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1Academic JournalOrganizational resilience: leadership, operational and individual responses to the COVID-19 pandemic
المؤلفون: Kim, Jungsik, Lee, Hun Whee, Chung, Goo Hyeok
المصدر: Journal of Organizational Change Management, 2023, Vol. 37, Issue 1, pp. 92-115.
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2Academic Journal
المؤلفون: Suh, Minki, Ryu, Minsang, Ha, Jonghyeon, Bang, Minji, Lee, Dabok, Lee, Hojoon, Sagong, Hyunchul, Kim, Jungsik
المساهمون: IC Design Education Center, Leaders in INdustry-university Cooperation 3.0, National Research Foundation of Korea
المصدر: IEEE Access ; volume 12, page 155119-155124 ; ISSN 2169-3536
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3Academic Journal
المؤلفون: Bang, Minji, Ha, Jonghyeon, Suh, Minki, Lee, Dabok, Ryu, Minsang, Han, Jin-Woo, Sagong, Hyunchul, Lee, Hojoon, Kim, Jungsik
المساهمون: Electronic Design Automation (EDA) Tool Program of the IC Design Education Center (IDEC), Republic of Korea, National Research Foundation of Korea (NRF) through the Korean Government, “Leaders in Industry-university Cooperation 3.0” Project through the Ministry of Education and National Research Foundation of Korea
المصدر: IEEE Access ; volume 12, page 130347-130355 ; ISSN 2169-3536
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4Academic Journal
المؤلفون: Ahn, Seok Hwan, Kim, Jungsik, Amanov, Auezhan
المساهمون: Tampere University, Materials Science and Environmental Engineering
مصطلحات موضوعية: 216 Materials engineering
وصف الملف: fulltext
Relation: 1037; 14; https://trepo.tuni.fi/handle/10024/160787
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5Academic Journal
المؤلفون: Lee, Gyeongyeop, Suh, Minki, Ryu, Minsang, Lee, Yunjong, Han, Jin-Woo, Kim, Jungsik
المساهمون: Electronic Design Automation (EDA) Tool Program of the IC Design Education Center (IDEC), Republic of Korea, “Leaders in INdustry-university Cooperation 3.0”, Ministry of Education and the National Research Foundation of Korea
المصدر: IEEE Access ; volume 11, page 97456-97465 ; ISSN 2169-3536
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6Academic Journal
المؤلفون: Ahn, Seok-Hwan, Kim, Jungsik, Amanov, Auezhan
المصدر: Metals (2075-4701); Sep2024, Vol. 14 Issue 9, p1037, 17p
مصطلحات موضوعية: HEAT treatment, CORROSION resistance, TRIBOLOGY, SURFACE morphology, STEEL
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7Academic Journal
المؤلفون: Yoon, Gilsang, Ko, Donghyun, Park, Jounghun, Kim, Donghwi, Kim, Jungsik, Lee, Jeong-Soo
المساهمون: Samsung Electronics Company Ltd., BK21 FOUR Program
المصدر: IEEE Access ; volume 10, page 62423-62428 ; ISSN 2169-3536
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8Periodical
المؤلفون: Park, Jounghun, Yoon, Gilsang, Go, Donghyun, Kim, Donghwi, Chul Sagong, Hyun Chul, Kim, Jungsik, Lee, Jeong-Soo
المصدر: IEEE Transactions on Electron Devices; October 2024, Vol. 71 Issue: 10 p6040-6048, 9p
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9Academic Journal
المؤلفون: Kim, Donghwi, Yoon, Gilsang, Go, Donghyun, Park, Jounghun, Kim, Jungsik, Lee, Jeong-Soo
المساهمون: Samsung-POSTECH Research Center (SPRC) through Samsung Electronics, National Research and Development Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT
المصدر: IEEE Transactions on Electron Devices ; volume 71, issue 8, page 4644-4648 ; ISSN 0018-9383 1557-9646
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10Academic Journal
المؤلفون: Bae, Hagyoul, Lee, Geon Bum, Yoo, Jaewook, Lee, Khwang-Sun, Ku, Ja-Yun, Kim, Kihyun, Kim, Jungsik, Ye, Peide D., Park, Jun-Young, Choi, Yang-Kyu
المساهمون: Jeonbuk National University, Ministry of Education, National Research Foundation of Korea, National Research Foundation, Siemens EDA, Ministry of Science, ICT and Future Planning
المصدر: Solid-State Electronics ; volume 215, page 108882 ; ISSN 0038-1101
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11Academic Journal
المؤلفون: Kim, Kihyun, Kim, Jungsik
المساهمون: National Research Foundation of Korea
المصدر: AIP Advances ; volume 11, issue 2 ; ISSN 2158-3226
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12Academic Journal
المؤلفون: Park, Iksoo, Choi, Jaeyong, Kim, Jungsik, Kong, Byoung Don, Lee, Jeong-Soo
المصدر: Micromachines; Apr2024, Vol. 15 Issue 4, p481, 7p
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13Conference
المؤلفون: Park, Jounghun, Yoon, Gilsang, Go, Donghyun, Kim, Donghwi, An, Ukju, Kim, Jongwoo, Kim, Jungsik, Lee, Jeong-Soo
المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS)
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14Academic Journal
المؤلفون: Lee, Hong, Kim, Jungsik, Ryu, Yeonjae
المصدر: Journal of Creative Behavior. Jun 2015 49(2):77-93.
