المؤلفون: Kyungjune Son, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Boogyo Sim, Taein Shin, Joonsang Park, Haeyeon Kim, Joungho Kim, Kyubong Gong

المصدر: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9f601cd820e588666383c4ded6fc4ecc
https://doi.org/10.1109/epeps53828.2022.9947197

المؤلفون: Seongtaek Jung, Daehwan Lho, Kyungjun Cho, HyunWook Park, Seongguk Kim, Joungho Kim, Taein Shin, Subin Kim, Shinyoung Park, Kyungjune Son, Gapyeol Park, Kyubong Gong

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1122-1136

مصطلحات موضوعية: Hardware_MEMORYSTRUCTURES, Computer science, Memristor, Signal, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, law.invention, Power (physics), Neuromorphic engineering, law, Electronic engineering, System on a chip, Signal integrity, Electrical and Electronic Engineering, Power network design, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::be1fb607fd7454866fcc3858553a497e
https://doi.org/10.1109/tcpmt.2021.3092740