المؤلفون: Gerald Beyer, Cor Claeys, Larry Zhao, Christopher J. Wilson, Henny Volders, Mikhail R. Baklanov, Marianna Pantouvaki, Zsolt Tőkei, Els Van Besien

المصدر: Microelectronic Engineering. 88:3030-3034

مصطلحات موضوعية: Materials science, chemistry.chemical_element, Film density, Substrate (electronics), Dielectric, Condensed Matter Physics, Nitrogen, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Ion, Metal, chemistry, visual_art, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, Porosity, Deposition (law)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::69c8ef81c3a3fc0b4fb66848b669ec61
https://doi.org/10.1016/j.mee.2011.05.002

المؤلفون: Chao Zhao, Zsolt Tkei, Gerald Beyer, Christopher J. Wilson, Henny Volders, Kristof Croes, Larry Zhao

المصدر: Microelectronic Engineering. 88:656-660

مصطلحات موضوعية: Diffraction, Interconnection, Materials science, Diffusion barrier, business.industry, Tantalum, chemistry.chemical_element, Recrystallization (metallurgy), Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Optics, chemistry, X-ray crystallography, Wafer, Electrical and Electronic Engineering, Composite material, business, Crystal twinning

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ef1f4811d232dbfa919ad004dbd2164c
https://doi.org/10.1016/j.mee.2010.06.014

المؤلفون: Virginie Gravey, B. Parmentier, Erik Sleeckx, Nancy Heylen, A. Cockburn, J. Steenbergen, G. Faelens, Thierry Conard, M. Van De Peer, L. Carbonell, Koen Marrant, Zs. Tkei, Gerald Beyer, Henny Volders, Christopher J. Wilson, Kavita Shah, Chao Zhao, Kristof Kellens

المصدر: Microelectronic Engineering. 88:690-693

مصطلحات موضوعية: Annealing (metallurgy), Analytical chemistry, Oxide, Mineralogy, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, Tantalum nitride, Physical vapor deposition, Thermal stability, Wafer, Metallizing, Electrical and Electronic Engineering, Thin film

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::851480646904e9ac819a5d54e70a68eb
https://doi.org/10.1016/j.mee.2010.09.003

المؤلفون: Gerald Beyer, Zaid El-Mekki, Philippe M. Vereecken, Wouter Ruythooren, Aleksandar Radisic, Henny Volders, Zsolt Tokei, Silvia Armini

المصدر: Microelectronic Engineering. 88:754-759

مصطلحات موضوعية: Materials science, business.industry, Copper interconnect, Nanotechnology, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Atomic layer deposition, Tantalum nitride, chemistry, Plating, Chemical-mechanical planarization, Physical vapor deposition, Optoelectronics, Wafer, Electrical and Electronic Engineering, business, Sheet resistance

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10774a12ccaa768ac01684f739a699b7
https://doi.org/10.1016/j.mee.2010.08.013

المؤلفون: Christopher J. Wilson, Zsolt Tkei, Henny Volders, Gerald Beyer, Anthony O'Neill, Kristof Croes, Alton B. Horsfall, Marianna Pantouvaki

المصدر: Microelectronic Engineering. 87:398-401

مصطلحات موضوعية: Diffraction, Annealing (metallurgy), Chemistry, Metallurgy, Alloy, Copper interconnect, Analytical chemistry, Low-k dielectric, engineering.material, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Physical vapor deposition, X-ray crystallography, engineering, Electrical and Electronic Engineering, Diffusion (business)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b2acf2cf98ec7bfd9a16fbfb88780719
https://doi.org/10.1016/j.mee.2009.06.023

المؤلفون: Magi Margalit Nagar, Silvia Armini, Philippe M. Vereecken, Wouter Ruythooren, Katrien Strubbe, Aleksandar Radisic, Zaid El-Mekki, Henny Volders

