المؤلفون: Sang-Hyeon Kim, Seong-Kwang Kim, Jae-Phil Shim, Dae-Myeong Geum, Gunwu Ju, Han-Sung Kim, Hee-Jeong Lim, Hyeong-Rak Lim, Jae-Hoon Han, Subin Lee, Ho-Sung Kim, Pavlo Bidenko, Chang-Mo Kang, Dong-Seon Lee, Jin-Dong Song, Won Jun Choi, Hyung-Jun Kim

المصدر: IEEE Journal of the Electron Devices Society, Vol 6, Pp 579-587 (2018)

مصطلحات موضوعية: Heterogeneous integration, monolithic 3D, sequential 3D, layer transfer, wafer bonding, epitaxial lift-off, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8283617/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/20293a3a75a24531bcbca730df0a2068

المؤلفون: Seong Kwang Kim, Hyeong-Rak Lim, Jaejoong Jeong, Seung Woo Lee, Joon Pyo Kim, Jaeyoung Jeong, Bong Ho Kim, Seung-Yeop Ahn, Youngkeun Park, Dae-Myoung Geum, Younghyun Kim, Yongku Baek, Byung Jin Cho, Sang Hyeon Kim

المصدر: 2022 International Electron Devices Meeting (IEDM).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::64b84f597aa75cdf2c82279eedcd4ff4
https://doi.org/10.1109/iedm45625.2022.10019551

المؤلفون: Dae-Myeong Geum, Won Jun Choi, Jaeyong Jeong, Hyeong-Rak Lim, Sanghyeon Kim, Seong Kwang Kim, Hyo-Jin Kim, Juhyuk Park, Jae-Hoon Han

المصدر: IEEE Electron Device Letters. 42:800-803

مصطلحات موضوعية: 010302 applied physics, Materials science, Doping, Analytical chemistry, Conductivity, 01 natural sciences, Omega, Electronic, Optical and Magnetic Materials, Gallium arsenide, chemistry.chemical_compound, chemistry, Electrical resistivity and conductivity, 0103 physical sciences, Electrical analysis, Wafer, Electrical and Electronic Engineering, Indium gallium arsenide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1cb16992c4bae1b710506c6eb8639bcc
https://doi.org/10.1109/led.2021.3076817

المؤلفون: YeonJoo Jeong, Seong Kwang Kim, Jae-Hoon Han, Hyung-jun Kim, Dae-Myeong Geum, Hyeong-Rak Lim, Sanghyeon Kim

المصدر: IEEE Electron Device Letters. 41:605-608

مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Wafer bonding, Transistor, Photodetector, Long-term potentiation, 01 natural sciences, Ray, Electronic, Optical and Magnetic Materials, law.invention, Synapse, Semiconductor, law, Artificial vision, 0103 physical sciences, Optoelectronics, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b5b17f057d94cc584785ffdfb7a1cefd
https://doi.org/10.1109/led.2020.2971321

المؤلفون: Jae-Hoon Han, Yun-Joong Lee, Hyung-jun Kim, Byeong Kwon Ju, Sanghyeon Kim, Hansung Kim, Hyeong-Rak Lim, Dae-Myeong Geum, Seong Kwang Kim

المصدر: IEEE Electron Device Letters. 40:1362-1365

مصطلحات موضوعية: 010302 applied physics, Electron mobility, Materials science, Silicon, Condensed matter physics, Wafer bonding, chemistry.chemical_element, Germanium, Biasing, Epitaxy, 01 natural sciences, Subthreshold slope, Electronic, Optical and Magnetic Materials, chemistry, 0103 physical sciences, MOSFET, Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::989862a96e8ef4dc3a0ad998d1ad863f
https://doi.org/10.1109/led.2019.2931410

المؤلفون: Jae-Phil Shim, Sanghyeon Kim, Hyeong-Rak Lim, Hansung Kim, Hyung-jun Kim, Seong Kwang Kim, Jae-Hoon Han, Gun Wu Ju

المصدر: IEEE Transactions on Electron Devices. 65:1253-1257

مصطلحات موضوعية: 010302 applied physics, Diffraction, Materials science, Silicon, business.industry, Wafer bonding, Stacking, chemistry.chemical_element, 02 engineering and technology, 021001 nanoscience & nanotechnology, Epitaxy, 01 natural sciences, Electronic, Optical and Magnetic Materials, Gallium arsenide, chemistry.chemical_compound, symbols.namesake, chemistry, Transmission electron microscopy, 0103 physical sciences, symbols, Optoelectronics, Electrical and Electronic Engineering, 0210 nano-technology, business, Raman spectroscopy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::81eacdcfdb1bf045a302dc26ecf3a951
https://doi.org/10.1109/ted.2018.2793285

المؤلفون: Dae-Myeong Geum, Won Jun Choi, Hosung Kim, Chang-Mo Kang, Hyung-jun Kim, Hyeong-Rak Lim, Jae-Phil Shim, Jin Dong Song, Jae-Hoon Han, Dong-Seon Lee, Seongkwang Kim, Sanghyeon Kim, Hansung Kim, Subin Lee, Gun Wu Ju, Heejeong Lim, Pavlo Bidenko

المصدر: IEEE Journal of the Electron Devices Society. 6:579-587

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, business.industry, Wafer bonding, MicroLED, 02 engineering and technology, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, Electronic, Optical and Magnetic Materials, Photodiode, law.invention, CMOS, law, 0103 physical sciences, MOSFET, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Electrical and Electronic Engineering, Photonics, 0210 nano-technology, business, Biotechnology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6c0cf0102e447c842aedf6ef3e46f56a
https://doi.org/10.1109/jeds.2018.2802840

المؤلفون: Pavlo Bidenko, Dae-Myeong Geum, Hyeong Rak Lim, Sanghyeon Kim, Yu Rim Jeon, Jae-Hoon Han, Hansung Kim, Chang Hwan Choi, YeonJoo Jeong, Hyung-jun Kim, Seong Kwang Kim, Yun Jung Lee

المصدر: ACS applied materialsinterfaces. 12(6)

مصطلحات موضوعية: 010302 applied physics, Interconnection, Materials science, Artificial neural network, Wafer bonding, Transconductance, Transistor, 01 natural sciences, law.invention, Neuromorphic engineering, law, 0103 physical sciences, Electronic engineering, General Materials Science, MNIST database, Communication channel

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::353cdfc67e9a0d3bc74d77e4a9b59eab
https://pubmed.ncbi.nlm.nih.gov/31939649

المؤلفون: Won Jun Choi, Chang-Mo Kang, Hee Jung Lim, Hyung-jun Kim, Hyeong Rak Lim, Hansung Kim, Jae-Hoon Han, Gun Wu Ju, Dae-Myeong Geum, Seongkwang Kim, Dong-Seon Lee, Sanghyeon Kim, Jae-Phil Shim, Jin Dong Song

المصدر: 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

مصطلحات موضوعية: 010302 applied physics, Interconnection, Computer science, Process (engineering), Transistor, Three-dimensional integrated circuit, Process design, Context (language use), Chip, 01 natural sciences, law.invention, Reduction (complexity), law, 0103 physical sciences, Electronic engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::05397c0089d5f3a4febb240a8a07da05
https://doi.org/10.1109/s3s.2017.8309242