المؤلفون: Kim, Georgiy Y.¹ kimgeoju@gmail.com, Nosov, Alexander V.¹

المصدر: Electrica. May2024, Vol. 24 Issue 2, p385-391. 7p.

مصطلحات موضوعية: *ELECTROSTATIC discharges, *INTEGRATED circuit failures, *MICROSTRIP transmission lines, *CROSSTALK, *ATTENUATION (Physics)

المؤلفون: Yazdanbakhsh, Amir¹, Balasubramanian, Raghuraman², Nowatzki, Tony², Sankaralingam, Karthikeyan²

المصدر: IEEE Micro. Nov2015, Vol. 35 Issue 6, p24-36. 13p.

مصطلحات موضوعية: *SERVICE life, INTEGRATED circuit failures, PREDICTION models, STATIC random access memory chips, LOGIC circuits

المؤلفون: Kurz, Daniel¹, Lewitschnig, Horst², Pilz, Jürgen¹

المصدر: Applied Stochastic Models in Business & Industry. Sep2015, Vol. 31 Issue 5, p732-744. 13p.

مصطلحات موضوعية: *BAYESIAN analysis, *PROBABILITY theory, *SEMICONDUCTOR device testing, INTEGRATED circuit failures, SEMICONDUCTOR defects, STRUCTURAL reliability

المؤلفون: Sparkes, Matthew

المصدر: New Scientist. 6/26/2021, Vol. 250 Issue 3340, p20-20. 1p.

مصطلحات موضوعية: *INTEGRATED circuit failures

الشركة/الكيان: GOOGLE Inc. GOOG, META Platforms Inc.

المؤلفون: Rao, Nanditha P.¹ nanditha.rao@iiitb.ac.in, Desai, Madhav P.¹ madhav@ee.iitb.ac.in

المصدر: Microelectronics Journal. Feb2018, Vol. 72, p86-99. 14p.

مصطلحات موضوعية: *INTEGRATED circuit failures, *INTEGRATED circuit design, *SOFT errors, *PLANAR transistors, *MICROELECTRONICS

المؤلفون: Barbashov, V.¹ vmbarbashov@mephi.ru, Trushkin, N.¹, Kalashnikov, O.² oakal@spels.ru

المصدر: Russian Microelectronics. Sep2015, Vol. 44 Issue 5, p312-315. 4p.

مصطلحات موضوعية: *LARGE scale integration of circuits, *INTEGRATED circuit failures, *BRAUER groups, *INTEGRATED circuit reliability, *FUZZY systems

المؤلفون: Bescup, John¹ John.Bescup@Weatherford.com

المصدر: Electronic Device Failure Analysis. Aug2015, Vol. 17 Issue 3, p30-34. 5p.

مصطلحات موضوعية: *KIRKENDALL effect, *INTEGRATED circuit failures, *MAGNETIC fields, *VIBRATION (Mechanics), *DELAMINATION of composite materials

المؤلفون: Tian, Naiyu, Ouyang, Dantong, Song, Jincai, Zhang, Liming

المصدر: Electronics Letters (Wiley-Blackwell); Jul2021, Vol. 57 Issue 15, p597-599, 3p

مصطلحات موضوعية: FAULT tolerance (Engineering), SEMICONDUCTOR failures, INTEGRATED circuit failures, INTEGRATED circuit fault tolerance, SEMICONDUCTORS

المؤلفون: De Wolf, Ingrid, Croes, Kristof, Beyne, Eric

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; May2018, Vol. 8 Issue 5, p711-718, 8p

مصطلحات موضوعية: THROUGH-silicon via, SILICON wafers, THREE-dimensional integrated circuits, DESIGN failures, INTEGRATED circuit failures, FAILURE analysis

المؤلفون: Phang, Jacob C. H.^1,2

المصدر: Electronic Device Failure Analysis. Aug2013, Vol. 15 Issue 3, p28-31. 3p.

مصطلحات موضوعية: *OPTICAL microscopes, *INTEGRATED circuit failures, *SEMICONDUCTOR defects, *PULSED lasers, *LOCK-in amplifiers

المؤلفون: Surya, Gulamfaruk N., Khan, Zafar J., Ballal, Makarand S., Suryawanshi, Hiralal M.

