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1Academic Journal
المؤلفون: Ming-Feng Wu, Kwang-Lung Lin
المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 2414-2423 (2024)
مصطلحات موضوعية: Twin, Dislocation, Resistivity, Microhardness, EBSD, TEM, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2Academic Journal
المؤلفون: Wen-Chieh Tsai, Kwang-Lung Lin
المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-7 (2022)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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3Academic Journal
المؤلفون: Wen‑Chieh Tsai, Kwang‑Lung Lin
المصدر: Scientific Reports, Vol 12, Iss 1, Pp 1-2 (2022)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
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4Academic Journal
المؤلفون: Yi-Han Liao, Chien-Lung Liang, Kwang-Lung Lin, Albert T. Wu
المصدر: AIP Advances, Vol 5, Iss 12, Pp 127210-127210-6 (2015)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2158-3226
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5Academic Journal
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6Academic Journal
المؤلفون: Jenn-Ming Song, Kwang-Lung Lin, Nai-Shuo Liu
المصدر: MATERIALS TRANSACTIONS. 2004, 45(3):776
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7Academic Journal
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8Conference
المؤلفون: Chih-Yu, Wang, Kwang-Lung, Lin
المصدر: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) ; page 1-8
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9
المؤلفون: Chien Lung Liang, Yi Han Liao, Albert T. Wu, Chang Hsien Chen, Kwang-Lung Lin
المصدر: Acta Materialia. 200:200-210
مصطلحات موضوعية: 010302 applied physics, Diffraction, Materials science, Polymers and Plastics, Metals and Alloys, 02 engineering and technology, 021001 nanoscience & nanotechnology, Microstructure, 01 natural sciences, Electromigration, Electronic, Optical and Magnetic Materials, Crystal, Crystallinity, Electrical resistance and conductance, Transmission electron microscopy, 0103 physical sciences, Ceramics and Composites, Composite material, Dislocation, 0210 nano-technology, High-resolution transmission electron microscopy
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10
المؤلفون: Kwang-Lung Lin, Jeng Chi Lin, Chien Lung Liang
المصدر: Journal of Materials Science: Materials in Electronics. 31:19318-19331
مصطلحات موضوعية: 010302 applied physics, Materials science, Alloy, Intermetallic, engineering.material, Condensed Matter Physics, Microstructure, 01 natural sciences, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Soldering, 0103 physical sciences, Ultimate tensile strength, engineering, Electrical and Electronic Engineering, Composite material, Embrittlement, Tensile testing, Solid solution
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11
المؤلفون: Shan-Bo Wang, An-Hsuan Hsu, Chin-Li Kao, David Tarng, Chien-Lung Liang, Kwang-Lung Lin
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
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12
المؤلفون: Rui-Gang Chen, Chien-Lung Liang, Kwang-Lung Lin
المصدر: SSRN Electronic Journal.
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13
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14
المؤلفون: Wen-Chieh Tsai, Kwang-Lung Lin
المصدر: Scientific reports. 12(1)
مصطلحات موضوعية: Multidisciplinary, Silver, Dendrites
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15
المؤلفون: Che Wei Chang, Kwang-Lung Lin
المصدر: Journal of Materials Science: Materials in Electronics. 30:13090-13098
مصطلحات موضوعية: Materials science, Intermetallic, Nanoindentation, Condensed Matter Physics, Microstructure, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Shear (sheet metal), Phase (matter), Soldering, Shear strength, Electrical and Electronic Engineering, Composite material, Eutectic system
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16
المؤلفون: Chien Lung Liang, Kwang-Lung Lin
المصدر: Journal of Alloys and Compounds. 789:336-344
مصطلحات موضوعية: Supersaturation, Materials science, Mechanical Engineering, Metals and Alloys, Analytical chemistry, Electromigration, Cathode, Anode, law.invention, Mechanics of Materials, law, Scanning transmission electron microscopy, Materials Chemistry, Grain boundary diffusion coefficient, Crystallite, Single crystal
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17
المؤلفون: Min-Lung Huang, I-Ting Lin, Sheng-Wen Yang, Min-Yan Tsai, Chien-Lung Liang, Jen-Kuang Fang, Kwang-Lung Lin, Yung-Sheng Lin
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Surface diffusion, Void (astronomy), Materials science, Grain boundary diffusion coefficient, Grain boundary, Composite material, Microstructure, Current density, Electromigration, Hillock
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18
المؤلفون: Kwang-Lung Lin
المصدر: 3D Microelectronic Packaging ISBN: 9789811570896
3D Microelectronic Packaging ISBN: 9783319445847مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Packaging engineering, business.industry, Metallurgy, Mechanical engineering, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Form factor (design), Substrate (building), Soldering, Ball grid array, 0103 physical sciences, Microelectronics, Bumping, 0210 nano-technology, business
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19
المؤلفون: Yung-Sheng Lin, Chin-Li Kao, Shan-Bo Wang, Yun-Ching Hung, Chien-Lung Liang, Kwang-Lung Lin, David Tarng
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Open-circuit voltage, Direct current, Current crowding, Oxide, Electromigration, Cathode, law.invention, chemistry.chemical_compound, chemistry, law, Composite material, Current density, Polyimide
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20
المؤلفون: Chien Lung Liang, Kwang-Lung Lin
المصدر: Materials Letters. 236:607-610
مصطلحات موضوعية: Materials science, Mechanical Engineering, Nucleation, Intermetallic, Current crowding, Recrystallization (metallurgy), Thermodynamics, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Electromigration, 0104 chemical sciences, Amorphous solid, Mechanics of Materials, Stress relaxation, General Materials Science, Crystallite, 0210 nano-technology