المؤلفون: Tian Tian, Hwa-Young Son, Rao Morusupalli, Kwang-Yoo Byun, R. Caramto, Young-Chang Joo, Nobumichi Tamura, Hwisu Shin, Martin Kunz, Arief Suriadi Budiman, Larry Smith, Y-L. Shen

المصدر: Procedia Engineering. 139:101-111

مصطلحات موضوعية: Electron mobility, Materials science, Silicon, chemistry.chemical_element, 02 engineering and technology, Integrated circuit, Substrate (electronics), 01 natural sciences, law.invention, Stress (mechanics), Reliability (semiconductor), law, 0103 physical sciences, Electronic engineering, Cu TSV, Engineering(all), 010302 applied physics, Interconnection, Through-silicon via, business.industry, General Medicine, 3-D interconnects, 021001 nanoscience & nanotechnology, chemistry, Optoelectronics, 0210 nano-technology, business, X-ray microdiffraction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e70e0c75bdcf5d6660e7d512d09da659

المؤلفون: Hae-A. Seul Shin, Sung-Hwan Hwang, Kwang-Yoo Byun, B.-J. Kim, Nobumichi Tamura, Qwan-Ho Chung, Min Suk Suh, Ho-Young Son, Young-Chang Joo, Arief Suriadi Budiman, Martin Kunz

المصدر: Microelectronics Reliability. 52:530-533

مصطلحات موضوعية: Materials science, Through-silicon via, X-ray, Integrated circuit, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Synchrotron, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Stress (mechanics), Crystallography, law, Ultimate tensile strength, Electrical and Electronic Engineering, Hydrostatic stress, Composite material, Safety, Risk, Reliability and Quality

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f5c9b42ce83caa41d76f9aa56385224a
https://doi.org/10.1016/j.microrel.2011.10.016

المؤلفون: Dong-Ik Kim, Ho-Young Son, Ju-Heon Kim, Arief Suriadi Budiman, Hae-A. Seul Shin, Nobumichi Tamura, Martin Kunz, Byoung-Joon Kim, Young-Chang Joo, Sung-Hwan Hwang, Kwang-Yoo Byun

المصدر: Journal of Electronic Materials. 41:712-719

مصطلحات موضوعية: Materials science, Solid-state physics, Silicon, Annealing (metallurgy), Metallurgy, chemistry.chemical_element, Condensed Matter Physics, Microstructure, Copper, Grain size, Electronic, Optical and Magnetic Materials, Grain growth, chemistry, Materials Chemistry, Electrical and Electronic Engineering, Stress concentration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::742fa87c1721ef173d71d2ad9c6b67cd
https://doi.org/10.1007/s11664-012-1943-7

المؤلفون: Sang-Joon Lim, Heung-Jae Shin, Jong-Tae Lee, Woong-Sun Lee, Qwan-Ho Chung, Jung-Kwon Park, Kwang-Yoo Byun

المصدر: International Symposium on Microelectronics. 2011:000887-000890

مصطلحات موضوعية: Engineering, business.industry, Electrical engineering, Slew rate, Substrate (printing), Chip, Signal, law.invention, law, Automotive Engineering, Resistor, business, Sensitivity (electronics), Layer (electronics), Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6e8aa304b5d7473886d5c8ac0d4ed0c5
https://doi.org/10.4071/isom-2011-tha1-paper2

المؤلفون: Qwan-Ho Chung, Kwang-Yoo Byun, Young-Bae Park, Seung-Taek Yang, Gi-Tae Lim, Jang-Hee Lee, Min Suk Suh

المصدر: Journal of the Korean Physical Society. 54:1784-1792

مصطلحات موضوعية: Thermal copper pillar bump, Materials science, Kirkendall effect, Soldering, Current crowding, General Physics and Astronomy, Composite material, Joule heating, Current density, Electromigration, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2085b96f60e8bad24abd60ce970452dd
https://doi.org/10.3938/jkps.54.1784

