المؤلفون: Müller, J., Pfefferling, B., Merbeth, T., Otani, Y., Hazen, D. Sanchez, Hula, T., Mansueto, M., Titova, A., Ramasubramanian, L., Grimm, C. V.-B., Weisheit, M., Wolf, G., Kriegerstein, V., Vogel, A., Scharf, P., Wang, Y., Huang, Y., Komma, V. S., Sankar, R. Uma, Yoon, H., Kallensee, O., Naik, V. B., Soss, S.

المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

الاتاحة: http://dx.doi.org/10.1109/edtm58488.2024.10511905
http://xplorestaging.ieee.org/ielx7/10511270/10511310/10511905.pdf?arnumber=10511905

المؤلفون: Naik, V. B., Yamane, K., Lee, T.Y., Kwon, J., Chao, R., Lim, J.H., Chung, N.L., Behin-Aein, B., Hau, L.Y., Zeng, D., Otani, Y., Chiang, C., Huang, Y., Pu, L., Jang, S.H., Neo, W.P., Dixit, H., Goh, S. K L. C., Toh, E. H., Ling, T., Hwang, J., Ting, J.W., Low, R., Zhang, L., Lee, C.G., Balasankaran, N., Tan, F., Gan, K. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Kriegerstein, V., Merbeth, T., Seet, C.S., Ong, S., Xu, J., Wong, J., You, Y.S., Woo, S.T., Chan, T.H., Quek, E., Siah, S. Y.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM)

الاتاحة: http://dx.doi.org/10.1109/iedm13553.2020.9371935
http://xplorestaging.ieee.org/ielx7/9371868/9371888/09371935.pdf?arnumber=9371935

المؤلفون: Naik, V. B., Lim, J. H., Lee, T. Y., Neo, W. P., Dixit, H., K, S., Goh, L. C., Ling, T., Hwang, J., Zeng, D., Ting, J. W., Lee, K., Toh, E. H., Zhang, L., Low, R., Balasankaran, N., Zhang, L. Y., Gan, K. W., Hau, L. Y., Mueller, J., Pfefferling, B., Kallensee, O., Yamane, K., Tan, S. L., Seet, C. S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y., Pellerin, J., Chao, R., Kwon, J., Thiyagarajah, N., Chung, N. L., Jang, S. H., Behin-Aein, B.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM)

الاتاحة: http://dx.doi.org/10.1109/iedm19573.2019.8993454
http://xplorestaging.ieee.org/ielx7/8971803/8993428/08993454.pdf?arnumber=8993454

المؤلفون: Hoentschel, J., Shiang Yang Ong, Balzer, T., Sassiat, N., Ran Yan, Herrmann, T., Flachowsky, S., Grass, C., Beyer, S., Kallensee, O., Yu-Yin Lin, Shickova, A., Muehlhoff, A., Kretzschmar, C., Winkler, J., Wiatr, M., Horstmann, M.

المصدر: 2013 14th International Conference on Ultimate Integration on Silicon (ULIS) ; page 37-40

الاتاحة: http://dx.doi.org/10.1109/ulis.2013.6523485
http://xplorestaging.ieee.org/ielx7/6520920/6523476/06523485.pdf?arnumber=6523485

المؤلفون: Foerster, J., Schuderer, B., Haeuser, M., Kallensee, O., Gross, Th.

المصدر: AIP Conference Proceedings; 2004, Vol. 741 Issue 1, p39-44, 6p

مصطلحات موضوعية: THERMAL stresses, STRAINS & stresses (Mechanics), ANNEALING of metals, TITANIUM, TUNGSTEN, ADHESION