المؤلفون: Li, Yanruoyue, Fu, Guicui, Wan, Bo, Wu, Zhaoxi, Yan, Xiaojun, Zhang, Weifang

المصدر: Soldering & Surface Mount Technology, 2021, Vol. 34, Issue 3, pp. 162-173.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2021-0012

المؤلفون: Yang, Yang, Guan, Shukai, Hong, Shimin, Wan, Bo, Fu, Guicui

المصدر: 2024 10th International Symposium on System Security, Safety, and Reliability (ISSSR)

الاتاحة: http://dx.doi.org/10.1109/isssr61934.2024.00006
http://xplorestaging.ieee.org/ielx8/10562059/10562060/10562117.pdf?arnumber=10562117

المؤلفون: Yang, Yanbo, Wan, Bo, Chen, Zhiqiang, Guan, Shukai, Fu, Guicui

المصدر: 2024 10th International Symposium on System Security, Safety, and Reliability (ISSSR)

الاتاحة: http://dx.doi.org/10.1109/isssr61934.2024.00074
http://xplorestaging.ieee.org/ielx8/10562059/10562060/10562104.pdf?arnumber=10562104

المؤلفون: Yang, Borui, Luo, Jun, Wan, Bo, Su, Yutai, Fu, Guicui, Long, Xu

المصدر: Computer Modeling in Engineering & Sciences ; volume 130, issue 2, page 1113-1134 ; ISSN 1526-1506

الاتاحة: http://dx.doi.org/10.32604/cmes.2022.018037
https://www.techscience.com/CMES/v130n2/45950/pdf

المؤلفون: Zhang, Zhongqing, Wan, Bo, Fu, Guicui, Su, Yutai, Wu, Zhaoxi, Wang, Xiangfen, Long, Xu

المصدر: Computer Modeling in Engineering & Sciences ; volume 139, issue 1, page 441-458 ; ISSN 1526-1506

الاتاحة: http://dx.doi.org/10.32604/cmes.2023.043616
https://www.techscience.com/CMES/v139n1/55129/pdf

المؤلفون: Yuan, Xi, Fu, Guicui, Zhang, Zhongqing, Wan, Bo

المصدر: IOP Conference Series: Materials Science and Engineering ; volume 1043, issue 3, page 032043 ; ISSN 1757-8981 1757-899X

الاتاحة: http://dx.doi.org/10.1088/1757-899x/1043/3/032043
https://iopscience.iop.org/article/10.1088/1757-899X/1043/3/032043
https://iopscience.iop.org/article/10.1088/1757-899X/1043/3/032043/pdf

المؤلفون: Luo, Jun, Guan, Shukai, Wan, Bo, Jiang, Maogong, Fu, Guicui

المصدر: IEEE Access ; volume 9, page 106270-106282 ; ISSN 2169-3536

الاتاحة: http://dx.doi.org/10.1109/access.2021.3098974
http://xplorestaging.ieee.org/ielx7/6287639/9312710/09492076.pdf?arnumber=9492076

المؤلفون: Jiang, Maogong, Fu, Guicui, Wan, Bo, Xue, Peng, Qiu, Yao, Li, Yanruoyue

المصدر: Soldering & Surface Mount Technology, 2017, Vol. 30, Issue 1, pp. 49-56.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-07-2017-0019

المؤلفون: Guan, Shukai, Liu, Qingsheng, Ji, Qizheng, Fu, Guicui

المساهمون: Yue, Yang, Xu, Shuwen

المصدر: Third International Conference on Digital Signal and Computer Communications (DSCC 2023)

الاتاحة: http://dx.doi.org/10.1117/12.2685590

المؤلفون: Wan, Bo, Wang, Ye, Su, Yutai, Fu, Guicui

المساهمون: China Scholarship Council

المصدر: IEEE Access ; volume 8, page 188154-188170 ; ISSN 2169-3536

الاتاحة: http://dx.doi.org/10.1109/access.2020.3031022
http://xplorestaging.ieee.org/ielx7/6287639/8948470/09223700.pdf?arnumber=9223700

المؤلفون: Guo, Wendi, Fu, Guicui, Wan, Bo, Zhu, Ming

المصدر: Guo , W , Fu , G , Wan , B & Zhu , M 2020 , ' Reconstruction of pressureless sintered micron silver joints and simulation analysis of elasticity degradation in deep space environment ' , Applied Sciences (Switzerland) , vol. 10 , no. 18 , 6368 . https://doi.org/10.3390/APP10186368

