المؤلفون: Ning Lu, Theodorus E. Standaert, Matthew Angyal, G. Matusiewicz, Vincent J. McGahay

المصدر: CICC

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Scattering, Scanning electron microscope, Spice, Characterization (materials science), Electrical resistivity and conductivity, Hardware_INTEGRATEDCIRCUITS, Surface roughness, Electronic engineering, Optoelectronics, Node (circuits), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cd834e7c452c0027fa7d341befa900ae
https://doi.org/10.1109/cicc.2007.4405680

المؤلفون: I. Yang, F. Zhang, A. Tilke, P. Wrschka, Y.-H. Lin, J. Lian, P. Nguyen, V. Ramanchandran, Gregory M. Johnson, L.S. Leong, Atul C. Ajmera, A. Ebert, S.O. Kim, H. Zhuang, M.-C. Sun, J.-P. Kim, Andy Cowley, Christopher V. Baiocco, J.-H. Ku, W. Lin, J. Greg Massey, Alvin G. Thomas, M. Naujok, A. Vayshenker, G. Leake, A. Fischer, M. Sherony, E. Kaltalioglu, K. Hooper, Dirk Vietzke, C. Griffin, Y.-W. Teh, W. Gao, J. Sudijohno, Manfred Eller, Randy W. Mann, G. Matusiewicz, Y.K. Siew, T. Schiml, Renee T. Mo, S.-M. Choi, R. Knoefler, W.L. Tan, J. Benedict, T. Pompl, J.-H. Yang, F.F. Jamin, Fernando Guarin, K.C. Park, K.-W. Lee, An L. Steegen, Jae-Eun Park, S. Scheer, V. Klee, D.H. Hong, L. Tai, V. Ku, S.L. Liew

المصدر: IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

مصطلحات موضوعية: Interconnection, Reliability (semiconductor), Materials science, CMOS, business.industry, Low-power electronics, Gate dielectric, Electrical engineering, Optoelectronics, Static random-access memory, business, Voltage, Power (physics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::80b515e6807384d732a1a136ebc7ef9d
https://doi.org/10.1109/iedm.2005.1609267

المؤلفون: Eva E. Simonyi, William F. Landers, T. H. Ivers, Thomas M. Shaw, K. Ida, D. Jung, Sujatha Sankaran, Kaushal Patel, Johnny Widodo, Naftali E. Lustig, M. Chae, Kaushik Chanda, G. A. Biery, Wan-jae Park, J. Sucharitaves, W. Liu, T. Ko, Christos D. Dimitrakopoulos, M. Kelling, Stephen M. Gates, R. G. Filippi, D. Nielsen, John A. Fitzsimmons, O. Bravo, M. Beck, Satya V. Nitta, Terry A. Spooner, L. Economikos, T. Bolom, Alfred Grill, John G. Pellerin, X. Liu, Eric G. Liniger, G. Matusiewicz, E. Kaltalioglu, C. Tian, Mukta G. Farooq, F. Chen, David L. Rath, Griselda Bonilla, D. Nguyen, Nicholas C. M. Fuller, P. Davis, S. Arai, Daniel C. Edelstein, J.P. Doyle, Kevin S. Petrarca, P. Ong, Kaushik A. Kumar, H. Wendt, L. Wiggins, V. Patel, Stephan Grunow, W. Li, L. Nicholson, I. Melville, Sanjay Mehta, Stephen E. Greco, J. Werking, Robert L. Wisnieff, B. Moon, Darryl D. Restaino, S. Marokkey, R. Hannon, Myoung-Bum Lee, Theodorus E. Standaert, Shom Ponoth, Paul S. McLaughlin, R. Augur, P. V. McLaughlin, C. Labelle, A. Cowley, H. Shoba, S. Rhee, K. Malone, Stephan A. Cohen, Michael Lane, E.T. Ryan, H. Landis, Larry Clevenger, James R. Lloyd, James J. Demarest, Andrew H. Simon, K. Miyata

المصدر: 2006 International Electron Devices Meeting.

مصطلحات موضوعية: Back end of line, Reliability (semiconductor), Materials science, CMOS, Homogeneous, business.industry, Plasma-enhanced chemical vapor deposition, Electronic engineering, Copper interconnect, Optoelectronics, Node (circuits), Parasitic extraction, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::78f866f42f2dc1939f7fea86854709e4
https://doi.org/10.1109/iedm.2006.346782

المؤلفون: G. Matusiewicz

المصدر: International Symposium for Testing and Failure Analysis.

مصطلحات موضوعية: Yield (engineering), Agronomy, Mathematics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f1bee8a903bf749e9db45b84ccd1c3d5
https://doi.org/10.31399/asm.cp.istfa1996p0371

المؤلفون: H.K. Birnbaum, J. Keiser, G. Matusiewicz, R. Booker

المصدر: Scripta Metallurgica. 8:1419-1425

مصطلحات موضوعية: Materials science, chemistry, Hydrogen, Diffusion, Metallurgy, General Engineering, Niobium, Stress relaxation, chemistry.chemical_element, Thermodynamics, Activation energy, Internal friction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::08906cbb223ca6aaf626ee9ef8f86a07
https://doi.org/10.1016/0036-9748(74)90183-5

المؤلفون: H.K. Birnbaum, G. Matusiewicz

المصدر: Metallurgical Transactions A. 13:1675-1678

مصطلحات موضوعية: Arrhenius equation, Range (particle radiation), Materials science, Hydrogen, Diffusion, Metallurgy, Metals and Alloys, chemistry.chemical_element, Thermodynamics, Atmospheric temperature range, Condensed Matter Physics, Thermal diffusivity, symbols.namesake, chemistry, Mechanics of Materials, symbols, Solubility, Solid solution

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::401fc874d69ddd7f5ae5ab4330312ee0
https://doi.org/10.1007/bf02647822

المؤلفون: David J. Duquette, G. Matusiewicz

المصدر: Acta Metallurgica. 33:1637-1641

مصطلحات موضوعية: Materials science, Hydrogen, Hydride, General Engineering, Analytical chemistry, chemistry.chemical_element, Electrochemistry, Diffusion layer, Condensed Matter::Materials Science, Nickel, chemistry, Lattice (order), Grain boundary diffusion coefficient, Effective diffusion coefficient

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c94bac70b09c8ff6200138728a33540
https://doi.org/10.1016/0001-6160(85)90159-2

المؤلفون: G Matusiewicz, H K Birnbaum

المصدر: Journal of Physics F: Metal Physics. 7:2285-2289

مصطلحات موضوعية: Arrhenius equation, Physics and Astronomy (miscellaneous), Hydrogen, Metals and Alloys, General Engineering, Niobium, chemistry.chemical_element, Thermodynamics, Atmospheric temperature range, symbols.namesake, chemistry, Deuterium, Kinetic isotope effect, symbols, Tritium, Diffusion (business), Nuclear chemistry

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5598e3d4549a2bad32e873092219d92a
https://doi.org/10.1088/0305-4608/7/11/009