المؤلفون: Nashrudin, Muhammad Naqib, Gan, Zhong Li, Abas, Aizat, Ishak, M.H.H., Tura Ali, M. Yusuf

المصدر: Soldering & Surface Mount Technology, 2020, Vol. 32, Issue 3, pp. 147-156.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-10-2019-0028

المؤلفون: Ishak, M.H.H., Ismail, Farzad, Abdul Aziz, Mohd Sharizal, Abdullah, M.Z.

المصدر: Microelectronics International, 2020, Vol. 37, Issue 1, pp. 54-63.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/MI-11-2018-0071

المؤلفون: Ishak, M.H.H., Abdul Aziz, M.S., Abdul Samad, M.H.S., Ismail, Farzad, Mohd Salleh, M.A.A

المصدر: IOP Conference Series: Materials Science and Engineering ; volume 957, issue 1, page 012065 ; ISSN 1757-8981 1757-899X

الاتاحة: http://dx.doi.org/10.1088/1757-899x/957/1/012065
https://iopscience.iop.org/article/10.1088/1757-899X/957/1/012065/pdf
https://iopscience.iop.org/article/10.1088/1757-899X/957/1/012065

المؤلفون: Roslan, Hafiz, Abdul Aziz, M.S., Abdullah, M.Z., Kamarudin, R., Ishak, M.H.H., Ismail, F., Purna Irawan, Agustinus

المصدر: IOP Conference Series: Materials Science and Engineering ; volume 1007, issue 1, page 012173 ; ISSN 1757-8981 1757-899X

الاتاحة: http://dx.doi.org/10.1088/1757-899x/1007/1/012173
https://iopscience.iop.org/article/10.1088/1757-899X/1007/1/012173/pdf
https://iopscience.iop.org/article/10.1088/1757-899X/1007/1/012173

المؤلفون: Rusdi, M. S., Abdullah, M. Z., Abdul Aziz, M. S., Abdullah, M. K., Ishak, M.H.H, Rethinasamy, P.

المصدر: IOP Conference Series: Materials Science and Engineering ; volume 852, issue 1, page 012084 ; ISSN 1757-8981 1757-899X

الاتاحة: http://dx.doi.org/10.1088/1757-899x/852/1/012084
https://iopscience.iop.org/article/10.1088/1757-899X/852/1/012084/pdf
https://iopscience.iop.org/article/10.1088/1757-899X/852/1/012084

المؤلفون: Abdullah, M.S., Ishak, M.H.H., Ismail, F.

المساهمون: Ministry of Higher Education, Malaysia

المصدر: Engineering Failure Analysis ; volume 136, page 106199 ; ISSN 1350-6307

الاتاحة: http://dx.doi.org/10.1016/j.engfailanal.2022.106199
https://api.elsevier.com/content/article/PII:S135063072200173X?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S135063072200173X?httpAccept=text/plain

المؤلفون: Abas, Aizat, Ishak, M.H.H., Abdullah, M.Z., Che Ani, F., Khor, Soon Fuat

المساهمون: Division of Research and Innovation, Universiti Sains Malaysia

المصدر: Microelectronics Reliability ; volume 56, page 170-181 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/j.microrel.2015.10.014
https://api.elsevier.com/content/article/PII:S0026271415302018?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0026271415302018?httpAccept=text/plain

المؤلفون: Abas, Aizat, M.S., Haslinda, Ishak, M.H.H., A.S., Nurfatin, Abdullah, M.Z., Che Ani, F.

المساهمون: Ministry of Higher Education, Malaysia, Universiti Sains Malaysia, Penang

المصدر: Microelectronic Engineering ; volume 163, page 83-97 ; ISSN 0167-9317

الاتاحة: http://dx.doi.org/10.1016/j.mee.2016.06.010
https://api.elsevier.com/content/article/PII:S0167931716303331?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0167931716303331?httpAccept=text/plain

المؤلفون: Ishak, M.H.H., Abdullah, M.Z., Abas, Aizat

المساهمون: Ministry of Technology and Innovation of Malaysia, Universiti Sains Malaysia

المصدر: Microelectronics Reliability ; volume 65, page 205-216 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/j.microrel.2016.07.002
https://api.elsevier.com/content/article/PII:S0026271416301469?httpAccept=text/plain
https://api.elsevier.com/content/article/PII:S0026271416301469?httpAccept=text/xml

المؤلفون: Ishak, M.H.H.¹ me_hafifi@yahoo.com, Ismail, Farzad¹ aefarzad@usm.my, Che Mat, Sharzali² sharzalm@yahoo.com, Abdullah, M.Z.³ mezul@usm.my, Abdul Aziz, M.S.³ msharizal@usm.my, Idroas, M.Y.³ meyusof@usm.my

المصدر: Energies (19961073). Jan2019, Vol. 12 Issue 2, p281. 1p. 9 Diagrams, 4 Charts, 8 Graphs.

مصطلحات موضوعية: *NUMERICAL analysis, *NOZZLES, *BIOMASS energy, *DIESEL fuels, *COMPUTER simulation of fluid dynamics