المؤلفون: Wang, Chun, Abdo, Ibrahim, Liu, Chenxin, Gomez, Carrel da, Mayeda, Jill, Herdian, Hans, Wang, Wenqian, Fu, Xi, You, Dongwon, Shehata, Abanob, Park, Sunghwan, Wang, Yun, Pang, Jian, Sakai, Hiroyuki, Shirane, Atsushi, Okada, Kenichi

المساهمون: MIC, Society of Transnational Academic Researchers Scholars Network, VDEC in collaboration with Cadence Design Systems, Inc., Mentor Graphics, Inc., Keysight Technologies Japan, Ltd.

المصدر: IEEE Journal of Solid-State Circuits ; volume 59, issue 4, page 978-992 ; ISSN 0018-9200 1558-173X

الاتاحة: http://dx.doi.org/10.1109/jssc.2024.3353067
http://xplorestaging.ieee.org/ielx7/4/10480871/10412201.pdf?arnumber=10412201

المؤلفون: You, Dongwon, Wang, Xiaolin, Herdian, Hans, Fu, Xi, Lee, Hojun, Ide, Michihiro, Gomez, Carrel Da, Li, Zheng, Mayeda, Jill, Awaji, Daisuke, Pang, Jian, Sakamoto, Hiraku, Okada, Kenichi, Shirane, Atsushi

المساهمون: Ministry of Internal Affairs and Communications (MIC)/Strategic Information and Communications Research and Development Promotion Program, Japan Society for the Promotion of Science, MIC, Japan Science and Technology Agency (JST)/Adaptable and Seamless Technology Transfer Program through Target-Driven Research and Development, National Institute Of Information and Communications Technology, (STAR), VLSI Design and Education Center (VDEC) in Collaboration with Cadence Design Systems, Inc., Mentor Graphics, Inc., and Keysight Technologies Japan, Ltd

المصدر: IEEE Access ; volume 11, page 69522-69535 ; ISSN 2169-3536

الاتاحة: http://dx.doi.org/10.1109/access.2023.3291814
http://xplorestaging.ieee.org/ielx7/6287639/10005208/10172041.pdf?arnumber=10172041

المؤلفون: Jyo, Teruo, Abdo, Ibrahim, Hamada, Hiroshi, Nagatani, Munehiko, Pander, Adam, Wakita, Hitoshi, Mutoh, Miwa, Shiratori, Yuta, Kitayama, Daisuke, Gomez, Carrel Da, Wang, Chun, Hatano, Kota, Liu, Chenxin, Fadila, Ashbir Aviat, Pang, Jian, Shirane, Atsushi, Okada, Kenichi, Takahashi, Hiroyuki

المصدر: 2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) ; page 166-172

الاتاحة: http://dx.doi.org/10.1109/bcicts59662.2024.10745694
http://xplorestaging.ieee.org/ielx8/10745638/10745653/10745694.pdf?arnumber=10745694

المؤلفون: Wang, Chun, Herdian, Hans, Zheng, Wenbin, Liu, Chenxin, Mayeda, Jill, Liu, Yuxuan, Yong, Olivia Angel, Wang, Wenqian, Zhang, Yuncheng, Gomez, Carrel Da, Shehata, Abanob, Kato, Sena, Abdo, Ibrahim, Jyo, Teruo, Hamada, Hiroshi, Takahashi, Hiroyuki, Sakai, Hiroyuki, Shirane, Atsushi, Okada, Kenichi

المصدر: 2024 IEEE International Solid-State Circuits Conference (ISSCC) ; page 415-417

الاتاحة: http://dx.doi.org/10.1109/isscc49657.2024.10454273
http://xplorestaging.ieee.org/ielx7/10454133/10454267/10454273.pdf?arnumber=10454273

المؤلفون: Abdo, Ibrahim, Jyo, Teruo, Pander, Adam, Wakita, Hitoshi, Shiratori, Yuta, Muto, Miwa, Hamada, Hiroshi, Nagatani, Munehiko, Gomez, Carrel da, Wang, Chun, Hatano, Kota, Liu, Chenxin, Fadila, Ashbir Aviat, Pang, Jian, Shirane, Atsushi, Okada, Kenichi, Takahashi, Hiroyuki

المصدر: IEEE Microwave and Wireless Technology Letters ; volume 33, issue 6, page 887-890 ; ISSN 2771-9588 2771-957X

الاتاحة: http://dx.doi.org/10.1109/lmwt.2023.3267790
http://xplorestaging.ieee.org/ielx7/9944983/10144809/10113727.pdf?arnumber=10113727

المؤلفون: Abdo, Ibrahim, Gomez, Carrel da, Wang, Chun, Hatano, Kota, Li, Qi, Liu, Chenxin, Yanagisawa, Kiyoshi, Fadila, Ashbir Aviat, Pang, Jian, Hamada, Hiroshi, Nosaka, Hideyuki, Shirane, Atsushi, Okada, Kenichi

المساهمون: Cadence Design Systems, Synopsys, Mentor Graphics, Keysight Technologies

المصدر: 2021 IEEE International Solid- State Circuits Conference (ISSCC)

الاتاحة: http://dx.doi.org/10.1109/isscc42613.2021.9365968
http://xplorestaging.ieee.org/ielx7/9365732/9365735/09365968.pdf?arnumber=9365968