المصدر: ECS Transactions. 25:175-184

مصطلحات موضوعية: Materials science, Diffusion barrier, Inorganic chemistry, Alloy, Tantalum, chemistry.chemical_element, engineering.material, Copper, chemistry, Plating, engineering, Copper plating, Cyclic voltammetry, Cobalt

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca8192ff0c9d9e5717c4a228a218196b
https://doi.org/10.1149/1.3318516

المؤلفون: Youssef Travaly, O. Richard, E. VanBesien, Gerald Beyer, Romano Hoofman, Roel Daamen, Marianna Pantouvaki, Henny Volders, M. Willegems, Elisabeth Camerotto, Aurelie Humbert, Kristof Kellens

المصدر: Microelectronic Engineering. 85:2071-2074

مصطلحات موضوعية: Materials science, Copper interconnect, Low-k dielectric, Dielectric, Chemical vapor deposition, Condensed Matter Physics, Capacitance, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Chemical-mechanical planarization, Electrical and Electronic Engineering, Composite material, Air gap (plumbing), Porosity

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7a122b6badf3fd312ad226b4f025a7ba
https://doi.org/10.1016/j.mee.2008.05.020

المؤلفون: Alexis Franquet, S. Garaud, Guy Vereecke, F. Sinapi, Thierry Conard, Youssef Travaly, I. Hoflijk, Bert Brijs, Chao Zhao, Henny Volders, Zsolt Tokei, Hugo Bender, Chris Drijbooms, Wei-Min Li, D. Vanhaeren, H. Sprey, Alain M. Jonas, Rudy Caluwaerts, L. Carbonell, Alain Moussa

المصدر: Microelectronic Engineering. 84:2460-2465

مصطلحات موضوعية: Materials science, Oxide, Analytical chemistry, chemistry.chemical_element, Tungsten hexafluoride, Nanotechnology, Tungsten, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Atomic layer deposition, chemistry, Electrical resistivity and conductivity, Plasma-enhanced chemical vapor deposition, Electrical and Electronic Engineering, Ternary operation, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5f9ce21c9de7693605db1d66e1e00413
https://doi.org/10.1016/j.mee.2007.05.023

المؤلفون: Stefan Kubicek, Serge Biesemans, K. De Meyer, J. Petry, Henny Volders, Abdelkarim Mercha, Barry O'Sullivan, R. Singanamalla, Vasile Paraschiv, Hao Yu

المصدر: Microelectronic Engineering. 84:1865-1868

مصطلحات موضوعية: Materials science, Analytical chemistry, chemistry.chemical_element, Condensed Matter Physics, Capacitance, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Threshold voltage, chemistry, MOSFET, Work function, Electrical and Electronic Engineering, Metal gate, Tin, Order of magnitude, Leakage (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::263ecab4ee3788679b2e5430ac94d4ed
https://doi.org/10.1016/j.mee.2007.04.095

المؤلفون: L. Carbonell, N. Ban, S. Umehara, K. Kellens, Naomasa Suzuki, S. Takada, Toru Ishimoto, Henny Volders, Nancy Heylen, Zsolt Tokei, R. Caluwaerts

المصدر: SPIE Proceedings.

مصطلحات موضوعية: Void (astronomy), Materials science, business.industry, Detector, Early detection, High resolution, chemistry.chemical_element, Acceleration voltage, Copper, chemistry, Trench, Optoelectronics, Wafer, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0bdb30b31d066a6a756b4acc0c81db58
https://doi.org/10.1117/12.916254

المؤلفون: Gaetano Santoro, L. Carbonell, A. Cockburn, Li Yunlong, Virginie Gravey, Kavita Shah, Yuchun Wang, Leonardus Leunissen, Nancy Heylen, Kristof Kellens, Henny Volders, Zsolt Tokei, Gerald Beyer

