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1
المؤلفون: Li, Hangxi, 1994, Shiri, Daryoush, 1975, Kosen, Sandoko, 1991, Rommel, Marcus, 1987, Chayanun, Lert, 1990, Nylander, Andreas, 1988, Rehammar, Robert, 1980, Tancredi, Giovanna, 1981, Caputo, Marco, Grigoras, Kestutis, Gronberg, Leif, Govenius, Joonas, Bylander, Jonas, 1978
المصدر: Open Superconducting Quantum Computers (OpenSuperQPlus) An Open Superconducting Quantum Computer (OpenSuperQ) IEEE Transactions on Quantum Engineering. 4
مصطلحات موضوعية: Resonators, Finite element analysis, coplanar waveguide, Superconducting magnets, Frequency measurement, penetration depth, flip chip, Coplanar waveguides, Flip-chip devices, Qubit, superconducting resonator, kinetic inductance, quantum processor, Conformal mapping
وصف الملف: electronic
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2Academic Journal
المؤلفون: Tobias Lamprecht, Felix Betschon, Johan Bauwelinck, Joris Van Kerrebrouck, Joris Lambrecht, Holger Gaul, Alexander Eichler, Xin Yin
المصدر: IET Optoelectronics, Vol 15, Iss 2, Pp 92-101 (2021)
مصطلحات موضوعية: electro‐optical devices, elemental semiconductors, flip‐chip devices, integrated optics, optical polymers, optical switches, Applied optics. Photonics, TA1501-1820
وصف الملف: electronic resource
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3Academic Journal
المساهمون: Schroeder, Katlin [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)]
المصدر: IEEE Transactions on Applied Superconductivity; 27; 4
وصف الملف: Medium: ED; Size: 4 p.
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4Academic Journal
المؤلفون: VANDIER, Quentin, FREMONT, Helene, DROUIN, Dominique
المصدر: crossref
مصطلحات موضوعية: Sensors, Moisture, Flip-chip devices, Humidity, Moisture measurement, Carbon nanotubes, Relative humidity sensors, FC-PBGA, Moisture diffusion, Long-term high-humidity storage, Absorption, Ball grid arrays, Desorption, Finite difference methods, Multi-wall carbon nanotubes, Nanosensors, Flip chip plastic ball grid array (FC-PBGA), Relative humidity (RH) sensors, Sciences de l'ingénieur [physics]
Relation: oai:crossref.org:10.1109/tcpmt.2022.3226139; https://oskar-bordeaux.fr/handle/20.500.12278/173185
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5Academic Journal
المؤلفون: Ha, Hee-Bo, Lee, Byung Hoon, Qaiser, Nadeem, Seo, Youngjae, Kim, Jinyong, Koo, Ja Myeong, Hwang, Byungil
المساهمون: Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division, Electrical Engineering, Computer, Electrical and Mathematical Sciences, and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia, Electrical and Computer Engineering Program, KAUST Catalysis Center (KCC), KAUST Solar Center (KSC), Physical Science and Engineering (PSE) Division, School of Integrative Engineering, Chung-Ang University, Seoul 06974, Republic of Korea, Manufacturing Core Technology Team / Global Technology Research, Samsung Electronics, Suwon, Republic of Korea, School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
مصطلحات موضوعية: Engineering controlled terms: Anisotropy, Copper compounds, Electroless plating, Fabrication, Finite element method, Flip chip devices, Hot pressing, Integrated circuit interconnects, Network components, Polyimides, Soldering, Engineering uncontrolled terms: Anisotropic conductive films, Array film, Electronic component, Finite elements simulation, Flexible, Flexible polyimide, Interconnect, Interconnection systems, Microdumbbell array, Polyimide film, Engineering main heading: Flexible electronics
Relation: https://linkinghub.elsevier.com/retrieve/pii/S0966979522000760; Ha, H.-B., Lee, B. H., Qaiser, N., Seo, Y., Kim, J., Koo, J. M., & Hwang, B. (2022). Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics. Intermetallics, 144, 107535. https://doi.org/10.1016/j.intermet.2022.107535; 2-s2.0-85126555158; Intermetallics; 107535; http://hdl.handle.net/10754/676339; 144
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6Academic JournalSilicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
