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1Academic Journal
المؤلفون: V.A. Dekhtyarenko, T.V. Pryadko, T.P. Vladimirova, C.V. Maksymova, O.M. Semyrga, and V.I. Bondarchuk
المصدر: Успехи физики металлов, Vol 25, Iss 4, Pp 765-786 (2024)
مصطلحات موضوعية: nickel, eutectic, b.c.c. solid solution, intermetallic compound, hydrogenation, dehydrogenation, hydrogen capacity, Physics, QC1-999
وصف الملف: electronic resource
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2
المصدر: Computational materials science. 244:1-14
مصطلحات موضوعية: Level set, Diffusional phase transformations, Finite strain plasticity, Intermetallic compound growth, Cu6Sn5
وصف الملف: electronic
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3Academic Journal
المؤلفون: Kamaruzzaman, Lina Syazwana, Goh, Yingxin, Goh, Yi Chung
المصدر: Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 5, pp. 285-295.
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4Academic Journal
المؤلفون: Shijie Ouyang, Zhi Li, Mingdong Bao, Yingwen Cao, Guoqi Hu, Xuebo Xu
المصدر: Journal of Materials Research and Technology, Vol 33, Iss , Pp 7274-7283 (2024)
مصطلحات موضوعية: Sn-Bi Cu core solder joints, Intermetallic compound, Interfacial reaction, Shear strength, Fracture, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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5Academic Journal
المؤلفون: Nikhil Kumar, Venkat Vivek Pamarthi, John Moffat, Iain Masters
المصدر: Journal of Materials Research and Technology, Vol 33, Iss , Pp 3058-3067 (2024)
مصطلحات موضوعية: Electric vehicle (EV), Li-ion battery, Laser welding, Intermetallic compound formation, Weld resistance, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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6Academic Journal
المؤلفون: Dongjie Liu, Jiaheng Lei, Ziyang Yan, Qingdong Zhang, Yuzhou Du, Chao Yang, Bailing Jiang
المصدر: Journal of Materials Research and Technology, Vol 33, Iss , Pp 6350-6362 (2024)
مصطلحات موضوعية: Fe-SG series metals, Graphite nodule count, Hot melting loss performance, Fe–Al intermetallic compound, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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7Academic Journal
المؤلفون: Shuai Wang, Jiayun Feng, Wei Wang, Peng Wu, Jiayue Wen, Dongsheng Yang, Yilong Huang, Ruyu Tian, Shang Wang, Yanhong Tian
المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 937-954 (2024)
مصطلحات موضوعية: Reliability test, Copper pillar bump, Intermetallic compound, Resistance monitor, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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8Academic Journal
المؤلفون: Kengfeng Xu, Weixi Zhang, Jiao Luo, Hang Yu, Hai Yuan, Bozhe Wang, Daowei Wu
المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 2843-2856 (2024)
مصطلحات موضوعية: Heterogeneous bonding, Al–Au, Intermetallic compound, Thermodynamic, Thermal stress, Fracture behavior, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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9Academic Journal
المصدر: Успехи физики металлов, Vol 25, Iss 3, Pp 520-544 (2024)
مصطلحات موضوعية: laves phase, intermetallic compound, alloying element, tetrahedral interstitial sites, hydrogenation–dehydrogenation, hydrogen capacity, Physics, QC1-999
وصف الملف: electronic resource
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10Academic Journal
المؤلفون: Ali H. Jassim, Najeeb S. Abtaan, Saad R. Ahmed
المصدر: Tikrit Journal of Engineering Sciences, Vol 31, Iss 4 (2024)
مصطلحات موضوعية: Compound casting, Al-Cu bimetal, Intermetallic compound, Interface formation, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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11Academic Journal
المؤلفون: Bolong Li, Tianhan Hu, Jiayi Zhou, Hua Pan, Kai Ding, Tianhai Wu, Yulai Gao
المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 2498-2507 (2024)
مصطلحات موضوعية: Steel-Al joint, Welding parameter, Failure mechanism, Intermetallic compound, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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12Academic Journal
المؤلفون: Yifan Yao, Yuxuan An, Jiatong Dong, Yang Wang, K.N. Tu, Yingxia Liu
المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 3374-3382 (2024)
مصطلحات موضوعية: Joule heating, Microbump, Intermetallic compound, Sidewall wetting void, Thermomigration, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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13Academic Journal
المؤلفون: Young-Ok Yoon, Nam-Seok Kim, Seong-Ho Ha, Bong-Hwan Kim, Hyun-Kyu Lim, Shae K. Kim
المصدر: Archives of Metallurgy and Materials, Vol vol. 69, Iss No 2, Pp 489-492 (2024)
مصطلحات موضوعية: diffusion, tool steel, al alloy, intermetallic compound, phase diagram, Mining engineering. Metallurgy, TN1-997, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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14Academic Journal
المؤلفون: Apalowo, Rilwan Kayode, Abas, Mohamad Aizat, Che Ani, Fakhrozi, Mukhtar, Muhamed Abdul Fatah Muhamed, Ramli, Mohamad Riduwan
المصدر: Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 3, pp. 154-164.
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15Academic Journal
المؤلفون: Yan Zhou, Chengxiang Li, Dan Chen, Ting Shen, Chennan Xu, Xianmin Wang
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 1726-1734 (2024)
مصطلحات موضوعية: Electromagnetic pulse welding (EMPW), Interface transition layer, Intermetallic compound (IMC), Secondary transition layer, Cu sheet, Al sheet, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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16Academic Journal
المؤلفون: Sufian Raja, Farazila Yusof, Mohd Ridha Muhamad, Muhammad Safwan Mohd Mansor, Azib Juri, Bo Wu, Mohd Fadzil Jamaludin, Nooruddin Ansari, James Ren
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 9102-9114 (2024)
مصطلحات موضوعية: Mg/Steel FSW, Microstructure analysis, Intermetallic compound, Welding and joining, Al powder additive, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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17Academic Journal
المؤلفون: Minho Oh, Naru Tokunaga, Equo Kobayashi
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 9531-9541 (2024)
مصطلحات موضوعية: Sn–Ag, Grain boundary diffusion, Cu6Sn5 morphology, Grain growth, Intermetallic compound, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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18Academic Journal
المؤلفون: Ruyu Tian, Yan Gao, Jiayue Wen, Pengrong Lin, Shimeng Xu, Yanhong Tian
المصدر: Journal of Materials Research and Technology, Vol 29, Iss , Pp 5034-5047 (2024)
مصطلحات موضوعية: Composite solder, Intermetallic compound, Shear property, Thermal shock, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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19Academic Journal
المؤلفون: Ramiro Sebastian Vargas Cruz, Viktor Gonda
المصدر: Metals, Vol 15, Iss 1, p 17 (2024)
مصطلحات موضوعية: advanced electronic packaging, finite element analysis, lead-free soldering materials, creep strain energy density, intermetallic compound, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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20Academic Journal
المؤلفون: Weiqian Chen, Peiqing La, Ruojiao Yin, Lei Wan, Yong Du, Yibing Zheng
المصدر: Crystals, Vol 15, Iss 1, p 46 (2024)
مصطلحات موضوعية: first-principles, B2-FeAl intermetallic compound, electronic structure, element doping, chlorine migration barrier, Crystallography, QD901-999
وصف الملف: electronic resource