المؤلفون: Huang, Tsung-Ching, Huang, Jiun-Lang, Cheng, Kwang-Ting

المصدر: Foundations and Trends® in Electronic Design Automation. 9(2)

مصطلحات موضوعية: Electrical and Electronic Engineering, Computer Hardware

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/1sw9d29x

المؤلفون: Bonnassieux, Yvan, Brabec, Christoph J., Cao, Yong, Carmichael, Tricia Breen, Chabinyc, Michael L., Cheng, Kwang Ting, Cho, Gyoujin, Chung, Anjung, Cobb, Corie L., Distler, Andreas, Egelhaaf, Hans Joachim, Grau, Gerd, Guo, Xiaojun, Haghiashtiani, Ghazaleh, Huang, Tsung Ching, Hussain, Muhammad Mustafa, Iniguez, Benjamin, Lee, Taik Min, Li, Ling, Ma, Yuguang, Ma, Dongge, McAlpine, Michael C., Ng, Tse Nga, Österbacka, Ronald, Patel, Shrayesh N., Peng, Junbiao, Peng, Huisheng, Rivnay, Jonathan, Shao, Leilai, Steingart, Daniel, Street, Robert A., Subramanian, Vivek, Torsi, Luisa, Wu, Yunyun

المساهمون: Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division, Electrical and Computer Engineering Program, Integrated Nanotechnology Lab, CNRS, École Polytechnique, IP Paris, Palaiseau, France, Friedrich-Alexander University Erlangen-Nürnberg, Institute of Materials for Electronics and Energy Technology (i-MEET), Martensstr. 7, 91058 Erlangen, Germany, Department of Renewable Energies, Bavarian Center for Applied Energy Research e.V., 91058 Erlangen, Germany, Forschungszentrum Jülich GmbH, Helmholtz Institute Erlangen-Nürnberg for Renewable Energies (HI ERN), Immerwahrstr. 2, 91058 Erlangen, Germany, South China University of Technology, 381 Wushan Road, Tianhe District, Guangzhou, Guangdong Province 510641, People’s Republic of China, Department of Chemistry and Biochemistry, University of Windsor, Windsor, Ontario N9B 3P4, Canada, Materials Department, University of California, Santa Barbara, CA 93016-5050, United States of America, School of Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Department of Biophysics, Institute of Quantum Biophysics, Sungkyunkwan University, Suwon, Republic of Korea, Korea Flexible & Printed Electronics Association, Seoul, Republic of Korea, Department of Mechanical Engineering, University of Washington, Seattle, WA 98195, United States of America, Bavarian Center for Applied Energy Research e.V., Department of Renewable Energies, Solar Factory of the Future, Fürther Str. 250, 90429 Nürnberg, Germany, Department of Electrical Engineering and Computer Science, York University, Toronto, ON, Canada, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China, Department of Mechanical Engineering, University of Minnesota, 111 Church Street SE, Minneapolis, MN 55455, United States of America, Hewlett Packard Laboratory, 820 N. McCarthy Blvd, Milpitas, CA 95035, United States of America, Electrical Engineering and Computer Science, University of California, Berkeley, CA 94720-1770, United States of America, Universitat Rovira i Virgili, Tarragona, Spain, Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), 156, Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Republic of Korea, Institute of Microelectronics, Chinese Academy of Sciences, Beitucheng West Road, Chaoyang District, Beijing 100029, People’s Republic of China, University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China, University of California, Jacobs Hall, 9500 Gilman Drive, San Diego, CA 92093, United States of America, Physics, Faculty of Science and Engineering, Åbo Akademi University, Turku 20500, Finland, Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL 60637, United States of America, Fudan University, 2205 Songhu Road, Shanghai 200438, People’s Republic of China, Department of Biomedical Engineering, Northwestern University, Evanston, IL 60657, United States of America, Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, United States of America, Department of Earth and Environmental Engineering, Columbia University, New York, NY 10027, United States of America, Department of Chemical Engineering, Columbia University, New York, NY 10027, United States of America, Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, CA 94304, United States of America, Institute of Microengineering, École Polytechnique fédérale de Lausanne, Lausanne, Switzerland, Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, United States of America, Dipartimento di Chimica, Università degli Studi di Bari ‘Aldo Moro’, Bari 70125, Italy