المؤلفون: Hwa Jung Kim, Seung Wook Yoon, Kwang Yoo Byun, Jun Ki Hong

المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 28:168-175

مصطلحات موضوعية: Printed circuit board, Materials science, Chip-scale package, Soldering, Mechanical joint, Ball grid array, Electronic engineering, Electronic packaging, Solder paste, Electrical and Electronic Engineering, Composite material, Daisy chain, Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9dfbee919d9e526017baa46fddec0409
https://doi.org/10.1109/tepm.2005.847398

المؤلفون: Jang-Hee Lee, Gi-Tae Lim, Park, Young-Bae, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun

المصدر: 2008 58th Electronic Components and Technology Conference ; page 2030-2034

الاتاحة: http://dx.doi.org/10.1109/ectc.2008.4550263
http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550263.pdf?arnumber=4550263

المؤلفون: Woong Sun Lee, Kwang Yoo Byun

المصدر: 2007 International Conference on Electronic Materials and Packaging ; page 1-5

الاتاحة: http://dx.doi.org/10.1109/emap.2007.4510327
http://xplorestaging.ieee.org/ielx5/4489832/4510273/04510327.pdf?arnumber=4510327

المؤلفون: N.-S Kim, M. Murugesan, Kang-Wook Lee, Jichoel Bea, Takafumi Fukushima, Min Suk Suh, Mitsumasa Koyanagi, Hwa-Young Son, Kwang-Yoo Byun

المصدر: 3DIC

مصطلحات موضوعية: Materials science, business.industry, Stacking, Three-dimensional integrated circuit, Substrate (printing), Chip, Integrated circuit layout, law.invention, law, Electronic engineering, Optoelectronics, Wetting, Self-assembly, Photolithography, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dd2f0fe9231f8b7b379b3991e356e5fd
https://doi.org/10.1109/3dic.2013.6702360

المؤلفون: Pierre Chia, Jae-Sung Oh, Nam-Seog Kim, Jay Im, Rui Huang, Chenglin Wu, Kwang-Yoo Byun, Paul S. Ho, Tengfei Jiang, Li Li, Peng Su, Xi Liu, Ho-Young Son

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.

مصطلحات موضوعية: business.product_category, Materials science, Deformation (mechanics), business.industry, Structural engineering, Plasticity, Synchrotron, Finite element method, law.invention, Stress (mechanics), law, Residual stress, Die (manufacturing), Composite material, business, Beam (structure)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::516f74c85b541e17a12e6a11d21766d2
https://doi.org/10.1109/ectc.2013.6575641

المؤلفون: Joohee Kim, Jun So Pak, Jonghyun Cho, Eakhwan Song, Jeonghyeon Cho, Heegon Kim, Taigon Song, Junho Lee, Hyungdong Lee, Kunwoo Park, Seungtaek Yang, Min-Suk Suh, Kwang-Yoo Byun, Joungho Kim

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 1, issue 2, page 181-195 ; ISSN 2156-3950 2156-3985

الاتاحة: http://dx.doi.org/10.1109/tcpmt.2010.2101890
http://xplorestaging.ieee.org/ielx5/5503870/5739011/05739019.pdf?arnumber=5739019

المؤلفون: Paul S. Ho, Rui Huang, Tengfei Jiang, Qiu Zhao, Kwang-Yoo Byun, Suk-Kyu Ryu, Ho-Young Son, Jay Im

المصدر: 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.

مصطلحات موضوعية: Materials science, Silicon, business.industry, chemistry.chemical_element, Structural engineering, Temperature cycling, Curvature, Finite element method, Computer Science::Other, Nonlinear system, Grain growth, Reliability (semiconductor), chemistry, Thermal, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::163738049116968ab728ce8a92313008
https://doi.org/10.1109/icsict.2012.6467715

المؤلفون: Jay Im, Ho-Young Son, Suk-Kyu Ryu, Kwang-Yoo Byun, Qiu Zhao, Rui Huang, Paul S. Ho, Tengfei Jiang

المصدر: 2012 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Work (thermodynamics), Materials science, Silicon, business.industry, Numerical analysis, chemistry.chemical_element, Structural engineering, Plasticity, Temperature measurement, Stress (mechanics), symbols.namesake, chemistry, Thermal, symbols, business, Raman spectroscopy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d623a0d771193938a2bfdd0dd294f61
https://doi.org/10.1109/iitc.2012.6251570

المؤلفون: Jay Im, Ho-Young Son, Rui Huang, Qiu Zhao, Paul S. Ho, Tengfei Jiang, Suk-Kyu Ryu, Kwang-Yoo Byun

المصدر: 2012 Symposium on VLSI Technology (VLSIT).