المصدر: 2010 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Interconnection, Materials science, chemistry, Chemical-mechanical planarization, Compatibility (mechanics), Metallurgy, Hardware_INTEGRATEDCIRCUITS, Slurry, Copper interconnect, chemistry.chemical_element, Process optimization, Copper, Corrosion

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5747ba912c47e90b087115337aec16c0
https://doi.org/10.1109/iitc.2010.5510692

المؤلفون: Herbert Struyf, Ivan Ciofi, Deenesh Padhi, Harold Dekkers, Erik Sleeckx, Gerald Beyer, Virginie Gravey, Wilfried Alaerts, Eddy Kunnen, M. Maenhoudt, J. Versluijs, Yong Kong Siew, Kavita Shah, Atif Noori, Els Van Besien, A. Cockburn, Samuel Suhard, Henny Volders

المصدر: 2010 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Materials science, Audio time-scale/pitch modification, Copper interconnect, chemistry.chemical_element, Nanotechnology, STRIPS, law.invention, Resist, chemistry, law, Multiple patterning, Silicon oxide, Tin, Immersion lithography

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2b38e0253e0eef6c8003e2c7d90ec3a1
https://doi.org/10.1109/iitc.2010.5510743

المؤلفون: Youssef Travaly, Nancy Heylen, Elisabeth Camerotto, Guy Vereecke, Henny Volders, Zsolt Tokei, Gerald Beyer

المصدر: 2010 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Materials science, Silicon, Metallurgy, chemistry.chemical_element, Polishing, chemistry, Scratch, Agglomerate, Chemical-mechanical planarization, Composite material, Tin, Porosity, Layer (electronics), computer, computer.programming_language

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5f71f99de14cd77f735fdd946e6793ce
https://doi.org/10.1109/iitc.2010.5510742

المؤلفون: J. Verluijs, V. Truffert, Geert Vandenberghe, J. De Backer, Marc Demand, E. Altamirano, M. Ercken, G. Mannaert, Christina Baerts, Anne Lauwers, Stephan Brus, T. Hoffman, S. Locorotondo, T. Vandeweyer, Andriy Hikavyy, W. Alaerts, Gerald Beyer, J. Hermans, Herbert Struyf, Serge Biesemans, Craig Huffman, Michal Rakowski, Nancy Heylen, C. Delvaux, Frederic Lazzarino, S. Verhaegen, Steven Demuynck, Henny Volders, Patrick Ong, Christa Vrancken, H. Dekkers, Philippe Absil, Kurt G. Ronse, Naoto Horiguchi, Kristof Kellens

المصدر: 2010 Symposium on VLSI Technology.

مصطلحات موضوعية: Materials science, business.industry, Extreme ultraviolet lithography, Logic gate, MOSFET, Multiple patterning, Optoelectronics, Nanotechnology, business, Metal gate, Lithography, Integrated circuit layout, High-κ dielectric

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::defe254198501107a7ae29e809a1ce4a
https://doi.org/10.1109/vlsit.2010.5556133

المؤلفون: A. Van Dijk, Hans Meiling, M. Demand, Anne-Marie Goethals, Olivier Richard, Nancy Heylen, Mircea Dusa, Jan Hermans, Philippe Absil, Staf Verhaegen, R. Schreutelkamp, Michal Rakowski, G. Beyer, Steven Demuynck, Serge Biesemans, J. De Backer, Tom Vandeweyer, Harold Dekkers, Kavita Shah, Herbert Struyf, Andriy Hikavyy, F. Van Roey, Frederic Lazzarino, Geert Vandenberghe, C. Pigneret, C. Vrancken, C. Baerts, A. Cockburn, Patrick Ong, T. Y. Hoffmann, R. Rajagopalan, Jerry Gelatos, Bart Baudemprez, Hugo Bender, Henny Volders, Kurt G. Ronse, Monique Ercken, S. Brus, A. De Keersgieter, Virginie Gravey, Bas Hultermans, S. Locorotondo, Anabela Veloso, K. Kellens, L. Romijn, C. Huffman, Christie Delvaux, E. Altamirano, D. Goossens, Sjoerd Lok

المصدر: 2009 IEEE International Electron Devices Meeting (IEDM).