وصف الملف: application/pdf

Relation: https://iopscience.iop.org/article/10.1088/2058-8585/abf986; Bonnassieux, Y., Brabec, C. J., Cao, Y., Carmichael, T. B., Chabinyc, M. L., Cheng, K.-T., … Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2), 023001. doi:10.1088/2058-8585/abf986; 2-s2.0-85107977151; Flexible and Printed Electronics; 023001; http://hdl.handle.net/10754/669780

الاتاحة: http://hdl.handle.net/10754/669780
https://doi.org/10.1088/2058-8585/abf986

المؤلفون: Lei, Ting, Guan, Ming, Liu, Jia, Lin, Hung-Cheng, Pfattner, Raphael, Shaw, Leo, McGuire, Allister F., Huang, Tsung-Ching, Shao, Leilai, Cheng, Kwang-Ting, Tok, Jeffrey B.-H., Bao, Zhenan

المصدر: Proceedings of the National Academy of Sciences of the United States of America, 2017 May . 114(20), 5107-5112.

URL الوصول: https://www.jstor.org/stable/26483205

المؤلفون: Shao, Leilai, Li, Sicheng, Lei, Ting, Huang, Tsung-Ching, Beausoleil, Raymond, Bao, Zhenan, Cheng, Kwang-Ting

المصدر: Proceedings of the 56th Annual Design Automation Conference 2019

الاتاحة: http://dx.doi.org/10.1145/3316781.3317928
https://dl.acm.org/doi/pdf/10.1145/3316781.3317928

المؤلفون: Huang, Tsung‐Ching, Lei, Ting, Shao, Leilai, Sivapurapu, Sridhar, Swaminathan, Madhavan, Bao, Zhenan, Cheng, Kwang‐Ting, Beausoleil, Raymond

المساهمون: Air Force Research Laboratory

المصدر: Journal of the Society for Information Display ; volume 28, issue 3, page 241-251 ; ISSN 1071-0922 1938-3657

الاتاحة: http://dx.doi.org/10.1002/jsid.876
https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fjsid.876
https://onlinelibrary.wiley.com/doi/pdf/10.1002/jsid.876
https://onlinelibrary.wiley.com/doi/full-xml/10.1002/jsid.876
https://sid.onlinelibrary.wiley.com/doi/am-pdf/10.1002/jsid.876

المؤلفون: Huang, Tsung-Ching, Lei, Ting, Shao, Leilai, Sivapurapu, Sridhar, Swaminathan, Madhavan, Li, Sicheng, Bao, Zhenan, Cheng, Kwang-Ting, Beausoleil, Raymond

المساهمون: Air Force Research Laboratory

المصدر: SID Symposium Digest of Technical Papers ; volume 50, issue 1, page 217-220 ; ISSN 0097-966X 2168-0159

الاتاحة: http://dx.doi.org/10.1002/sdtp.12894
https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.12894
https://sid.onlinelibrary.wiley.com/doi/am-pdf/10.1002/sdtp.12894

المؤلفون: Lei, Ting, Shao, Lei-Lai, Zheng, Yu-Qing, Pitner, Gregory, Fang, Guanhua, Zhu, Chenxin, Li, Sicheng, Beausoleil, Ray, Wong, H.-S. Philip, Huang, Tsung-Ching, Cheng, Kwang-Ting, Bao, Zhenan

المصدر: Nature Communications ; volume 10, issue 1 ; ISSN 2041-1723

الاتاحة: http://dx.doi.org/10.1038/s41467-019-10145-9
https://www.nature.com/articles/s41467-019-10145-9.pdf
https://www.nature.com/articles/s41467-019-10145-9

المؤلفون: Shao, Leilai, Lei, Ting, Huang, Tsung-Ching, Bao, Zhenan, Cheng, Kwang Ting

Relation: http://repository.ust.hk/ir/Record/1783.1-106218; Proceedings - Design Automation Conference, v. 2020-July, July 2020, article number 9218570; https://doi.org/10.1109/DAC18072.2020.9218570; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0738-100X&rft.volume=2020&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Shao&rft.aufirst=&rft.atitle=Robust+design+of+large+area+flexible+electronics+via+compressed+sensing&rft.title=Proceedings+-+Design+Automation+Conference; http://www.scopus.com/record/display.url?eid=2-s2.0-85093920344&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000628528400078