المؤلفون: Ermolov, Vladimir, Lamminen, Antti, Varonen, Mikko, Ailas, Henri, Lahti, Markku, Forstén, Henrik, Kaunisto, Mikko, Kantanen, Mikko, Parveg, Dristy, Pursula, Pekka
المصدر: Ermolov , V , Lamminen , A , Varonen , M , Ailas , H , Lahti , M , Forstén , H , Kaunisto , M , Kantanen , M , Parveg , D & Pursula , P 2024 , Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits . in 2024 54th European Microwave Conference (EuMC) . , 10732737 , Wiley-IEEE Press , pp. 581-584 , 54th European Microwave Conference, EuMC 2024 , Paris , France , 24/09/24 . https://doi.org/10.23919/EuMC61614.2024.10732737
مصطلحات موضوعية: Fabrication, Wafer bonding, Costs, Integrated circuit interconnections, Packaging, Silicon, Sensors, Flip-chip devices, Standards, Terahertz communications, micromachining, terahertz (THz), integration, /dk/atira/pure/sustainabledevelopmentgoals/industry_innovation_and_infrastructure, name=SDG 9 - Industry, Innovation, and Infrastructure
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7Academic Journal
المؤلفون: Ermolov, Vladimir, Lamminen, Antti, Saarilahti, Jaakko, Varonen, Mikko, Kantanen, Mikko, Lahti, Markku, Pursula, Pekka
المصدر: Ermolov , V , Lamminen , A , Saarilahti , J , Varonen , M , Kantanen , M , Lahti , M & Pursula , P 2024 , ' Wafer Level Integration of Sub-THz and THz Systems ' , IEEE Microwave and Wireless Technology Letters , vol. 34 , no. 2 , pp. 187-190 . https://doi.org/10.1109/LMWT.2023.3341169
مصطلحات موضوعية: Coplanar waveguides, Electromagnetic waveguides, Fabrication, Flip-chip devices, Integration, micromachining, Probes, Semiconductor device measurement, Silicon, terahertz (THz), /dk/atira/pure/sustainabledevelopmentgoals/industry_innovation_and_infrastructure, name=SDG 9 - Industry, Innovation, and Infrastructure
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8
المؤلفون: Kieler, Oliver, Tian, Hao, Kraus, Marco, Priyadarshi, Shekhar, Felgner, Judith, Fernández Scarioni, Alexander, Kohlmann, Johannes, Bieler, Mark
المساهمون: Physikalisch-Technische Bundesanstalt (PTB)
مصطلحات موضوعية: photodiodes, gold stud bumps, flip chip devices, superconducting quantum circuits, cryo-electronics, AC Josephson Voltage Standard, Josephson Arbitrary Waveform Synthesizer, INSPEC A0620 Metrology, INSPEC E1810 Packaging
وصف الملف: application/zip
الاتاحة: https://doi.org/10.7795/720.20240226
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9
المؤلفون: Saif Wakeel, A. S. M. A. Haseeb, Khoo Ly Hoon, M. A. Amalina
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1386-1394
مصطلحات موضوعية: Flip-chip devices, High temperature storage life, No-clean flux, Thermal cycling, Reliability, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Sensitivity, Moisture sensitivity, Delamination, Underfill delamination, Electrical and Electronic Engineering, Reliability analysis, Electronic packaging thermal management, Copper, Moisture
وصف الملف: application/pdf
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10Conference
المؤلفون: Timoneda i Comas, Xavier, Cabellos Aparicio, Alberto, Manessis, Dionyssios, Alarcón Cot, Eduardo José, Abadal Cavallé, Sergi
المساهمون: Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors, Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica, Universitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla, Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits
مصطلحات موضوعية: Àrees temàtiques de la UPC::Informàtica::Arquitectura de computadors, Wireless communications systems, Networks on a chip, Channel Characterization, Flip-chip package, Mm-Wave Propagation, Wireless Network-on-Chip, Economic and social effects, Flip chip devices, Microprocessor chips, Microwave antennas, Millimeter waves, Servers, Wireless interconnects, Information transfers, Interchip communications, Millimeter-wave antennas, Package configurations, Transmitter and receiver, Chip scale packages, Comunicació sense fil, Sistemes de
وصف الملف: 8 p.
