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1Conference
المؤلفون: Bohl, Lennart P. P. B., Scharff, Katharina, Duan, Xiaomin, Kaller, Dierk, Schuster, Christian
مصطلحات موضوعية: Bayesian optimization, Continuous-Time Linear Equalizer, Crosstalk, Single-Bit Response, 600: Technology
Relation: 27th IEEE Workshop on Signal and Power Integrity, SPI 2023; IEEE Workshop on Signal and Power Integrity (SPI 2023); 979-835033282-7; https://hdl.handle.net/11420/42520; 2-s2.0-85163303483
الاتاحة: https://hdl.handle.net/11420/42520
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7Conference
المؤلفون: Rimolo Donadio, Renato, Winkel, Thomas Michael, Kaller, Dierk, Harrer, Hubert, Bruns, Heinz Dietrich, Schuster, Christian, SIVIERO, CLAUDIO
المساهمون: Rimolo Donadio, Renato, Winkel, Thomas Michael, Siviero, Claudio, Kaller, Dierk, Harrer, Hubert, Bruns, Heinz Dietrich, Schuster, Christian
مصطلحات موضوعية: Computer Networks and Communication, Signal Processing
وصف الملف: ELETTRONICO
Relation: info:eu-repo/semantics/altIdentifier/isbn/9781457704673; info:eu-repo/semantics/altIdentifier/wos/WOS:000299281100012; ispartofbook:2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings; 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011; firstpage:51; lastpage:54; numberofpages:4; http://hdl.handle.net/11583/2660751; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-79960908716
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8Academic Journal
المؤلفون: Rimolo-Donadio, Renato, Winkel, Thomas Michael, Siviero, Claudio, Kaller, Dierk, Harrer, Hubert, Brüns, Heinz-Dietrich, Schuster, Christian
مصطلحات موضوعية: 600: Technik, 620: Ingenieurwissenschaften
Relation: 15th IEEE Workshop on Signal Propagation on Interconnects, SPI 2011; 2011 15th IEEE Workshop on Signal Propagation on Interconnects (SPI)$d8 - 11 May 2011, Naples, Italy. - Seite 51-54; http://hdl.handle.net/11420/13531
الاتاحة: http://hdl.handle.net/11420/13531
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9Academic Journal
المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Nov2014, Vol. 4 Issue 11, p1847-1861, 15p
مصطلحات موضوعية: DATA transmission systems, HUMAN behavior models, INTEGRATED circuit interconnections, MATHEMATICAL models, SCATTERING (Physics), BIT error rate
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10Academic Journal
المؤلفون: Chinea, Alessandro, Grivet-Talocia, Stefano, Hu, Haisheng, Triverio, Piero, Kaller, Dierk, Siviero, Claudio, Kindscher, Martin
المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Jun2011, Vol. 1 Issue 6, p920-933, 14p
مصطلحات موضوعية: SIGNAL integrity (Electronics), MULTICHIP modules (Microelectronics), PASSIVE components, TIME-domain analysis, PERFORMANCE evaluation, ITERATIVE methods (Mathematics), ELECTRIC transients, SIMULATION methods & models
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11Academic Journal
المؤلفون: Klink, Erich, Garben, Bernd, Huber, Andreas, Kaller, Dierk, Grivet-Talocia, Stefano, Katopis, George A.
المصدر: IEEE Transactions on Advanced Packaging; Feb2004, Vol. 27 Issue 1, p4-9, 6p
مصطلحات موضوعية: ELECTRONICS packaging, MULTICHIP modules (Microelectronics), INTEGRATED circuits, ELECTRONIC noise, COMPUTER input-output equipment, ELECTRONICS
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12Academic Journal
المؤلفون: Winkel, Thomas-Michael1 winkel@de.ibm.com, Becker, Wiren D.2 wbecker@us.ibm.com, Harrer, Hubert1 hharrer@de.ibm.com, Pross, Harald1 hpross@de.ibm.com, Kaller, Dierk1 dkaller@de.ibm.com, Garben, Bernd1 garbenb@de.ibm.com, Chamberlin, Bruce J.3 chamberb@us.ibm.com, Kuppinger, Scott A.2 skupping@us.ibm.com
المصدر: IBM Journal of Research & Development. May/Jul2004, Vol. 48 Issue 3/4, p379-394. 16p. 5 Diagrams, 4 Charts, 2 Graphs.
مصطلحات موضوعية: *MICROPROCESSORS, *INTERNET servers, *BUSINESS logistics, *COMPUTER storage devices, *EQUIPMENT & supplies