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-106218
https://doi.org/10.1109/DAC18072.2020.9218570
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=0738-100X&rft.volume=2020&rft.issue=&rft.date=2020&rft.spage=&rft.aulast=Shao&rft.aufirst=&rft.atitle=Robust+design+of+large+area+flexible+electronics+via+compressed+sensing&rft.title=Proceedings+-+Design+Automation+Conference
http://www.scopus.com/record/display.url?eid=2-s2.0-85093920344&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000628528400078

المؤلفون: Huang, Tsung-Ching, Lei, Ting, Shao, Leilai, Sivapurapu, Sridhar, Swaminathan, Madhavan, Li, Sicheng, Bao, Zhenan, Cheng, Kwang-Ting, Beausoleil, Raymond

المصدر: 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) ; page 36-41

الاتاحة: http://dx.doi.org/10.23919/date.2019.8714975
http://xplorestaging.ieee.org/ielx7/8704855/8714721/08714975.pdf?arnumber=8714975

المؤلفون: Shao, Leilai, Huang, Tsung-Ching, Lei, Ting, Bao, Zhenan, Beausoleil, Raymond, Cheng, Kwang Ting

Relation: http://repository.ust.hk/ir/Record/1783.1-89504; Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, v. 2018-January, February 2018, article number 8297396, p. 651-657; https://doi.org/10.1109/ASPDAC.2018.8297396; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=2153-6961&rft.volume=&rft.issue=&rft.date=2018&rft.spage=651&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Process+Design+Kit+for+Flexible+Hybrid+Electronics&rft.title=2018+23RD+ASIA+AND+SOUTH+PACIFIC+DESIGN+AUTOMATION+CONFERENCE+%28ASP-DAC%29; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000426987100122; http://www.scopus.com/record/display.url?eid=2-s2.0-85045338414&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-89504
https://doi.org/10.1109/ASPDAC.2018.8297396
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=2153-6961&rft.volume=&rft.issue=&rft.date=2018&rft.spage=651&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Process+Design+Kit+for+Flexible+Hybrid+Electronics&rft.title=2018+23RD+ASIA+AND+SOUTH+PACIFIC+DESIGN+AUTOMATION+CONFERENCE+%28ASP-DAC%29
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000426987100122
http://www.scopus.com/record/display.url?eid=2-s2.0-85045338414&origin=inward

المؤلفون: Shao, Leilai, Huang, Tsung-Ching, Lei, Ting, Bao, Zhenan, Beausolei, Raymond, Cheng, Kwang Ting

مصطلحات موضوعية: Carbon nanotube, Thin-film transistors, SPICE, Pseudo-CMOS, Robust design, Design automation

Relation: http://repository.ust.hk/ir/Record/1783.1-91608; Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018, v. 2018-January, April 2018, p. 491-496; https://doi.org/10.23919/DATE.2018.8342058; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1530-1591&rft.volume=&rft.issue=&rft.date=2018&rft.spage=491&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Compact%20Modeling%20of%20Carbon%20Nanotube%20Thin%20Film%20Transistors%20for%20Flexible%20Circuit%20Design&rft.title=PROCEEDINGS%20OF%20THE%202018%20DESIGN,%20AUTOMATION%20%26%20TEST%20IN%20EUROPE%20CONFERENCE%20%26%20EXHIBITION%20(DATE); http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000435148800089; http://www.scopus.com/record/display.url?eid=2-s2.0-85048793733&origin=inward

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-91608
https://doi.org/10.23919/DATE.2018.8342058
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=1530-1591&rft.volume=&rft.issue=&rft.date=2018&rft.spage=491&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Compact%20Modeling%20of%20Carbon%20Nanotube%20Thin%20Film%20Transistors%20for%20Flexible%20Circuit%20Design&rft.title=PROCEEDINGS%20OF%20THE%202018%20DESIGN,%20AUTOMATION%20%26%20TEST%20IN%20EUROPE%20CONFERENCE%20%26%20EXHIBITION%20(DATE)
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000435148800089
http://www.scopus.com/record/display.url?eid=2-s2.0-85048793733&origin=inward

