفون: Yong-Bum Jo, Chul-Hee Jeon, Hyun-Goo Jeon, Jongwoo Park, Kyung-Il Ouh

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings.

مصطلحات موضوعية: Void (astronomy), Materials science, chemistry, Aluminium, High-temperature operating life, Electronic engineering, chemistry.chemical_element, Extrusion, Failure mechanism, Quad Flat Package, Composite material, Electronic circuit, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6693a2dbf6e21875b524bccd3b3b5fb6
https://doi.org/10.1109/relphy.2004.1315423

المؤلفون: Jung-Young Nam, Sang-Jun Hong, Soo-Hyung Kim, Kyung-Il Ouh, Chae-Bok Rim

المصدر: Proceedings of the International Conference on Electromagnetic Interference and Compatibility.

مصطلحات موضوعية: Burst noise, Engineering, Noise temperature, Noise, Noise generator, business.industry, Electrical engineering, Electronic engineering, Effective input noise temperature, Flicker noise, business, Power-on reset, Reset (computing)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dd74e27d26ad6305e8b426a405afee0f
https://doi.org/10.1109/icemic.1999.871611

المؤلفون: Soo-Hyung Kim, Jung-Young Nam, Kyung-Il Ouh, Sang-Jun Hong, Chae-Bok Rim

المصدر: Proceedings of the International Conference on Electromagnetic Interference & Compatibility '99 (IEEE Cat No 99TH 8487); 1999, p120-125, 6p

المؤلفون: Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim, Yong-Bum Jo, June-Kyun Park, Sam-Young Kim, Sang-Cheol Shin, Man-Young Shin, Kyung-Il Ouh, Hyungoo Jeon

المصدر: IEEE Transactions on Components & Packaging Technologies; Dec2007, Vol. 30 Issue 4, p731-744, 14p, 5 Black and White Photographs, 1 Diagram, 4 Charts, 9 Graphs

مصطلحات موضوعية: METAL bonding, WIRE bonding (Electronic packaging), ELECTRONIC packaging, SHEAR (Mechanics), MOLDING (Founding), EPOXY compounds, FAILURE analysis, ATOMIC force microscopy, AUGER effect

المؤلفون: Yong-Bum Jo, Jongwoo Park, June-Kyun Park, Kyung-Il Ouh, Hyun-Goo Jeon

المصدر: IEEE Transactions on Components & Packaging Technologies; Dec2007, Vol. 30 Issue 4, p724-730, 7p, 6 Black and White Photographs, 2 Graphs

مصطلحات موضوعية: ELECTRODIFFUSION, PHYSICAL metallurgy, METAL extrusion, EXTRUSION process, HIGH temperatures, FAILURE analysis, INTEGRATED circuit interconnections, INTEGRATED circuits, DIELECTRICS, STRESS concentration

المؤلفون: Soo-Hyung Kim, Seung-Bae Lee, Kyung-Il Ouh, Chae-Bog Rim, Kyoung-Sik Moon, Ho-Gyu Yoon, Tak-Jin Moon

المصدر: IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016); 2000, p153-153, 1p