المؤلفون: Francesca Ruccia, MD, FRCS (Plast), Rami Elmorsi, MD, Karthikeyan Dhandapani, MBBS, MRCS, Mohammad Alzaid, Zaira Bailón-Valdez, MD, MSc(c), Iin Tammasse, MD, Ankur Khajuria, BSc (Hons), MBBS (Dist.), FHEA, FRSPH, MRCS, MAcadMEd, MFSTEd, MSc (Oxford), PhD

المصدر: Plastic and Reconstructive Surgery, Global Open, Vol 12, Iss 8, p e6033 (2024)

مصطلحات موضوعية: Surgery, RD1-811

وصف الملف: electronic resource

Relation: http://journals.lww.com/prsgo/fulltext/10.1097/GOX.0000000000006033; https://doaj.org/toc/2169-7574

URL الوصول: https://doaj.org/article/c7fc84257e7f48b7afdcb76d8f25ffd3

المؤلفون: Kannan, Deeba, Amutha, Balakrishnan, Dasarathan, Sattianadan, Salomi Victoria, Daniel Rosy, Maheshkar, Vikas, Ramkumar, Ravindran, Karthikeyan, Dhandapani

المصدر: Indonesian Journal of Electrical Engineering and Computer Science; Vol 33, No 3: March 2024; 1748-1759 ; 2502-4760 ; 2502-4752 ; 10.11591/ijeecs.v33.i3

مصطلحات موضوعية: Back propagation network, Disease forecast, Machine learning models, Plant diseases, XGBoost

وصف الملف: application/pdf

Relation: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/35324/18060; https://ijeecs.iaescore.com/index.php/IJEECS/article/view/35324

الاتاحة: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/35324
https://doi.org/10.11591/ijeecs.v33.i3.pp1748-1759

المؤلفون: Kannan, Deeba, Balakrishnan, Amutha, Devi, K. Mekala, Singh, Nagendra, Kiruba, P. Angelin, Ramkumar, Ravindran, Karthikeyan, Dhandapani

المصدر: Bulletin of Electrical Engineering and Informatics; Vol 13, No 3: June 2024; 1667-1675 ; 2302-9285 ; 2089-3191 ; 10.11591/eei.v13i3

مصطلحات موضوعية: image processing, Amended 20% ordinal scale, Disease index, Disease severity index, Image processing techniques, Spread of infection

وصف الملف: application/pdf

Relation: https://beei.org/index.php/EEI/article/view/5432/3759; https://beei.org/index.php/EEI/article/view/5432

الاتاحة: https://beei.org/index.php/EEI/article/view/5432
https://doi.org/10.11591/eei.v13i3.5432

المؤلفون: Deeba, Kannan, Dasarathan, Sattianadan, Kandula, Srinivasa Rao, Sheela, Krishnasamy Selva, Ramkumar, Ravindran, Ashokkumar, Nagarajan, Karthikeyan, Dhandapani

المصدر: Indonesian Journal of Electrical Engineering and Computer Science; Vol 31, No 3: September 2023; 1648-1655 ; 2502-4760 ; 2502-4752 ; 10.11591/ijeecs.v31.i3

مصطلحات موضوعية: Convolutional neural network, Deep learning, Fire detection, Surveillance cameras, Transfer learning

وصف الملف: application/pdf

Relation: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30988/17576; https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30988

الاتاحة: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30988
https://doi.org/10.11591/ijeecs.v31.i3.pp1648-1655

المؤلفون: Karthikeyan, Dhandapani, Kannan, Deeba, Gunasekaran, Brindha, Selvaraj, Hemalatha, Gupta, Saurabh, Ramkumar, Ravindran, Vijayakumar, Krishnasamy

المصدر: Indonesian Journal of Electrical Engineering and Computer Science; Vol 30, No 3: June 2023; 1348-1358 ; 2502-4760 ; 2502-4752 ; 10.11591/ijeecs.v30.i3

مصطلحات موضوعية: Agriculture, Internet of things, Multispectral based nutrient monitoring, Smart irrigation model, Triboelectricity

وصف الملف: application/pdf

Relation: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30808/17381; https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30808

الاتاحة: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/30808
https://doi.org/10.11591/ijeecs.v30.i3.pp1348-1358

