المؤلفون: Tsuei, Mengping (ORCID 0000-0001-9891-9602), Hsu, Yung-Yu

المصدر: Asia-Pacific Education Researcher. Oct 2019 28(5):457-467.

Peer Reviewed: Y

Page Count: 11

Descriptors: Parent Attitudes, Technology Integration, Grade 5, Elementary School Students, Foreign Countries, Parent Teacher Cooperation, Parent Child Relationship, Children, Usability, Teaching Methods

مصطلحات جغرافية: Taiwan (Taipei)

المؤلفون: Kim, Dae-Hyeong, Ghaffari, Roozbeh, Lu, Nanshu, Wang, Shuodao, Lee, Stephen P., Keum, Hohyun, D'Angelo, Robert, Klinker, Lauren, Su, Yewang, Lu, Chaofeng, Kim, Yun-Soung, Ameen, Abid, Li, Yuhang, Zhang, Yihui, de Graff, Bassel, Hsu, Yung-Yu, Liu, ZhuangJian, Ruskin, Jeremy, Xu, Lizhi, Lu, Chi, Omenetto, Fiorenzo G., Huang, Yonggang, Mansour, Moussa, Slepian, Marvin J., Rogers, John A.

المصدر: Proceedings of the National Academy of Sciences of the United States of America, 2012 Dec 01. 109(49), 19910-19915.

URL الوصول: https://www.jstor.org/stable/41830439

المؤلفون: Gonzalez, Mario, Vandevelde, Bart, Christiaens, Wim, Hsu, Yung Yu, Iker, Francois, Bossuyt, Frederick, Vanfleteren, Jan, Van der Sluis, Olaf, Timmermans, Pieter

المصدر: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings ; ISBN: 9781424470266 ; ISBN: 9781424470273

مصطلحات موضوعية: Technology and Engineering, finite element analysis, electronics packaging, flexible electronics, flip-chip devices, thermomechanical treatment, thermo-mechanical analysis, stretchable electronics, ultra thin dies, finite element modeling, chip embedding, ultra thin chip package

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/1071525; http://hdl.handle.net/1854/LU-1071525; http://doi.org/10.1109/ESIME.2010.5464566; https://biblio.ugent.be/publication/1071525/file/1071591

الاتاحة: https://biblio.ugent.be/publication/1071525
http://hdl.handle.net/1854/LU-1071525
https://doi.org/10.1109/ESIME.2010.5464566
https://biblio.ugent.be/publication/1071525/file/1071591

المؤلفون: Widlund, Thomas, Yang, Shixuan, Hsu, Yung-Yu, Lu, Nanshu

المصدر: International Journal of Solids and Structures ; volume 51, issue 23-24, page 4026-4037 ; ISSN 0020-7683

الاتاحة: http://dx.doi.org/10.1016/j.ijsolstr.2014.07.025
https://api.elsevier.com/content/article/PII:S0020768314003011?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0020768314003011?httpAccept=text/plain

المؤلفون: Vanfleteren, Jan, Gonzalez, Mario, Bossuyt, Frederick, Hsu, Yung-Yu, Vervust, Thomas, De Wolf, Ingrid, Jablonski, Michal

المصدر: MRS BULLETIN ; ISSN: 0883-7694

مصطلحات موضوعية: Technology and Engineering, ELECTRONICS, INTERCONNECTS, DESIGN

وصف الملف: application/pdf

Relation: https://biblio.ugent.be/publication/3060806; http://hdl.handle.net/1854/LU-3060806; http://dx.doi.org/10.1557/mrs.2012.48; https://biblio.ugent.be/publication/3060806/file/3066227

الاتاحة: https://biblio.ugent.be/publication/3060806
http://hdl.handle.net/1854/LU-3060806
https://doi.org/10.1557/mrs.2012.48
https://biblio.ugent.be/publication/3060806/file/3066227

المؤلفون: Hsu, Yung-Yu, Lucas, Kylie, Davis, Dan, Ghaffari, Rooz, Elolampi, Brian, Dalal, Mitul, Work, John, Lee, Stephen, Rafferty, Conor, Dowling, Kevin

المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference ; volume 73, page 623-628

الاتاحة: http://dx.doi.org/10.1109/ectc.2013.6575638
http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575638.pdf?arnumber=6575638