المؤلفون: Sai Liu, Farid E. Mohamed Ghazali, Jingjing Yang, Zongkang Guo, Kejun Zeng, Yixing Chen

المصدر: Buildings, Vol 14, Iss 12, p 3904 (2024)

مصطلحات موضوعية: EnergyPlus, windows, building energy simulation, economic analysis, Building construction, TH1-9745

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-5309/14/12/3904; https://doaj.org/toc/2075-5309

URL الوصول: https://doaj.org/article/ca023037ecc54b769ef062f428de6a54

المؤلفون: Fanghan Su, Zhiyuan Wang, Yue Yuan, Chengcheng Song, Kejun Zeng, Yixing Chen, Rongpeng Zhang

المصدر: Sustainability, Vol 15, Iss 14759, p 14759 (2023)

مصطلحات موضوعية: ice storage system, shopping malls, system operation, scheme optimization, peak shaving, building simulation, Environmental effects of industries and plants, TD194-195, Renewable energy sources, TJ807-830, Environmental sciences, GE1-350

Relation: https://www.mdpi.com/2071-1050/15/20/14759; https://doaj.org/toc/2071-1050; https://doaj.org/article/2d8ff6404ee24d69825092777a7eccdc

الاتاحة: https://doi.org/10.3390/su152014759
https://doaj.org/article/2d8ff6404ee24d69825092777a7eccdc

المؤلفون: Yuhui Yang, Siman Shen, Yin Cai, Kejun Zeng, Keyu Liu, Simeng Li, Lanfen Zeng, Linming Chen, Jing Tang, Zhe Hu, Zhengyuan Xia, Liangqing Zhang

المصدر: Oxidative Medicine and Cellular Longevity, Vol 2021 (2021)

مصطلحات موضوعية: Cytology, QH573-671

Relation: http://dx.doi.org/10.1155/2021/5537804; https://doaj.org/toc/1942-0900; https://doaj.org/toc/1942-0994; https://doaj.org/article/b04dd8d40c0f48cda2998e0e93842a5d

الاتاحة: https://doi.org/10.1155/2021/5537804
https://doaj.org/article/b04dd8d40c0f48cda2998e0e93842a5d

المؤلفون: Jing Tang, Keyu Liu, Yin Cai, Linming Chen, Zhengyuan Xia, Liangqing Zhang, Zhe Hu, Kejun Zeng, Simeng Li, Yuhui Yang, Lanfen Zeng, Siman Shen

المصدر: Oxidative Medicine and Cellular Longevity, Vol 2021 (2021)
Oxidative Medicine and Cellular Longevity

مصطلحات موضوعية: Male, Untranslated region, Aging, Adenosine, Article Subject, Biology, Biochemistry, Mice, chemistry.chemical_compound, Animals, Myocytes, Cardiac, RNA, Messenger, Messenger RNA, Heart development, QH573-671, Gene Expression Regulation, Developmental, RNA, Heart, Cell Biology, General Medicine, Methylation, Cardiac chamber formation, Cell biology, Mice, Inbred C57BL, chemistry, DNA methylation, N6-Methyladenosine, Cytology, Research Article

وصف الملف: text/xhtml

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9592f1acaec4a472c83b3c011f57ce9c
https://doaj.org/article/b04dd8d40c0f48cda2998e0e93842a5d

المؤلفون: Qinghai Meng, Kai Nie, Kejun Zeng

المصدر: 2020 Chinese Automation Congress (CAC).

مصطلحات موضوعية: Decision support system, business.industry, Computer science, media_common.quotation_subject, 010401 analytical chemistry, Knowledge engineering, Two-graph, ComputerApplications_COMPUTERSINOTHERSYSTEMS, 02 engineering and technology, Link (geometry), Ontology (information science), 021001 nanoscience & nanotechnology, 01 natural sciences, Measure (mathematics), 0104 chemical sciences, Knowledge graph, Feature (machine learning), Quality (business), Artificial intelligence, 0210 nano-technology, business, media_common

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9361fecb4eeed7c47032b39d3b85f3fb
https://doi.org/10.1109/cac51589.2020.9327031

المؤلفون: Jaimal Williamson, Kejun Zeng

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 021001 nanoscience & nanotechnology, 01 natural sciences, Copper, chemistry, Plating, Ball grid array, 0103 physical sciences, Composite material, 0210 nano-technology, Electroplating, Layer (electronics), Carbon