المؤلفون: Karthikeyan, Dhandapani, Rajiv Khiani, Simran, Alice Hepzibah, Albert, Jothilingam, Uthayakumar, Ramkumar, Ravindran, Venkadasamy Prathaban, Arumbu, Vijayakumar, Krishnasamy

المصدر: Indonesian Journal of Electrical Engineering and Computer Science; Vol 29, No 3: March 2023; 1268-1280 ; 2502-4760 ; 2502-4752 ; 10.11591/ijeecs.v29.i3

مصطلحات موضوعية: Artificial intelligence, Artificial neural network, NLM, ONLM, Proportional-integral

وصف الملف: application/pdf

Relation: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/28973/17162; https://ijeecs.iaescore.com/index.php/IJEECS/article/view/28973

الاتاحة: https://ijeecs.iaescore.com/index.php/IJEECS/article/view/28973
https://doi.org/10.11591/ijeecs.v29.i3.pp1268-1280

المؤلفون: Prathaban, Arumbu Venkadasamy, Karthikeyan, Dhandapani

المصدر: Indonesian Journal of Electrical Engineering and Computer Science, 26(2), 629-638, (2022-05-01)

مصطلحات موضوعية: Control algorithms, GWO-RNN, Hybrid MPPT, LUO converter, Photovoltaic system

Relation: oai:zenodo.org:7142443

الاتاحة: https://doi.org/10.11591/ijeecs.v26.i2.pp629-638

المؤلفون: Thamizh Thentral, Ramya Rathakrishnan, Velu Anbalagan, Karthikeyan Dhandapani, Usha Sengamalai, Palanisamy Ramasamy

المصدر: International Journal of Power Electronics and Drive System (IJPEDS), 13(1), 113-121, (2022-03-01)

مصطلحات موضوعية: Adjustable speed drive, Diode rectifier, Direct torque control, Harmonics, Multi-drive system, Shunt active power filter

Relation: oai:zenodo.org:6614028

الاتاحة: https://doi.org/10.11591/ijpeds.v13.i1.pp113-121

المؤلفون: Arumbu Venkadasamy Prathaban, Karthikeyan Dhandapani, Ahamed Ibrahim Soni Abubakar

المصدر: Energies; Volume 15; Issue 8; Pages: 2808

مصطلحات موضوعية: multilevel inverter, module, standing voltage, cascaded structure, reduced power switches

وصف الملف: application/pdf

Relation: F3: Power Electronics; https://dx.doi.org/10.3390/en15082808

الاتاحة: https://doi.org/10.3390/en15082808

المؤلفون: Jagabar Sathik, Shady H. E. Abdel Aleem, Rasoul Shalchi Alishah, Dhafer Almakhles, Kent Bertilsson, Mahajan Sagar Bhaskar, George Fernandez Savier, Karthikeyan Dhandapani

المصدر: Energies; Volume 14; Issue 21; Pages: 7249

مصطلحات موضوعية: multilevel inverter, diode half-bridge circuit, power devices, asymmetric inverter, symmetric inverter

وصف الملف: application/pdf

Relation: A2: Solar Energy and Photovoltaic Systems; https://dx.doi.org/10.3390/en14217249

الاتاحة: https://doi.org/10.3390/en14217249

المؤلفون: Natarajan Venkatachalam, Subrahmanya V. R. K. Rao, Vijay Karthikeyan Dhandapani, Swaminathan Saravanavel

المصدر: International Journal of Chemical, Materials and Biomolecular Sciences, 12.0(12), (2018-11-02)

Relation: https://doi.org/10.5281/zenodo.2022712; https://doi.org/10.5281/zenodo.2022713; oai:zenodo.org:2022713

الاتاحة: https://doi.org/10.5281/zenodo.2022713

المؤلفون: Karthikeyan Dhandapani, Dae-Suk Kim

المصدر: International Symposium on Microelectronics. 2020:000001-000004

مصطلحات موضوعية: Materials science, Soldering, Automotive Engineering, Evaluation methods, Path (graph theory), Mechanical engineering, Temperature cycling, Joint (geology), Reliability (statistics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a5eb8fc8630e1d867da0fea509f7b876
https://doi.org/10.4071/2380-4505-2020.1.000001

المؤلفون: Debabrata Som, Karthikeyan Dhandapani

المصدر: International Journal of Orthopaedics Sciences. 6:284-291

مصطلحات موضوعية: medicine.medical_specialty, Proximal humerus, Modalities, business.industry, medicine, business, Surgery

