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1Conference
المؤلفون: M., Bousquet, P., Perreau, G., Castellan, M., Bertucchi, C., Maeder-Pachurka, F., Delaguillaumie, A., Joulie, G., Enyedi, B., Sailler, D., Mariolle, P., Gergaud, A.M., Papon, F.-X, Darras, F., Mazen, P.S.P., Kuisseu, Y., Lamy, C., Billard, A., Reinhardt
المساهمون: Université Grenoble Alpes - CEA, LETI, MINATEC Campus, 38054 Grenoble, France
المصدر: IEEE International Ultrasonics Symposium ; https://cea.hal.science/cea-04548750 ; IEEE International Ultrasonics Symposium, 2020, ⟨10.1109/IUS46767.2020.9251463⟩
مصطلحات موضوعية: [PHYS]Physics [physics]
Relation: cea-04548750; https://cea.hal.science/cea-04548750
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2Academic Journal
المؤلفون: G. Enyedi, A. Csaszar, C. Bowers, A. Gopalan
المساهمون: The Pennsylvania State University CiteSeerX Archives
وصف الملف: application/pdf
Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.433.5185; http://www.rfc-editor.org/rfc/internet-drafts/draft-ietf-rtgwg-mrt-frr-algorithm-01.pdf
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3
المؤلفون: M. Pellat, J. Thooris, G. Enyedi, Frank Fournel, Pierre Montmeat, T. Enot
المساهمون: Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)
المصدر: International Journal of Adhesion and Adhesives
International Journal of Adhesion and Adhesives, Elsevier, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩
International Journal of Adhesion and Adhesives, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩مصطلحات موضوعية: 010302 applied physics, chemistry.chemical_classification, Thermoplastic, Materials science, Polymers and Plastics, Silicon, General Chemical Engineering, chemistry.chemical_element, 02 engineering and technology, engineering.material, 021001 nanoscience & nanotechnology, 01 natural sciences, Biomaterials, [SPI]Engineering Sciences [physics], chemistry, Coating, Chemical-mechanical planarization, 0103 physical sciences, engineering, Wafer, Adhesive, Composite material, 0210 nano-technology, Silicon oxide, Layer (electronics)
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4Academic Journal
المؤلفون: A. Atlas, R. Kebler, C. Bowers, G. Enyedi, A. Csaszar, J. Tantsura, M. Konstantynowicz, R. White
المساهمون: The Pennsylvania State University CiteSeerX Archives
وصف الملف: application/pdf
Relation: http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.432.8658; http://www.rfc-editor.org/rfc/internet-drafts/draft-ietf-rtgwg-mrt-frr-architecture-04.pdf
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7
المؤلفون: N. Sillon, N. Bouzaida, F. Jacquet, Jean Charbonnier, G. Enyedi, C. Brunet-Manquat, V. Lapras, David Henry, B. Aventurier
المصدر: 2008 2nd Electronics Systemintegration Technology Conference.
مصطلحات موضوعية: Materials science, Silicon, Hybrid silicon laser, business.industry, chemistry.chemical_element, chemistry, CMOS, Etching (microfabrication), Electronic engineering, Optoelectronics, Bumping, Wafer, business, Lithography, Wafer-level packaging
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8
المؤلفون: P Nagy, G Enyedi, L Nagy, Ágnes Király, Anita Illés
المصدر: Zeitschrift für Gastroenterologie. 46
مصطلحات موضوعية: Topical capsaicin, business.industry, Anesthesia, Healthy volunteers, Gastroenterology, Medicine, business
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9
المؤلفون: G. Enyedi
المصدر: Geoforum. 7:250-254
مصطلحات موضوعية: Geography, Sociology and Political Science, Rural sociology, Rural settlement, Socioeconomics, Rural development, Rural economics
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10
المؤلفون: G. Enyedi
المصدر: Geoforum. 1:96-97
مصطلحات موضوعية: Sociology and Political Science, business.industry, Political science, Regionalism (international relations), European integration, Single Euro Payments Area, International trade, business, European studies