المؤلفون: Khan, Mir-Hamza, Jabar, Sharhid, Hayat, Qamar, Kotadia, Hiren, Khan, Tahir Irfan, Ceglarek, Darek, Franciosa, Pasquale

المصدر: Procedia CIRP ; volume 124, page 478-483 ; ISSN 2212-8271

الاتاحة: https://doi.org/10.1016/j.procir.2024.08.157
https://api.elsevier.com/content/article/PII:S2212827124005110?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S2212827124005110?httpAccept=text/plain

المؤلفون: Khan, Mir-Hamza, Jabar, Sharhid, Hayat, Qamar, Kotadia, Hiren, Khan, Tahir Irfan, Ceglarek, Darek, Franciosa, Pasquale

المصدر: Procedia CIRP; January 2024, Vol. 124 Issue: 1 p478-483, 6p

المؤلفون: Irshad, Hafiz Muzammil, Ahmed, Bilal Anjum, Ehsan, Muhammad Ali, Khan, Tahir Irfan, Laoui, Tahar, Yousaf, Muhammad Rizwan, Ibrahim, Ahmed, Hakeem, Abbas Saeed

المساهمون: KFUPM

المصدر: Ceramics International ; volume 43, issue 14, page 10645-10653 ; ISSN 0272-8842

الاتاحة: http://dx.doi.org/10.1016/j.ceramint.2017.05.325
https://api.elsevier.com/content/article/PII:S0272884217311653?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0272884217311653?httpAccept=text/plain

المؤلفون: Adeniyi, Adedayo Sheriff, Ahmed, Bilal Anjum, Hakeem, Abbas Saeed, Patel, Faheemuddin, Bakare, Akolade Idris, Ul-Hamid, Anwar, Khan, Amir Azam, Ehsan, Muhammad Ali, Khan, Tahir Irfan

المصدر: Nanomaterials (2079-4991); Dec2019, Vol. 9 Issue 12, p1682-1682, 1p

مصطلحات موضوعية: THERMAL conductivity, FRACTURE toughness, THERMAL expansion, HARDNESS, LOW temperatures