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المؤلفون: Lau, John, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y.M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Beica, Rozalia, Wee, Koh Sau, Li, Ming, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lee, N.C., Ko, Cheng-Ta, Yang, Henry, Chen, Y.H., Tao, Mian, Lo, Jeffery, Lee, Ricky, Yang, Lei, Li, Margie, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ; page 1574-1582
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3Academic Journal
المؤلفون: Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 13, issue 9, page 1371-1379 ; ISSN 2156-3950 2156-3985
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4Conference
المؤلفون: Chen, Yu-Hua, Lin, Puru Bruce, Ko, Cheng-Ta, Tseng, Tzyy-Jang
المصدر: 2017 International Conference on Electronics Packaging (ICEP) ; page 16-18
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5Conference
المؤلفون: Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ; page 885-894
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6Conference
المؤلفون: Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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7ConferenceA Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous Integrated Packages
المؤلفون: Peng, Chia-Yu, Lin, Puru Bruce, Ko, Cheng-Ta, Wang, Chi-Wei, Chuang, Oscar, Lee, Chang-Chun
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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19Conference
المؤلفون: Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Lin, Curry, Chang, Chieh Lin, Pan, Jhih Yuan, Wu, Hsing Hui, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Lo, Penny, So, R., Chen, Y. H., Fan, Nelson, Kuah, Eric, Lin, Marc, Cheung, Y. M., Ng, Eric, Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Tao, Mian, Lo, Chi Chuen, Lee, Shi-wei
Relation: http://repository.ust.hk/ir/Record/1783.1-100393; Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20; https://doi.org/10.1109/ECTC.2019.00010; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=14&rft.aulast=Ko&rft.aufirst=C.-T.&rft.atitle=Feasibility+study+of+fan-out+panel-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-85072272707&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500003
الاتاحة: http://repository.ust.hk/ir/Record/1783.1-100393
https://doi.org/10.1109/ECTC.2019.00010
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=14&rft.aulast=Ko&rft.aufirst=C.-T.&rft.atitle=Feasibility+study+of+fan-out+panel-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-85072272707&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500003 -
20Conference
المؤلفون: Lau, John, Li, Ming, Xu, Iris, Chen, Tony, Tan, Kim Hwee, Li, Zhang, Fan, Nelson, Kuah, Eric, So, Raymond, Lo, Penny, Cheung, Y. M., Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, N.C., Ko, Cheng Ta, Yang, Henry, Chen, Y. H., Tao, Mian, Lo, Chi Chuen, Lee, Shi-wei
مصطلحات موضوعية: EMC, FOWLP, Heterogeneous integration, RDLs
Relation: http://repository.ust.hk/ir/Record/1783.1-100394; Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811333, p. 903-909; https://doi.org/10.1109/ECTC.2019.00141; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=903&rft.aulast=Lau&rft.aufirst=J.&rft.atitle=Feasibility+study+of+fan-out+wafer-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-85072270021&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500134
الاتاحة: http://repository.ust.hk/ir/Record/1783.1-100394
https://doi.org/10.1109/ECTC.2019.00141
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2019-May&rft.issue=&rft.date=2019&rft.spage=903&rft.aulast=Lau&rft.aufirst=J.&rft.atitle=Feasibility+study+of+fan-out+wafer-level+packaging+for+heterogeneous+integrations&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-85072270021&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000503261500134