المؤلفون: Tong, Xin, Shi, Jin, Zhou, Yu

المساهمون: Tong, X (reprint author), Peking Univ, Coll Urban & Environm Sci, Beijing 100871, Peoples R China., Peking Univ, Coll Urban & Environm Sci, Beijing 100871, Peoples R China., Vassar Coll, Dept Earth Sci & Geog, Poughkeepsie, NY 12604 USA.

المصدر: SCI

مصطلحات موضوعية: Global product chains, Lead markets, Innovation diffusion, Lead-free soldering, COMPETITIVENESS, INNOVATION, FRAMEWORK, STANDARDS

Relation: ECOLOGICAL ECONOMICS.2012,83,174-182.; 861420; http://hdl.handle.net/20.500.11897/161016; WOS:000312054700019

الاتاحة: https://hdl.handle.net/20.500.11897/161016
https://doi.org/10.1016/j.ecolecon.2011.08.022