مصطلحات موضوعية: Materials science, business.industry, Extreme ultraviolet lithography, Transistor, Nanotechnology, PMOS logic, law.invention, Resist, law, Logic gate, Optoelectronics, Node (circuits), Metal gate, business, NMOS logic

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d15fef4a75db1a9ae02381442fc12ebe
https://doi.org/10.1109/iedm.2009.5424365

المؤلفون: Martine Claes, G. Beyer, K. Croes, Guy Vereecke, Samuel Suhard, Nancy Heylen, Steven Demuynck, K. Kellens, H. Sprey, Patrick Verdonck, J. Versluijs, Henny Volders, D. De Roest, Julien Beynet, Craig Huffman, Herbert Struyf

المصدر: Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Materials science, Dielectric reliability, Nanotechnology, Engineering physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dbca50be4361dda80eb5e87e5b4a7314
https://doi.org/10.7567/ssdm.2009.d-9-5

المؤلفون: Larry Zhao, Henny Volders, Gerald Beyer, Gianni Giai Gischia, Zsolt Tikei

المصدر: 2009 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Interconnection, Materials science, Silicon, Passivation, Copper interconnect, chemistry.chemical_element, Dielectric, Engineering physics, law.invention, Capacitor, Reliability (semiconductor), chemistry, law, Electronic engineering, Process optimization

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b7b9e949130549e2c5481b8bd20f83b0
https://doi.org/10.1109/iitc.2009.5090389

المؤلفون: Efrain Altamirano Sanchez, Paul F. Ma, Johan Wouters, Qian Luo, Katia Devriendt, L. Carbonell, Jiang Lu, Murali Narasimhan, Kavita Shah, Arvind Sundarrajan, Virginie Gravey, Joseph F. Aubuchon, Gerald Beyer, Nancy Heylen, A. Cockburn, Rudy Caluwaerts, Kristof Kellens, Henny Volders, Zsolt Tokei

المصدر: 2009 IEEE International Interconnect Technology Conference.

مصطلحات موضوعية: Materials science, business.industry, Annealing (metallurgy), Metallurgy, Tantalum, Oxide, chemistry.chemical_element, Corrosion, chemistry.chemical_compound, chemistry, Chemical-mechanical planarization, Optoelectronics, Inorganic materials, business, Lithography

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9eec44fcb81fc30df62659a863637da8
https://doi.org/10.1109/iitc.2009.5090387

المؤلفون: Honggun Kim, Janko Versluijs, D. De Roest, Herbert Struyf, Henny Volders, C. Huffman, G. Beyer, H. Sprey, K. Kellens, Guy Vereecke, Martine Claes, Nancy Heylen, Steven Demuynck, M. Darnon, Patrick Verdonck

المصدر: Extended Abstracts of the 2008 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Materials science, Dielectric reliability, business.industry, Optoelectronics, Nanotechnology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0cb01dc658bf0a8bb40933c701a84e01
https://doi.org/10.7567/ssdm.2008.c-6-4

المؤلفون: Sywert Brongersma, P. Boelen, J. Van Olmen, J. Gelatos, S. List, Henny Volders, Zsolt Tokei, Ivan Ciofi, L. Carbonell, Eddy Kunnen, A. Khandelwal, Tushar Mandrekar, Nancy Heylen

المصدر: 2007 IEEE International Interconnect Technology Conferencee.

مصطلحات موضوعية: Atomic layer deposition, Cross section (physics), Materials science, business.industry, Scattering, Electrical resistivity and conductivity, MOSFET, Copper interconnect, Electronic engineering, Optoelectronics, Conductivity, business, Scaling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::677d3d46e7d5719941643f4a4ccb196d
https://doi.org/10.1109/iitc.2007.382338