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ab4c655577ab8879e2bb5c67b2abe2e9
https://doi.org/10.22271/ortho.2020.v6.i1e.1875

المؤلفون: Pavan Rajmane, Ahmer Syed, Mark Schwarz, Karthikeyan Dhandapani

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, System in package, Reliability (semiconductor), business.industry, Computer science, Time to market, New product development, Electronics, business, Finite element method, Die (integrated circuit), Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10f4da10e99d89af2230797a6a2cfd68
https://doi.org/10.1109/ectc32696.2021.00240

المؤلفون: Dhafer Almakhles, Karthikeyan Dhandapani, George Fernandez Savier, Rasoul Shalchi Alishah, Shady H. E. Abdel Aleem, Jagabar Sathik, Mahajan Sagar Bhaskar, Kent Bertilsson

المصدر: Energies, Vol 14, Iss 7249, p 7249 (2021)
Energies; Volume 14; Issue 21; Pages: 7249

مصطلحات موضوعية: Technology, Control and Optimization, Computer science, multilevel inverter, Asymmetric inverter, Energy Engineering and Power Technology, Topology (electrical circuits), Symmetric inverter, Electrical Engineering, Electronic Engineering, Information Engineering, Blocking (statistics), Network topology, Topology, Multilevel inverter, diode half-bridge circuit, Robustness (computer science), Power semiconductor device, Electrical and Electronic Engineering, Elektroteknik och elektronik, Engineering (miscellaneous), Diode, power devices, Renewable Energy, Sustainability and the Environment, asymmetric inverter, symmetric inverter, Power devices, Power (physics), Diode half-bridge circuit, Energy (miscellaneous), Voltage

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac61c47880458a254d1b55999fb5c08c
http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-43820

المؤلفون: Karthikeyan Dhandapani, David Fraser Rae, Brian Roggeman

المصدر: International Symposium on Microelectronics. 2018:000186-000192

مصطلحات موضوعية: 010302 applied physics, Product design, Computer science, 020208 electrical & electronic engineering, ComputerApplications_COMPUTERSINOTHERSYSTEMS, 02 engineering and technology, 01 natural sciences, Original equipment manufacturer, Reliability engineering, System in package, Market segmentation, 0103 physical sciences, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, Reliability (statistics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9fddc44a2763952cf74ebd15da3c686a
https://doi.org/10.4071/2380-4505-2018.1.000186

المؤلفون: Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson

المصدر: International Symposium on Microelectronics. 2017:000325-000330

مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, Chip, 01 natural sciences, law.invention, Printed circuit board, Particle board, law, 0103 physical sciences, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Wafer testing, business, Wafer-level packaging, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048

المؤلفون: Jiantao Zheng, Brian Roggeman, Marcus Hsu, Karthikeyan Dhandapani

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Computer science, Ball grid array, Bandwidth (signal processing), Package on package, Chip, Original equipment manufacturer, Flip chip, Reliability engineering, Data modeling, Test data

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bba61cde7e6213c3ed39f9820a4a39f4
https://doi.org/10.1109/ectc.2018.00248

المؤلفون: Divya Navamani Jayachandran, Karthikeyan Dhandapani, Vijayakumar Krishnaswamy, Lavanya Anbazhagan

المصدر: American Journal of Applied Sciences. 12:766-774

مصطلحات موضوعية: Forward converter, Engineering, Multidisciplinary, business.industry, Buck converter, Voltage divider, Buck–boost converter, Control theory, Dropout voltage, Boost converter, Electronic engineering, Voltage regulation, Voltage source, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b75a7d0c3a04e44488c7b513b63f770a
https://doi.org/10.3844/ajassp.2015.766.774

المؤلفون: Wei Lin, Ahmer Syed, KiWook Lee, Karthikeyan Dhandapani

المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001603-001621

مصطلحات موضوعية: Stress (mechanics), Substrate (building), Engineering drawing, Yield (engineering), Materials science, Residual stress, Flow (psychology), Process (computing), Mechanical engineering, Pharmacology (medical), Finite element method, Die (integrated circuit)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::291ca745917a505e0d8b9bcf00213ada
https://doi.org/10.4071/2013dpc-wp31