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::52d387a56014bafaf0165fe7d9e83a9b
https://doi.org/10.1109/ectc.2018.00031

المؤلفون: Laura May Antoinette Dela Paz Clemente, Amit Nangia, Kejun Zeng

المصدر: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, business.product_category, 020208 electrical & electronic engineering, Metallurgy, chemistry.chemical_element, 02 engineering and technology, Electrolyte, 01 natural sciences, Copper, Pulmonary surfactant, chemistry, Chemical engineering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Die (manufacturing), Chelation, High current, business, Deposition (law), Palladium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::89f4ab881c3867cfac902a1066720f42
https://doi.org/10.1109/eptc.2016.7861490

المؤلفون: Becky Holdford, Kejun Zeng, Mike Pierce, Hiroshi Miyazaki

المصدر: Journal of Electronic Materials. 41:253-261

مصطلحات موضوعية: Materials science, Metallurgy, Intermetallic, Electronic packaging, Solder paste, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Cracking, Reliability (semiconductor), Soldering, Ball grid array, Materials Chemistry, Electrical and Electronic Engineering, Joint (geology)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cfdd99cedf8da5b0f1480e728256f55d
https://doi.org/10.1007/s11664-011-1732-8

المؤلفون: H. W. Tseng, Yee Wen Yen, Kejun Zeng, Shijie Wang, Cheng Yi Liu

المصدر: Journal of Electronic Materials. 38:2257-2263

مصطلحات موضوعية: Solid-state physics, Chemistry, Analytical chemistry, chemistry.chemical_element, Electron microprobe, Condensed Matter Physics, Copper, Electronic, Optical and Magnetic Materials, Cross interaction, Field electron emission, Crystallography, Phase (matter), Materials Chemistry, Electrical and Electronic Engineering, Ternary operation, FOIL method

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e1adc9ef793fd4ae57acdb443d58e0f
https://doi.org/10.1007/s11664-009-0920-2

المؤلفون: Shengquan Ou, Kejun Zeng, Rajiv Dunne, King-Ning Tu, Yuhuan Xu

المصدر: Journal of Materials Research. 23:1482-1487

مصطلحات موضوعية: Materials science, Impact toughness, Mechanical Engineering, Metallurgy, Condensed Matter Physics, Fracture failure, Mechanics of Materials, Interfacial fracture, Soldering, Ball grid array, Impact energy, General Materials Science, Composite material, Ball shear, Eutectic system

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f20bc154837ca555467b1419500ba27
https://doi.org/10.1557/jmr.2008.0186

المؤلفون: Kejun Zeng

المصدر: Proceedings of the6th International Conference on Mechatronics, Materials, Biotechnology and Environment (ICMMBE 2016).

مصطلحات موضوعية: 0209 industrial biotechnology, Computer science, business.industry, De noising, 020206 networking & telecommunications, 02 engineering and technology, Signal, Adaptive filter, Vibration, 020901 industrial engineering & automation, Telemetry, Kernel (statistics), 0202 electrical engineering, electronic engineering, information engineering, Kernel adaptive filter, Electronic engineering, Computer vision, Artificial intelligence, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4ed37df2ba66f27085238bce5c28b849
https://doi.org/10.2991/icmmbe-16.2016.86

المؤلفون: Amit Nangia, Kejun Zeng

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Wire bonding, Materials science, Mold, Metallurgy, medicine, Clean environment, medicine.disease_cause, Microstructure, Chloride, medicine.drug, Corrosion, Ion, Crevice corrosion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c5cae91f716c8dbd2364fcad1e5e2954
https://doi.org/10.1109/ectc.2015.7159808

المؤلفون: Masood Murtuza, Roger J. Stierman, Kejun Zeng, Don Abbott

المصدر: JOM. 58:75-79

مصطلحات موضوعية: Electroless nickel, Materials science, Soldering, Metallurgy, General Engineering, Galvanic cell, Immersion (virtual reality), General Materials Science, Microstructure

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::31767307011f495e5f028de9fae5eb08
https://doi.org/10.1007/s11837-006-0187-5

المؤلفون: Vesa Vuorinen, Jorma Kivilahti, Kejun Zeng

المصدر: IEEE Transactions on Electronics Packaging Manufacturing. 25:162-167

مصطلحات موضوعية: Materials science, Phosphide, Metallurgy, Intermetallic, engineering.material, Microstructure, Industrial and Manufacturing Engineering, chemistry.chemical_compound, Coating, chemistry, Electron diffraction, Soldering, Scanning transmission electron microscopy, engineering, Metallizing, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fe714c1a96a8835dba4201329366c9b2
https://doi.org/10.1109/tepm.2002.801648

