المؤلفون: Kil-Joong Kim, Dong-Pil Heo, Heun-Ggyoo Oh, Hyeong-Gi Lee, Suck-Hwan Joung, Se-Hong Min

المصدر: Fire Science and Engineering. 37:157-166

مصطلحات موضوعية: Industrial and Manufacturing Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::26eeee31b40fb1e4fd14f80207e77153
https://doi.org/10.7731/kifse.cff75e75

المؤلفون: Jae-Wook Lee, Jung-hyun Cho, Min-Ho Kim, Dae-Sung Kim, J.W. Lee, Jae-Yong Park, Hyeong-Gi Lee

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Stress (mechanics), Materials science, Yield (engineering), business.industry, Process (computing), Wafer, Structural engineering, Stress distribution, Edge (geometry), High Bandwidth Memory, business, Throughput (business)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d708458127a29d362fc7b27134af748c
https://doi.org/10.1109/ectc32862.2020.00364

المؤلفون: Hyeong Gi Lee, Kyung-Wook Paik, Ji-Won Shin, Yongwon Choi

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:450-455

مصطلحات موضوعية: 010302 applied physics, Wire bonding, Materials science, Through-silicon via, Metallurgy, 02 engineering and technology, Thermocompression bonding, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, Isothermal process, Electronic, Optical and Magnetic Materials, Anodic bonding, Soldering, 0103 physical sciences, Electrical and Electronic Engineering, 0210 nano-technology, Contact area, Joint (geology)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f2ec337b06963fe97ef72dc2681d8892
https://doi.org/10.1109/tcpmt.2016.2641040

المؤلفون: Hyeong Gi Lee, Lev Truskinovsky, Jonathan Goodman, Ellen K. Longmire, John Lowengrub, Michael Shelley

المصدر: Free boundary problems

مصطلحات موضوعية: Physics, Chemical physics, Liquid liquid

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a238b5a15271e84013c389452f9ae153
https://doi.org/10.1201/9780203755518-19

المؤلفون: Ji-In Yu, Hyeong Gi Lee, Hyun-Seok Choi, Dong wook Kim, Yong Sung Park, Jun Su Lim, Ji-Min Kim, Yongjin Park, Sangho An, Sung-il Cho, Jin-san Jung

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Packaging engineering, business.industry, Process (computing), Mechanical engineering, 02 engineering and technology, High Bandwidth Memory, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, Form factor (design), Stack (abstract data type), 0103 physical sciences, 0210 nano-technology, business, Communication channel

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1227ace6e40fb9d69e851be975baec6c
https://doi.org/10.1109/ectc.2019.00038

المؤلفون: Hyeong-gi Lee, J. S. Lowengrub, J. Goodman

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-78/UMSI_2000-78.ps.Z.

وصف الملف: application/postscript

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.33.2077; http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-78/UMSI_2000-78.ps.Z

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.33.2077
http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-78/UMSI_2000-78.ps.Z

المؤلفون: Hyeong-gi Lee, J. S. Lowengrub, J. Goodman

المساهمون: The Pennsylvania State University CiteSeerX Archives

المصدر: http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-76/UMSI_2000-76.ps.Z.

وصف الملف: application/postscript

Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.33.1273; http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-76/UMSI_2000-76.ps.Z

الاتاحة: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.33.1273
http://www.msi.umn.edu/general/Reports/rptfiles/UMSI2000-76/UMSI_2000-76.ps.Z

المؤلفون: Kyung-Wook Paik, Hyeong-Gi Lee, Yongwon Choi, Ji-Won Shin

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:1567-1572

مصطلحات موضوعية: Interconnection, Materials science, Silicon, Through-silicon via, Stacking, chemistry.chemical_element, Epoxy, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, chemistry, visual_art, visual_art.visual_art_medium, Wafer dicing, Wafer, Electrical and Electronic Engineering, Composite material, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::59b7d7c26d0d19289442f97523135d28
https://doi.org/10.1109/tcpmt.2015.2478904