المصدر: IEEE Transactions on Industrial Electronics; Feb2017, Vol. 64 Issue 2, p1495-1506, 12p

مصطلحات موضوعية: SQUIRREL cage motors, INDUCTION motors -- Automatic control, FREQUENCY-domain analysis, INTEGRATED circuit failures, STATORS, HARMONIC distortion (Physics)

المؤلفون: Lin, Qian, Fu, Haipeng, Cheng, Qianfu, Zhu, Yuanyuan

المصدر: Analog Integrated Circuits & Signal Processing; Oct2016, Vol. 89 Issue 1, p177-183, 7p

مصطلحات موضوعية: POWER amplifiers, PHYSIOLOGICAL effects of temperature, INTEGRATED circuit failures, RADIO frequency, ELECTRONIC amplifiers, BANDWIDTHS, THERMAL stresses

المؤلفون: Geczy, Attila, Fejos, Márta, Tersztyánszky, László

المصدر: Soldering & Surface Mount Technology; 2015, Vol. 27 Issue 2, p61-68, 8p

مصطلحات موضوعية: REFLOW soldering, INTEGRATED circuits, TEMPERATURE compensation in electronic circuits, INTEGRATED circuit failures, WARPAGE in electronic circuits

المؤلفون: Sangho Youn, Chenjie Gu, Jaeha Kim

المصدر: DAC: Annual ACM/IEEE Design Automation Conference; 2014, p700-705, 6p

مصطلحات موضوعية: DEBUGGING, INTEGRATED circuit failures, INFERENTIAL statistics, COMPUTER input-output equipment, GRAPHICAL modeling (Statistics), PARTIALLY observable Markov decision processes, MIXED signal circuits

المؤلفون: Kanj, Rouwaida, Joshi, Rajiv, Zhuo Li, Hayes, Jerry, Nassif, Sani

المصدر: DAC: Annual ACM/IEEE Design Automation Conference; Jun2012, p1107-1112, 6p

مصطلحات موضوعية: ALGORITHMS, COMPUTER simulation of parameter estimation, SPHERICAL functions, SPHERICAL conics, INTEGRATED circuit failures, INTEGRATED circuit layout, MONTE Carlo method software

المؤلفون: Jaeger, Richard C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C.

المصدر: Journal of Electronic Packaging; Dec2014, Vol. 136 Issue 4, p1-10, 10p

مصطلحات موضوعية: ELECTRONIC packaging, HALL effect devices, INTEGRATED circuit failures, SILICON, ELECTRIC potential measurement

المؤلفون: Lall, Pradeep, Lowe, Ryan

المصدر: Journal of Electronic Packaging; Dec2014, Vol. 136 Issue 4, p1-8, 8p

مصطلحات موضوعية: ELECTRONICS, ELECTRONIC packaging, THERMOELECTRIC cooling, KALMAN filtering, INTEGRATED circuit failures

المؤلفون: Pomeranz, Irith

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems; Dec2014, Vol. 33 Issue 12, p2010-2014, 5p

مصطلحات موضوعية: DEBUGGING, INTEGRATED circuits testing, INTEGRATED circuits, TESTING, INTEGRATED circuit failures

المؤلفون: Paul, Dev

المصدر: IEEE Transactions on Industry Applications; Nov2014, Vol. 50 Issue 6, p4179-4187, 9p

مصطلحات موضوعية: ELECTRIC power system faults, INTEGRATED circuit fault tolerance, INTEGRATED circuit failures, ELECTRIC current grounding, ELECTRIC circuit breakers, ELECTRIC resistance

المؤلفون: Chen, Ming-Kun, Huang, Yu-Jung, Cheng, Chi-Chan, Lin, Yi-Lung, Fu, Shen-Li

المصدر: Journal of Materials Science: Materials in Electronics; Feb2014, Vol. 25 Issue 2, p596-603, 8p

مصطلحات موضوعية: MICROELECTRONIC materials, PHOTOLITHOGRAPHY, SEMICONDUCTOR materials -- Electric properties, INTEGRATED circuit failures, SCANNING electron microscopy, SEMICONDUCTOR devices, ELECTRON emission, METAL oxide semiconductors