المؤلفون: Ko, Cheng-Ta, 柯正達

Thesis Advisors: Chen, Kuan-Neng, 陳冠能

وصف الملف: 160

الاتاحة: http://ndltd.ncl.edu.tw/handle/71917281298790432507

المؤلفون: Lau, John, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Beica, Rozalia, Wee, Koh Sau, Li, Ming, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Yang, Lei, Li, Margie, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ; page 1574-1582

الاتاحة: https://doi.org/10.1109/ectc.2018.00239
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429752.pdf?arnumber=8429752

المؤلفون: Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 13, issue 9, page 1371-1379 ; ISSN 2156-3950 2156-3985

الاتاحة: http://dx.doi.org/10.1109/tcpmt.2023.3305099
http://xplorestaging.ieee.org/ielx7/5503870/10287668/10217014.pdf?arnumber=10217014

المؤلفون: Chen, Yu-Hua, Lin, Puru Bruce, Ko, Cheng-Ta, Tseng, Tzyy-Jang

المصدر: 2017 International Conference on Electronics Packaging (ICEP) ; page 16-18

الاتاحة: https://doi.org/10.23919/icep.2017.7939313
http://xplorestaging.ieee.org/ielx7/7934495/7939302/07939313.pdf?arnumber=7939313

المؤلفون: Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ; page 885-894

الاتاحة: http://dx.doi.org/10.1109/ectc32696.2021.00148
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501834.pdf?arnumber=9501834

المؤلفون: Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc32696.2021.00067
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501612.pdf?arnumber=9501612

المؤلفون: Peng, Chia-Yu, Lin, Puru Bruce, Ko, Cheng-Ta, Wang, Chi-Wei, Chuang, Oscar, Lee, Chang-Chun

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc32862.2020.00089
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159474.pdf?arnumber=9159474

المؤلفون: Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Lin, Curry, Chang, Chieh Lin, Pan, Jhih Yuan, Wu, Hsing Hui, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Lo, Penny, So, R., Chen, Y. H., Fan, Nelson, Kuah, Eric, Lin, Marc, Cheung, Y. M., Ng, Eric, Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Tao, Mian, Lo, Chi Chuen, Lee, Shi-wei

Relation: http://repository.ust.hk/ir/Record/1783.1-100393; Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20; https://doi.org/10.1109/ECTC.2019.00010; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=14&rft.aulast=Ko&rft.aufirst=C.-T.&rft.atitle=Feasibility+study+of+fan-out+panel-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-85072272707&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500003

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-100393
https://doi.org/10.1109/ECTC.2019.00010
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=14&rft.aulast=Ko&rft.aufirst=C.-T.&rft.atitle=Feasibility+study+of+fan-out+panel-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-85072272707&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500003