مصطلحات موضوعية: Deep space environment, Elastic mechanical properties, Extreme thermal shocks, Pressureless sintered micron silver joints, Reconstruction, Simulation

Relation: https://vbn.aau.dk/da/publications/da96002d-6717-400f-acf9-fb8be7026ed1

الاتاحة: https://vbn.aau.dk/da/publications/da96002d-6717-400f-acf9-fb8be7026ed1
https://doi.org/10.3390/APP10186368
http://www.scopus.com/inward/record.url?scp=85091814912&partnerID=8YFLogxK

المؤلفون: Liu, Xiaopeng, Zhang, Weifang, Liu, Xuerong, Dai, Wei, Fu, Guicui

المساهمون: Ministry of Industry and Information Technology of the People's Republic of China

المصدر: IEEE Access ; volume 7, page 156764-156778 ; ISSN 2169-3536

الاتاحة: http://dx.doi.org/10.1109/access.2019.2948291
http://xplorestaging.ieee.org/ielx7/6287639/8600701/08876693.pdf?arnumber=8876693

المؤلفون: Guan, Shukai, Wan, Bo, Zhong, Jingyang, Fu, Guicui, Wang, Xiangfen

المصدر: Microelectronics Reliability ; volume 150, page 115212 ; ISSN 0026-2714

الاتاحة: http://dx.doi.org/10.1016/j.microrel.2023.115212
https://api.elsevier.com/content/article/PII:S0026271423003128?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S0026271423003128?httpAccept=text/plain

المؤلفون: Zhang, Zhongqing, Wan, Bo, Fu, Guicui, Su, Yutai, Wu, Zhaoxi, Wang, Xiangfen, Long, Xu

المصدر: SSRN Electronic Journal ; ISSN 1556-5068

الاتاحة: http://dx.doi.org/10.2139/ssrn.4328064

المؤلفون: Ma, Cheng, Zhang, Sujuan, Fu, Guicui, Wan, Bo, Jiang, Maogong, Wang, Changcheng

المصدر: Journal of Physics: Conference Series ; volume 1074, page 012043 ; ISSN 1742-6588 1742-6596

الاتاحة: http://dx.doi.org/10.1088/1742-6596/1074/1/012043
http://stacks.iop.org/1742-6596/1074/i=1/a=012043/pdf
http://stacks.iop.org/1742-6596/1074/i=1/a=012043?key=crossref.3110e956473a36ab0a5d408327c58332

المؤلفون: Cheng, Yu, Fu, Guicui

المصدر: Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering

الاتاحة: http://dx.doi.org/10.2991/ic3me-15.2015.214

المؤلفون: Wang, Ye, Fu, Guicui, Tian, Pengcheng, Wan, Bo, Li, Jian, Song, Yong, Yu, Hongjun, Xue, Hailin, Che, Chuncheng, Huang, Dongsheng, Rong, Keyi, Su, Yutai, Chen, Weixiong, Li, Xin

المصدر: Engineering Failure Analysis ; volume 131, page 105892 ; ISSN 1350-6307

الاتاحة: http://dx.doi.org/10.1016/j.engfailanal.2021.105892
https://api.elsevier.com/content/article/PII:S1350630721007536?httpAccept=text/xml
https://api.elsevier.com/content/article/PII:S1350630721007536?httpAccept=text/plain

المؤلفون: Li, Yanruoyue, Fu, Guicui, Wan, Bo, Yan, Xiaojun, Zhang, Weifang

المصدر: Proceedings of the 2020 International Conference on Aviation Safety and Information Technology

الاتاحة: http://dx.doi.org/10.1145/3434581.3434665
https://dl.acm.org/doi/pdf/10.1145/3434581.3434665

المؤلفون: Yang, Borui, Fu, Guicui, Wan, Bo, Wang, Ye

المصدر: Proceedings of the 2020 International Conference on Aviation Safety and Information Technology

الاتاحة: http://dx.doi.org/10.1145/3434581.3434669
https://dl.acm.org/doi/pdf/10.1145/3434581.3434669

المؤلفون: Li, Yanruoyue, Fu, Guicui, Wan, Bo, Yan, Xiaojun, Zhang, Weifang, Li, Wei

المصدر: Journal of Electronic Materials ; volume 51, issue 1, page 259-272 ; ISSN 0361-5235 1543-186X

الاتاحة: http://dx.doi.org/10.1007/s11664-021-09287-8
https://link.springer.com/content/pdf/10.1007/s11664-021-09287-8.pdf
https://link.springer.com/article/10.1007/s11664-021-09287-8/fulltext.html