المؤلفون: Shao, Leilai, Lei, Ting, Huang, Tsung-Ching, Li, Sicheng, Chu, Ta Ya, Wong, Man, Beausoleil, Raymond, Bao, Zhenan, Cheng, Kwang-Ting Tim

مصطلحات موضوعية: Compact model, Design automation, Flex-IoT, Flexible hybrid electronics, Pseudo-CMOS, Thin-film transistors

Relation: https://repository.hkust.edu.hk/ir/Record/1783.1-99109; IEEE Design & Test, v. 36, (4), August 2019, article number 8640824, p. 6-14; https://doi.org/10.1109/MDAT.2019.2899058; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=36&rft.issue=4&rft.date=2019&rft.spage=6&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Compact+Modeling+of+Thin-Film+Transistors+for+Flexible+Hybrid+IoT+Design&rft.title=IEEE+Design+%26+Test; http://www.scopus.com/record/display.url?eid=2-s2.0-85069767230&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000476811500003

الاتاحة: https://repository.hkust.edu.hk/ir/Record/1783.1-99109
https://doi.org/10.1109/MDAT.2019.2899058
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=36&rft.issue=4&rft.date=2019&rft.spage=6&rft.aulast=Shao&rft.aufirst=L&rft.atitle=Compact+Modeling+of+Thin-Film+Transistors+for+Flexible+Hybrid+IoT+Design&rft.title=IEEE+Design+%26+Test
http://www.scopus.com/record/display.url?eid=2-s2.0-85069767230&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000476811500003

المؤلفون: Huang, Tsung Ching, Youn, Jinsung, Rhim, Peter Jin, Fiorentino, Marco

وصف الملف: application/pdf

Relation: http://www.osti.gov/servlets/purl/1840428; https://www.osti.gov/biblio/1840428

الاتاحة: http://www.osti.gov/servlets/purl/1840428
https://www.osti.gov/biblio/1840428

المؤلفون: Huang, Tsung-Ching, Cheng, Kwang-Ting, Beausoleil, Raymond

المصدر: 2016 IEEE International Symposium on Circuits and Systems (ISCAS) ; page 353-356

الاتاحة: http://dx.doi.org/10.1109/iscas.2016.7527243
http://xplorestaging.ieee.org/ielx7/7515073/7527154/07527243.pdf?arnumber=7527243

المؤلفون: Huang, Tsung-Ching, Cheng, Tim Kwang-Ting, Beausoleil, Raymond G.

مصطلحات موضوعية: Printed Electronics, Flexible Electronics, Thin-Film Transistor (TFT)

Relation: http://repository.ust.hk/ir/Record/1783.1-83192; 2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016, October 2016, article number 7579340; https://doi.org/10.1109/NOCS.2016.7579340; http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2016&rft.spage=&rft.aulast=Huang&rft.aufirst=T.-C.&rft.atitle=Printed+circuits+on+flexible+substrates%3A+Opportunities+and+challenges+%28invited+paper%29&rft.title=2016+10th+IEEE%2FACM+International+Symposium+on+Networks-on-Chip,+NOCS+2016; http://www.scopus.com/record/display.url?eid=2-s2.0-84994558700&origin=inward; http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000392263800024

الاتاحة: http://repository.ust.hk/ir/Record/1783.1-83192
https://doi.org/10.1109/NOCS.2016.7579340
http://lbdiscover.ust.hk/uresolver?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rfr_id=info:sid/HKUST:SPI&rft.genre=article&rft.issn=&rft.volume=&rft.issue=&rft.date=2016&rft.spage=&rft.aulast=Huang&rft.aufirst=T.-C.&rft.atitle=Printed+circuits+on+flexible+substrates%3A+Opportunities+and+challenges+%28invited+paper%29&rft.title=2016+10th+IEEE%2FACM+International+Symposium+on+Networks-on-Chip,+NOCS+2016
http://www.scopus.com/record/display.url?eid=2-s2.0-84994558700&origin=inward
http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000392263800024