Relation: https://ieeexplore.ieee.org/document/8512172; info:eu-repo/grantAgreement/MINECO/1PE/PCIN-2015-012; info:eu-repo/grantAgreement/AEI/TEC2017-90034-C2-1-R; info:eu-repo/grantAgreement/EC/H2020-736876-VISORSURF; info:eu-repo/grantAgreement/ICREA/V PRI/ICREA ACADEMIA 2016-02; Timoneda, X., Cabellos-Aparicio, A., Manessis, D., Alarcón, E., Abadal, S. Channel characterization for chip-scale wireless communications within computing packages. A: IEEE/ACM International Symposium on Networks-on-Chip. "2018 Twelfth IEEE/ACM International Symposium on Networks-on-Chip (NOCS): Torino, Italy, 4-5 October 2018". Institute of Electrical and Electronics Engineers (IEEE), 2018, p. 1-8.; http://hdl.handle.net/2117/125964
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11
المؤلفون: Xie, Li, Shen, Jue, Mao, Jia, Jonsson, Fredrik, Zheng, Lirong
المصدر: 2011 61st Electronic Components and Technology Conference, ECTC 2011 Electronic Components and Technology Conference. :1752-1757
مصطلحات موضوعية: ACF interconnect, RFID receiver, anisotropic conductive adhesives, anisotropic conductive film, circuit design, de-embedded technology, electrical characteristics, equivalent circuit model, flip chip interconnection codesign, four-point measurement structure, impedance parameter, inkjet-printed circuit, interconnect material, matching network, paper substrate, paper-based UHF RFID tag, paper-based electronic system, radio frequency performance, time domain reflectometry, vector network analyzer, flip-chip devices, radiofrequency identification
وصف الملف: electronic
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12Academic Journal
المؤلفون: Li, Teng, Li, Chenhui, Nab, Jasper, Stabile, Ripalta, Raz, Oded
المصدر: Li , T , Li , C , Nab , J , Stabile , R & Raz , O 2019 , ' A 100 Gbps optical transceiver engine by using photo-imageable thick film on ceramics ' , IEEE Photonics Technology Letters , vol. 31 , no. 24 , 8897650 , pp. 1999-2002 . https://doi.org/10.1109/LPT.2019.2953267
مصطلحات موضوعية: Ceramics, chip scale packaging, flip-chip devices, optical receivers, optical transmitters, photo-imageable thick film technologies
وصف الملف: application/pdf
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13Academic Journal
المؤلفون: Genç, M., Sheremet, V. N., Elçi, M., Kasapoğlu, Ahmet Emre, Altuntaş, İsmail, Demir, İlkay, Eğin, G., İslamoğlu, S., Gür, Emre Y., Muzafferoğlu, N., Elagöz, Sezai, Gülseren, Oğuz
المساهمون: Mühendislik Fakültesi, Elektrik Elektronik Mühendisliği Bölümü, Aydınlı, Atilla, ABI-7535-2020, 7005432613
مصطلحات موضوعية: Electric resistance, Physics, Electroluminescence, Light-emitting-diodes, Flip chip devices, Light emitting diodes, Gallium nitride, Series resistances, Iii-v semiconductors, Power out put, Light, Minimum value, Luminescence, Light emitting diode (leds), Ohmic contacts, Electroluminescence emission, Current distribution, Device configurations, Current injections, condensed matter, Flip Chip, Extraction Efficiency
Relation: Makale - Uluslararası Hakemli Dergi; Superlattices and Microstructures; Yurt içi; Sanayi; https://doi.org/10.1016/j.spmi.2019.01.008; https://www.sciencedirect.com/science/article/pii/S0749603618320330?via%3Dihub; https://hdl.handle.net/11452/38878; 000463693300002; 13; 128
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14Academic Journal
المؤلفون: Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
المصدر: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS ; ISSN: 1077-260X ; ISSN: 1558-4542