المؤلفون: Hyeong-Gi Lee, Kyung-Wook Paik

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:451-459

مصطلحات موضوعية: Materials science, Composite number, Epoxy, Dielectric, Industrial and Manufacturing Engineering, Thermal expansion, Electronic, Optical and Magnetic Materials, Differential scanning calorimetry, visual_art, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, Material properties, Glass transition, Curing (chemistry)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3f067661cda0262e490090c6415aa5a4
https://doi.org/10.1109/tcpmt.2015.2406875

المؤلفون: Hyeong Gi Lee, Young Soon Kim, SeYong Lee, Kyung-Wook Paik, Ji-Won Shin

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, Kirkendall effect, Silicon, Metallurgy, chemistry.chemical_element, 02 engineering and technology, 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, 0104 chemical sciences, Electrical resistance and conductance, chemistry, Soldering, Wafer, Adhesive, Wetting, Composite material, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::684ef81980da0261b89ac7454bc1a08a
https://doi.org/10.1109/ectc.2016.128

المؤلفون: Yongwon Choi, SeYong Lee, Hyeong-Gi Lee, Kyung-Wook Paik

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Through-silicon via, Melting temperature, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Temperature measurement, Isothermal process, Soldering, 0103 physical sciences, Composite material, 0210 nano-technology, Electrical conductor, Curing (chemistry)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a9f0e22cdf4245ccbd1539835703339c
https://doi.org/10.1109/ectc.2016.134

المؤلفون: Ji-Won Shin, Hyeong-Gi Lee, Yongwon Choi, Kyung-Wook Paik

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Materials science, Through-silicon via, business.industry, law.invention, Die preparation, law, Lamination, Electronic engineering, Optoelectronics, Wafer dicing, Wafer, business, Electrical conductor, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3addd43d92e9c3506c42f85c55f72b53
https://doi.org/10.1109/ectc.2015.7159613

المؤلفون: John Lowengrub, Hyeong Gi Lee, J. Goodman

المصدر: Physics of Fluids. 14:492-513

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Physics, Mechanical Engineering, Maxwell construction, Computational Mechanics, Mechanics, Condensed Matter Physics, System of linear equations, Physics::Fluid Dynamics, Nonlinear system, Hele-Shaw flow, Gravitational field, Mechanics of Materials, Compressibility, Statistical physics, Boussinesq approximation (water waves), Linear stability

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::929be3d4efc35930bd2aa597745e1e68
https://doi.org/10.1063/1.1425843

المؤلفون: Hyeong Gi Lee, J. Goodman, John Lowengrub

المصدر: Physics of Fluids. 14:514-545

مصطلحات موضوعية: Fluid Flow and Transfer Processes, Physics, Buoyancy, Mechanical Engineering, Computational Mechanics, Stratified flows, Mechanics, engineering.material, Condensed Matter Physics, Instability, Physics::Fluid Dynamics, Hele-Shaw flow, Mechanics of Materials, Compressibility, engineering, Rayleigh–Taylor instability, Statistical physics, Stratified flow, Boussinesq approximation (water waves)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::15064dc3427a59f3503a3622eedb1066
https://doi.org/10.1063/1.1425844

المؤلفون: Kyung-Wook Paik, Hyeong-Gi Lee

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference.

مصطلحات موضوعية: inorganic chemicals, Materials science, Scanning electron microscope, Composite number, Nanowire, chemistry.chemical_element, Nanotechnology, Epoxy, law.invention, Magnetic anisotropy, Nickel, Optical microscope, Ferromagnetism, chemistry, law, visual_art, otorhinolaryngologic diseases, visual_art.visual_art_medium, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::124d6983f9cf080e4f3d7a2ac14f3019
https://doi.org/10.1109/ectc.2012.6249129

المؤلفون: Hyeong Gi Lee, Chong Un

المصدر: IEEE Transactions on Acoustics, Speech, and Signal Processing. 28:398-407

مصطلحات موضوعية: Voice activity detection, Discriminator, Delta modulation, Codec2, Computer Science::Sound, Computer science, Speech recognition, Signal Processing, Speech coding, Realization (linguistics), Linear predictive coding, Speech processing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2dbe1ac14c1c30f98bfd9f9e91ccfac5
https://doi.org/10.1109/tassp.1980.1163424