مصطلحات موضوعية: Materials science, Silicon, Analytical chemistry, chemistry.chemical_element, Temperature cycling, Temperature measurement, Finite element method, Computer Science::Other, Stress (mechanics), symbols.namesake, chemistry, Thermal, Stress relaxation, symbols, Composite material, Raman spectroscopy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::63b2a3c87815a2451bd374e683045c6e
https://doi.org/10.1109/vlsit.2012.6242482

المؤلفون: Arief Suriadi Budiman, R. Caramto, Larry Smith, Nobumichi Tamura, Q.-H. Chung, Sung-Hwan Hwang, Kwang-Yoo Byun, Martin Kunz, Min Suk Suh, B.-J. Kim, Young-Chang Joo, Hwa-Young Son, Hae-A. Seul Shin

المصدر: 2012 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Electron mobility, Materials science, Silicon, Through-silicon via, business.industry, Annealing (metallurgy), X-ray, chemistry.chemical_element, Stress measurement, Synchrotron, law.invention, chemistry, law, Stress control, Electronic engineering, Optoelectronics, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::13532bcc7e8293920ebc062a68b09e3f
https://doi.org/10.1109/iitc.2012.6251661

المؤلفون: Min-jae Choi, Kwang-Yoo Byun, Suk-woo Jeon, Gyujei Lee, Dongil Kwon

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, Scanning electron microscope, business.industry, chemistry.chemical_element, Structural engineering, Microstructure, Finite element method, chemistry, Residual stress, Indentation, Composite material, Contact area, business, SIMPLE algorithm

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f7ac0e60743922004bfe3f5cc96702a8
https://doi.org/10.1109/ectc.2012.6248921

المؤلفون: Kwang-Yoo Byun, Suk-woo Jeon, Dongil Kwon, Gyujei Lee

المصدر: 3DIC

مصطلحات موضوعية: Materials science, Silicon, chemistry, Through-silicon via, Residual stress, Indentation, chemistry.chemical_element, Integrated circuit design, Nanoindentation, Algorithm, Finite element method, SIMPLE algorithm

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ecbc02c58e458b6297670d69974211f5
https://doi.org/10.1109/3dic.2012.6262996

المؤلفون: Suk-woo Jeon, Gyujei Lee, Dongil Kwon, Yu-hwan Kim, Kwang-Yoo Byun

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Thermal copper pillar bump, Stress (mechanics), Materials science, Reliability (semiconductor), business.industry, Residual stress, Microelectronics, Structural engineering, Integrated circuit packaging, business, Focused ion beam, Finite element method

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14a290eaea82c95c0fc222fddd2cde7a
https://doi.org/10.1109/ectc.2011.5898700

المؤلفون: Gyujei Lee, Kwang Yoo Byun, Dongil Kwon, Ho Young Son, Joon Ki Hong

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Yield (engineering), Materials science, Residual stress, Plating, Indentation, Delamination, Grain boundary, Dielectric, Composite material, Thermal expansion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::19dbbb458dced9274f83398d36c2ae0e
https://doi.org/10.1109/ectc.2010.5490902

المؤلفون: Dongil Kwon, Jae-Sung Oh, Kwang-Yoo Byun, Seung-Kyun Kang, Gyujei Lee

المصدر: MRS Proceedings. 1159

مصطلحات موضوعية: Materials science, business.industry, Adhesion, Elastomer, Viscoelasticity, Characterization (materials science), Hysteresis, Indentation, visual_art, visual_art.visual_art_medium, Microelectronics, Ceramic, Composite material, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::56ab66472ae7648e2992e704b8039424
https://doi.org/10.1557/proc-1159-g06-05