المؤلفون: Habra, W., Tounsi, P., Madrid, F., Dupuy, P., Barbot, C., Dorkel, J. -M.

المصدر: Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

مصطلحات موضوعية: Physics - General Physics

URL الوصول: http://arxiv.org/abs/0801.1044

المؤلفون: Habra, W., Tounsi, P., Dorkel, J. -M.

المصدر: Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/0709.1830

المؤلفون: Habra, W., Tounsi, P., Madrid, F., Dupuy, Ph., Barbot, C., Dorkel, J-M.

المصدر: 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) ; page 141-144

الاتاحة: http://dx.doi.org/10.1109/therminic.2007.4451766
http://xplorestaging.ieee.org/ielx5/4446641/4451730/04451766.pdf?arnumber=4451766

المؤلفون: Habra, W., Tounsi, P., Dorkel, J.-M.

المساهمون: LAAS - LAAS/CNRS France, LAAS - LAAS/CNRS FRANCE

المصدر: Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 225-228

مصطلحات موضوعية: Compact modeling thermal simulation vhdl-ams

وصف الملف: 121934 bytes; application/pdf

Relation: Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 225-228; 2-916187-04-9; handle TIMA; http://hdl.handle.net/2042/6542

الاتاحة: http://hdl.handle.net/2042/6542

المؤلفون: Habra, W., Tounsi, P., Dorkel, J.-M.

المساهمون: LAAS/CNRS , Toulouse France, INSA, Toulouse France

المصدر: International Workshop on Thermal Investigation og ICs ans Systems, 27-30 Sep 2005, Belgirate Lake Maggiore, Italy, p129-134

وصف الملف: 183877 bytes; application/pdf

Relation: International Workshop on Thermal Investigation og ICs ans Systems, 27-30 Sep 2005, Belgirate Lake Maggiore, Italy, p 129-134; 2-916187-01-04; handle TIMA 2243/THERM2005_1020; http://hdl.handle.net/2042/6428

الاتاحة: http://hdl.handle.net/2042/6428

المؤلفون: Habra, W., Tounsi, P., Dorkel, J.-M.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. ; page 390-393

الاتاحة: http://dx.doi.org/10.1109/esime.2005.1502835
http://xplorestaging.ieee.org/ielx5/10046/32239/01502835.pdf?arnumber=1502835

المؤلفون: Habra, W., Tounsi, P., Madrid, F., Dorkel, J.-M.

المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Micro-Systems; 2008, p1-4, 4p

المؤلفون: Habra, W., Tounsi, P., Dupuy, P., Dorkel, J.-M., Madrid, F.

المصدر: 2007 IEEE Bipolar/BiCMOS Circuits & Technology Meeting; 2007, p86-89, 4p