المؤلفون: G. Druais, Aleksandar Radisic, P. Fischer, Gabriela Dilliway, O. Lühn, E. Guidotti, S. Zahraoui

المصدر: Microelectronic Engineering. 85:1957-1961

مصطلحات موضوعية: Interconnection, Materials science, business.industry, Electronic packaging, chemistry.chemical_element, Nanotechnology, Chemical vapor deposition, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Barrier layer, Stack (abstract data type), chemistry, Optoelectronics, Metallizing, Electrical and Electronic Engineering, business, Tin, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4ef075f38b3a878a3ea18e474ca4a7b4
https://doi.org/10.1016/j.mee.2008.06.004

المؤلفون: A. Roman, A. Seignard, Perrine Batude, C. Ribiere, O. Pollet, V. Benevent, E. Gourvest, M.-P. Samson, N. Rambal, Lucile Arnaud, L. Brunet, Hervé Denis, Y. Loquet, M. Vinet, V. Lapras, L. Emery, V. Lu, S. Maitrejean, Vincent Jousseaume, P. Besson, C.Fenouillet Beranger, G. Druais, C.Euvrard Colnat, Bernard Previtali, F. Deprat, R. Kachtouli, S. Kerdiles, Y.Le Friec, F. Aussenac

المصدر: Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.

مصطلحات موضوعية: Very-large-scale integration, Interconnection, Materials science, chemistry, Stability (learning theory), Electronic engineering, chemistry.chemical_element, Copper

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::479981eb26c9e73eb3604e339f643d59
https://doi.org/10.7567/ssdm.2015.k-4-3

المؤلفون: S. Chhun, R. Kachtouli, B. Mathieu, F. Aussenac, X. Garros, M. Casse, M.-P. Samson, A. Laurent, J.P. Barnes, L. Pasini, C. Reita, E. Richard, Claire Fenouillet-Beranger, M. Vinet, E. Petitprez, N. Guillot, Pascal Besson, Bernard Previtali, Fabrice Nemouchi, Perrine Batude, Pierre Perreau, V. Benevent, I. Toque-Tresonne, D. Barge, Laurent Brunet, Karim Huet, Sebastien Kerdiles, G. Druais, F. Deprat, H. Dansas, D. Lafond, V. Lu, N. Rambal

المصدر: 2014 IEEE International Electron Devices Meeting.

مصطلحات موضوعية: Very-large-scale integration, Materials science, business.industry, Doping, Transistor, Laser, law.invention, chemistry.chemical_compound, chemistry, law, MOSFET, Silicide, Electronic engineering, Optoelectronics, Thermal stability, Metal gate, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4900ebd2c14b7ee98c73dbf874dd9c82
https://doi.org/10.1109/iedm.2014.7047121

المؤلفون: B. Le-Gratiet, G. Druais, Denis Rideau, Marie-Anne Jaud, J.-D. Chapon, D. Hoguet, M. Mellier, L. Babaud, Clement Pribat, Emmanuel Josse, D. Barge, S. Puget, J. Mazurier, L. Grenouillet, Nicolas Loubet, S. Zoll, Thierry Poiroux, Jerome Simon, S.P. Fetterolf, M. Bidaud, S. Chhun, M. Vinet, Quanwei Liu, R. Bianchini, E. Bernard, J.-F. Kruck, X. Gerard, C. Gaumer, A. Pofelski, Francois Andrieu, Mustapha Rafik, Olivier Weber, N. Guillot, Pascal Gouraud, F. Abbate, O. Faynot, N. Degors, Olivier Gourhant, Antoine Cros, L. Parmigiani, E. Petitprez, J. Lacord, Patrick Scheer, C. Monget, Michel Haond, Evelyne Richard, P. Maury, Bruce B. Doris, M. Celik, Daniel Benoit, Frederic Monsieur, E. Baylac, L. Clément, S. Lagrasta, Magali Gregoire, J.-P. Manceau, S. Lasserre, P. Perreau, P. Brun, C. Gallon, V. Beugin, Remi Beneyton, Eric Perrin, S. Delmedico, R. Bingert

المصدر: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.

مصطلحات موضوعية: Very-large-scale integration, business.industry, Computer science, Transistor, Electrical engineering, law.invention, law, Logic gate, MOSFET, Dynamic demand, Electronic engineering, Static random-access memory, business, Electrical efficiency, Efficient energy use

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aedffd54e01f33ec4661fa88cc9e090c
https://doi.org/10.1109/vlsit.2014.6894343

المؤلفون: Francois Leverd, Y. Dodo, G. Druais, Perceval Coudrain, N. Guitard, L.L. Chapelon, A. Ostrovsky, O. Robin, E. Cirot, V. Caubet, J. Pruvost, K. Haxaire, Alexis Farcy, N. Hotellier, D. Riquet, T. Divel, Christophe Aumont, Jean Michailos, Sébastien Petitdidier, R. Liou, N. Sillon, C. Chaton, E. Saugier, Jean-Philippe Colonna, S. Cordova, Pascal Ancey, S. Cheramy

المصدر: 3DIC

مصطلحات موضوعية: Engineering, business.industry, Embedded system, Final product, Wireless, Integrated circuit packaging, Integrated circuit design, business, Partition (database), Manufacturing engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6fc10f3c978f1ad767396df021eae78e
https://doi.org/10.1109/3dic.2012.6262962

المؤلفون: S. Kohler, A.L. Mareau, Sebastien Cremer, Patrick Scheer, C. Charbuillet, Franck Arnaud, S. Colquhoun, F. Hasbani, S. Jeannot, G. Druais, R. Paulin

المصدر: 2011 International Electron Devices Meeting.

مصطلحات موضوعية: Engineering, High data rate, business.industry, Hardware_PERFORMANCEANDRELIABILITY, Capacitance, CMOS, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, System on a chip, Triple gate, business, Critical path method, Dram, Decoupling (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::05d0aed95b3868734d4224f26df49046
https://doi.org/10.1109/iedm.2011.6131562

المؤلفون: N. Sillon, Y. Guillou, Alexis Farcy, G. Druais, L.L. Chapelon, G. Garnier, E. Saugier, Y. Dodo, P. Leduc, Jean Charbonnier, David Henry, J. Pruvost, Pascal Ancey, S. Cheramy

المصدر: 3rd Electronics System Integration Technology Conference ESTC.

مصطلحات موضوعية: Wire bonding, Materials science, Lead bonding, CMOS, business.industry, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Electronic packaging, Wireless, Electrical measurements, Product (category theory), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cfd5b95424f8f3a727aa89edeae7c809
https://doi.org/10.1109/estc.2010.5642920

المؤلفون: Alexis Farcy, R. Hida, Paul-Henri Haumesser, N. Sillon, E. Saugier, Jean Charbonnier, M. Neyret, David Henry, R. Anciant, G. Garnier, S. Cheramy, C. Brunet-Manquat, Maxime Rousseau, G. Druais, O. Hajji, Laurent Vandroux, J. Cuzzocrea, P. Chausse

المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Silicon, Process (engineering), Process development, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Capacitance, Parasitic capacitance, Electrical resistance and conductance, chemistry, Plasma-enhanced chemical vapor deposition, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24dc21817bb7c28e8e8b7ef1ca805ca5
https://doi.org/10.1109/ectc.2010.5490835