Peer Reviewed: Y
Page Count: 17
Descriptors: Theories, Creativity, Measures (Individuals), Comparative Analysis, Factor Analysis
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15Conference
المؤلفون: LEE, JEONG SOO, PARK, IKSOO, KIM, JUNGSIK, LEE, DONGHUN
المساهمون: LEE, JEONG SOO, PARK, IKSOO, KIM, JUNGSIK, LEE, DONGHUN
Relation: 제29회 한국반도체학술대회; https://oasis.postech.ac.kr/handle/2014.oak/116298; 66291
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16Conference
المؤلفون: LEE, JEONG SOO, GO, DONG HYUN, YOON, GIL SANG, PARK, JOUNG HUN, KIM, JUNGSIK
المساهمون: LEE, JEONG SOO, GO, DONG HYUN, YOON, GIL SANG, PARK, JOUNG HUN, KIM, JUNGSIK
Relation: 제29회 한국반도체학술대회; https://oasis.postech.ac.kr/handle/2014.oak/110330; 61913
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17Conference
المؤلفون: LEE, JEONG SOO, KIM, DONGHWI, GILSANG, YOON, GO, DONGHYUN, PARK, JOUNG HUN, KIM, JUNGSIK
المساهمون: LEE, JEONG SOO, KIM, DONGHWI, GILSANG, YOON, GO, DONGHYUN, PARK, JOUNG HUN, KIM, JUNGSIK
Relation: 제29회 한국반도체학술대회; https://oasis.postech.ac.kr/handle/2014.oak/110329; 61914
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18Academic JournalOrganizational resilience: leadership, operational and individual responses to the COVID-19 pandemic
المؤلفون: Kim, Jungsik, Lee, Hun Whee, Chung, Goo Hyeok
المصدر: Journal of Organizational Change Management ; volume 37, issue 1, page 92-115 ; ISSN 0953-4814
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19Academic Journal
المؤلفون: PARK, JOUNGHUN, HAN, JIN-WOO, YOON, GILSANG, GO, DONGHYUN, KIM, DONGHWI, KIM, JUNGSIK, LEE, JEONG SOO
المساهمون: PARK, JOUNGHUN, YOON, GILSANG, GO, DONGHYUN, KIM, DONGHWI, KIM, JUNGSIK, LEE, JEONG SOO
مصطلحات موضوعية: 3-D NAND flash memory, radiation, single-event upset (SEU), technology-computer-aided design (TCAD) simulation
Relation: IEEE Transactions on Electron Devices; Engineering, Electrical & Electronic; Physics, Applied; Engineering; Physics; https://oasis.postech.ac.kr/handle/2014.oak/114629; 51921; IEEE Transactions on Electron Devices, v.69, no.11, pp.6089 - 6094; 000862328900001; 2-s2.0-85139514229
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20Academic Journal
المؤلفون: Go, Donghyun, Yoon, Gilsang, Park, Jounghun, Kim, Donghwi, Kim, Jiwon, Kim, Jungsik, Lee, Jeong-Soo
المصدر: Micromachines; Nov2023, Vol. 14 Issue 11, p2007, 11p