المؤلفون: Cheng, Yuanjie, Lo, Jeffery C.C., Qiu, Xing, Xu, Hua, Tao, Mian, Lee, S.W. Ricky

المصدر: 2024 International Conference on Electronics Packaging (ICEP)

الاتاحة: http://dx.doi.org/10.23919/icep61562.2024.10535696
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535696.pdf?arnumber=10535696

المؤلفون: Tu, Ning, Lo, Jeffery C.C., Lee, S.W. Ricky

المصدر: 2022 International Conference on Electronics Packaging (ICEP)

الاتاحة: http://dx.doi.org/10.23919/icep55381.2022.9795441
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795441.pdf?arnumber=9795441

المؤلفون: Lo, Jeffery C.C., Jia, B.F., Liu, Z., Zhu, J., Ricky Lee, S.W.

المصدر: Soldering & Surface Mount Technology, 2008, Vol. 20, Issue 2, pp. 30-38.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540910810871548

المؤلفون: Qiming Zhang, Babak Kondori, Xing Qiu, Jeffery C.C. Lo, S.W. Ricky Lee

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9e2b9f761970f07c7fe6d8b5d6c641de
https://doi.org/10.31399/asm.hb.v11a.a0006827

المؤلفون: TU, Ning, LO, Jeffery C.C., Ricky LEE, S. W.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

الاتاحة: http://dx.doi.org/10.1109/ectc32862.2020.00310
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159247.pdf?arnumber=9159247

المؤلفون: Lau, John Hon Shing, Li, Ming, Yang, Lei, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee Raymond, Cheung, Yiu Ming, Ng, Eric, Lo, Penny, Kai, Wu, Hao, Ji, Beica, Rozalia, Wee, Koh Sau, Ran, Jiang, Xi, Cao, Lim, Sze Pei, Lee, NC, Ko, Cheng Ta, Yang, Henry, Chen, YH, Tao, Mian, Lo, Jeffery C.C., Lee, Shi-wei

مصطلحات موضوعية: FOWLP, RDLs, Reliability, Solder joints

Relation: http://repository.ust.hk/ir/Record/1783.1-93491; Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429752, p. 1574-1582; https://doi.org/10.1109/ECTC.2018.00239; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2018-May&rft.issue=&rft.date=2018&rft.spage=1574&rft.aulast=Lau&rft.aufirst=J.&rft.atitle=Reliability+of+fan-out+wafer-level+packaging+with+large+chips+and+multiple+re-distributed+layers&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-85051975866&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000514675100232

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-93491
https://doi.org/10.1109/ECTC.2018.00239
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0569-5503&rft.volume=v. 2018-May&rft.issue=&rft.date=2018&rft.spage=1574&rft.aulast=Lau&rft.aufirst=J.&rft.atitle=Reliability+of+fan-out+wafer-level+packaging+with+large+chips+and+multiple+re-distributed+layers&rft.title=Proceedings+-+Electronic+Components+and+Technology+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-85051975866&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000514675100232

المؤلفون: Tao, Mian, Lo, Jeffery C.C., Liou, Ying Hong, Chiu, Peter, Lee, Shi-wei

مصطلحات موضوعية: Printed electronic, Silver nanoparticle ink, Soldering, Wafer level packaging

Relation: http://repository.ust.hk/ir/Record/1783.1-93540; 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 / IEEE. New York, NY, USA : Institute of Electrical and Electronics Engineers Inc., 2018, p. 350-354; https://doi.org/10.23919/ICEP.2018.8374321; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2018&rft.spage=350&rft.aulast=Tao&rft.aufirst=&rft.atitle=Solderability%20evaluation%20of%20printed%20silver%20solder%20pad%20for%20wafer-level%20packaging&rft.title=2018%20International%20Conference%20on%20Electronics%20Packaging%20and%20iMAPS%20All%20Asia%20Conference,%20ICEP-IAAC%202018; http://www.scopus.com/record/display.url?eid=2-s2.0-85048775072&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-93540
https://doi.org/10.23919/ICEP.2018.8374321
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2018&rft.spage=350&rft.aulast=Tao&rft.aufirst=&rft.atitle=Solderability%20evaluation%20of%20printed%20silver%20solder%20pad%20for%20wafer-level%20packaging&rft.title=2018%20International%20Conference%20on%20Electronics%20Packaging%20and%20iMAPS%20All%20Asia%20Conference,%20ICEP-IAAC%202018
http://www.scopus.com/record/display.url?eid=2-s2.0-85048775072&origin=inward

المؤلفون: Liu, Huihua, Lo, Jeffery C.C., Lee, Shi Wei Ricky

Relation: http://repository.ust.hk/ir/Record/1783.1-76246; 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146; https://doi.org/10.1109/SSLCHINA.2013.7177334; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=142&rft.aulast=Liu&rft.aufirst=H.&rft.atitle=Optical+characterization+of+a+light+bulb+with+the+waffle+pack+LED+WLP+module&rft.title=2013+10th+China+International+Forum+on+Solid+State+Lighting,+ChinaSSL+2013; http://www.scopus.com/record/display.url?eid=2-s2.0-84957893285&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300036

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-76246
https://doi.org/10.1109/SSLCHINA.2013.7177334
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2013&rft.spage=142&rft.aulast=Liu&rft.aufirst=H.&rft.atitle=Optical+characterization+of+a+light+bulb+with+the+waffle+pack+LED+WLP+module&rft.title=2013+10th+China+International+Forum+on+Solid+State+Lighting,+ChinaSSL+2013
http://www.scopus.com/record/display.url?eid=2-s2.0-84957893285&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000395822300036

المؤلفون: Lee, S. W. Ricky, Lau, C.H., Chan, S.P., Ma, K.Y., Ng, M.H., Ng, Y.W., Lee, K.H., Lo, Jeffery C.C.

Relation: http://repository.ust.hk/ir/Record/1783.1-44663; 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000239687300037

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-44663
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000239687300037

المؤلفون: Zhang, H., Dziegielewski, P.T., Nguyen, T.J., Jeffery, C.C., O'Connell, D.A., Harris, J.R., Seikaly, H.

المصدر: International Journal of Radiation Oncology*Biology*Physics ; volume 88, issue 2, page 495 ; ISSN 0360-3016

الاتاحة: http://dx.doi.org/10.1016/j.ijrobp.2013.11.105
https://api.elsevier.com/content/article/PII:S0360301613034081?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0360301613034081?httpAccept=text/plain

المؤلفون: Jeffery C.C. Lo, B.F. Jia, Z. Liu, J. Zhu, S.W. Ricky Lee

المصدر: Soldering & Surface Mount Technology; Apr2008, Vol. 20 Issue 2, p30-38, 9p

مصطلحات موضوعية: SURFACE mount technology, PACKAGING, SOLDER & soldering, MECHANICAL engineering, ELECTRONIC circuits testing

المؤلفون: Jeffery, C.C.

المصدر: Injury ; volume 4, issue 2, page 131-136 ; ISSN 0020-1383

الاتاحة: http://dx.doi.org/10.1016/0020-1383(72)90011-3
https://api.elsevier.com/content/article/PII:0020138372900113?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:0020138372900113?httpAccept=text/plain