المؤلفون: H. Balkan, King-Ning Tu, F. Zhang, W. T. Chen, Kejun Zeng, P. Elenius, M. Li

المصدر: Journal of Materials Research. 17:1612-1621

مصطلحات موضوعية: Materials science, Mechanical Engineering, Metallurgy, Intermetallic, Condensed Matter Physics, Microstructure, Mechanics of Materials, Soldering, General Materials Science, Thin film, Layer (electronics), Dissolution, Eutectic system, Phase diagram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3d867df9f7adfce0438bbd8bf28ac170
https://doi.org/10.1557/jmr.2002.0239

المؤلفون: King-Ning Tu, Kejun Zeng

المصدر: Materials Science and Engineering: R: Reports. 38:55-105

مصطلحات موضوعية: Surface-mount technology, Materials science, Reliability (semiconductor), Mechanics of Materials, Whisker, Mechanical Engineering, Soldering, Metallurgy, Electronic packaging, General Materials Science, Microstructure, Electromigration, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1e23a4c7f3c197bf230fa78b7b673f1b
https://doi.org/10.1016/s0927-796x(02)00007-4

المؤلفون: Jorma K. Kivilahti, Iikka Suni, Tomi Laurila, Jyrki Molarius, Kejun Zeng

المصدر: Laurila, T, Zeng, K, Kivilahti, J K, Molarius, J & Suni, I 2002, ' TaC as a diffusion barrier between Si and Cu ', Journal of Applied Physics, vol. 91, no. 8, pp. 5391-5399 . https://doi.org/10.1063/1.1464652

مصطلحات موضوعية: Materials science, Diffusion barrier, tantalum, Scanning electron microscope, Analytical chemistry, General Physics and Astronomy, rutherford backscattering, metallization, law.invention, Barrier layer, semiconductor device metallisation, law, transmission electron microscopy, diffusion barriers, Crystallization, tantalum carbide, thermodynamic properties, silicon, Microstructure, Rutherford backscattering spectrometry, failure analysis, Amorphous solid, tantalum pentoxide, x-ray diffraction, Transmission electron microscopy, copper, annealing, phase diagrams, scanning electron microscopy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f73e7569e56ed83a05de68cdcfed7b9
https://doi.org/10.1063/1.1464652

المؤلفون: J. W. Jang, T. Y. Lee, Kejun Zeng, King-Ning Tu, S. M. Kuo, D. R. Frear, W. J. Choi, J. K. Lin, Jorma Kivilahti

المصدر: Journal of Materials Research. 17:291-301

مصطلحات موضوعية: Materials science, Morphology (linguistics), Mechanical Engineering, Kinetics, Metallurgy, Intermetallic, Activation energy, Condensed Matter Physics, Mechanics of Materials, Soldering, Phase (matter), General Materials Science, Wetting, Eutectic system

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b86df2f56d4c8b79358fb2eefceb2ac0
https://doi.org/10.1557/jmr.2002.0042

المؤلفون: Kejun Zeng, Tommi Riekkinen, Tomi Laurila, Jorma K. Kivilahti, Jyrki Molarius, Ilkka Suni

المصدر: Laurila, T, Zeng, K, Molarius, J, Riekkinen, T, Suni, I & Kivilahti, J K 2002, ' Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems ', Microelectronic Engineering, vol. 64, no. 1-4, pp. 279-287 . https://doi.org/10.1016/S0167-9317(02)00800-6

مصطلحات موضوعية: Materials science, Diffusion barrier, tantalum, Analytical chemistry, Tantalum, chemistry.chemical_element, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Amorphous solid, Secondary ion mass spectrometry, chemistry.chemical_compound, chemistry, Transmission electron microscopy, copper metallisation, diffusion barriers, Electrical and Electronic Engineering, Ternary operation, phase diagrams, tantalum carbide, Tantalum carbide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b55fdee16aec824f5ae5b06f2db39b3c
https://doi.org/10.1016/S0167-9317(02)00800-6

المؤلفون: Amit Nangia, Kejun Zeng

المصدر: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Stress (mechanics), Printed circuit board, Materials science, Chip-scale package, Soldering, Metallurgy, Solder paste, Wafer, Temperature cycling, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e38552d495e65c77cfb0729d61d9d097
https://doi.org/10.1109/eptc.2014.7028401