المؤلفون: Kuchhangi, Ankit

مصطلحات موضوعية: Materials Science, Electrical engineering, III-V reconstitution, large diameter III-V wafer, thermocompression bonding

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/0277d0xz

المؤلفون: Shin, Jiwon, Woo, Kwangbok, Kwon, Donguk, Kim, Youngja, Lee, Youngmin, Kang, Dongwoo, Sahoo, Krutikesh, Ren, Haoxiang, Huang, Yu-Pei, Shah, Ujash, Yang, Yutao, Kuchhangi, Ankit, Iyer, Subramanian S.

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc51906.2022.00187
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816580.pdf?arnumber=9816580