يعرض 1 - 20 نتائج من 70 نتيجة بحث عن '"Fong, King Yan"', وقت الاستعلام: 0.52s تنقيح النتائج
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    المساهمون: King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research award, Ernest S. Kuh Endowed Chair Professorship

    المصدر: Science ; volume 372, issue 6541, page 501-503 ; ISSN 0036-8075 1095-9203

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    Academic Journal

    المساهمون: Massachusetts Institute of Technology. Department of Physics, Massachusetts Institute of Technology. Department of Mechanical Engineering

    المصدر: Nature

    وصف الملف: application/pdf

    Relation: Nature Communications; https://hdl.handle.net/1721.1/136472

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    Conference

    المساهمون: Agio, Mario, Srinivasan, Kartik, Soci, Cesare

    المصدر: Quantum Photonic Devices 2018

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    المساهمون: NSF Nanoscale Science and Engineering Center, University of California, Berkeley, CA, USA, Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA, University of Hong Kong, Hong Kong, China

    Relation: http://www.nature.com/articles/s41566-019-0428-0; Li, H.-K., Fong, K. Y., Zhu, H., Li, Q., Wang, S., Yang, S., … Zhang, X. (2019). Valley optomechanics in a monolayer semiconductor. Nature Photonics, 13(6), 397–401. doi:10.1038/s41566-019-0428-0; 2-s2.0-85066098270; Nature Photonics; 397-401; http://hdl.handle.net/10754/678853; 13

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    المساهمون: Nanoscale Science and Engineering Center, University of California, Berkeley, CA, USA, Faculties of Science and Engineering, The University of Hong Kong, Hong Kong, China

    Relation: http://www.nature.com/articles/s41586-019-1800-4; Fong, K. Y., Li, H.-K., Zhao, R., Yang, S., Wang, Y., & Zhang, X. (2019). Phonon heat transfer across a vacuum through quantum fluctuations. Nature, 576(7786), 243–247. doi:10.1038/s41586-019-1800-4; 2-s2.0-85076379691; 7786; Nature; 243-247; http://hdl.handle.net/10754/678927; 576

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    المصدر: Nano Letters; Jun2019, Vol. 19 Issue 6, p3716-3722, 7p

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    Relation: http://repository.ust.hk/ir/Record/1783.1-8305; The 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2009), Shenzhen, China, pp.143-146, Jan 5-8

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