مصطلحات موضوعية: Technology and Engineering, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Flip-chip devices, hybrid integrated circuits, semiconductor lasers, silicon photonics
وصف الملف: application/pdf
Relation: https://biblio.ugent.be/publication/01H932SCFQS1P5AMB5Y5CBP6CA; http://doi.org/10.1109/jstqe.2022.3223641; https://biblio.ugent.be/publication/01H932SCFQS1P5AMB5Y5CBP6CA/file/01H932W1XQSTVANJMWBNNXN8SD
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15Conference
المؤلفون: Rausch, Marko, Flisgen, Thomas, Stölmacker, Christoph, Stranz, Andrej, Thies, Andreas, Doerner, Ralf, Yacoub, Hady, Heinrich, Wolfgang
مصطلحات موضوعية: Flip-chip devices, heterobipolar transistor, indium phosphide (InP), millimeter-wave (mm-wave) integrated circuits, semiconductor device packaging
Relation: European Microwave Conference 2022; #PLACEHOLDER_PARENT_METADATA_VALUE#; 52nd European Microwave Conference 2022; https://publica.fraunhofer.de/handle/publica/446092
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16Academic Journal
المؤلفون: Wakeel, Saif, Haseeb, A. S. M. A., Hoon, Khoo Ly, Amalina, M. A.
مصطلحات موضوعية: Copper, Delamination, Electronic packaging thermal management, Flip-chip devices, High temperature storage life, Moisture, Moisture sensitivity, No-clean flux, Reliability, Reliability analysis, Sensitivity, Thermal cycling, Underfill delamination
وصف الملف: application/pdf
Relation: Wakeel, S., Haseeb, A. S. M. A., Hoon, K. L. and Amalina, M. A. (2022) 'Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars', IEEE Transactions on Components Packaging and Manufacturing Technology, 12(8), pp. 1386-1394. doi:10.1109/TCPMT.2022.3191604; 1394; IEEE Transactions on Components Packaging and Manufacturing Technology; 1386; http://hdl.handle.net/10468/13581; 12
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17Conference
المؤلفون: Perniola, L., Noe, Pascal, Hubert, Q., Souiki, S., Ghezzi, G., Navarro, G., Cabrini, A., Persico, A., Delaye, V., Blachier, D., Barnes, J.-P., Henaff, E., Tessaire, M., Souchier, E., Roule, A., Fillot, F., Ferrand, J., Fargeix, A., Hippert, F., Raty, Jean-Yves, Jahan, C., Sousa, V., Torelli, G., Maitrejean, S., De Salvo, B., Reimbold, G.
المصدر: Technical Digest - International Electron Devices Meeting, IEDM, 18.7.1-18.7.4 (2012); 2012 IEEE International Electron Devices Meeting, IEDM 2012, 10 December 2012 through 13 December 2012
مصطلحات موضوعية: C-doping, End-of-line, Original design, Phase stable, Physical-chemical analysis, Precoding, Thermal budget, Top layers, Electron devices, Lead, Phase change memory, Soldering, Flip chip devices, Engineering, computing & technology, Materials science & engineering, Ingénierie, informatique & technologie, Science des matériaux & ingénierie
Relation: urn:issn:0163-1918
URL الوصول: https://orbi.uliege.be/handle/2268/164096
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18Conference
المؤلفون: Gonzalez, Mario, Vandevelde, Bart, Christiaens, Wim, Hsu, Yung Yu, Iker, Francois, Bossuyt, Frederick, Vanfleteren, Jan, Van der Sluis, Olaf, Timmermans, Pieter
المصدر: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings ; ISBN: 9781424470266 ; ISBN: 9781424470273
مصطلحات موضوعية: Technology and Engineering, finite element analysis, electronics packaging, flexible electronics, flip-chip devices, thermomechanical treatment, thermo-mechanical analysis, stretchable electronics, ultra thin dies, finite element modeling, chip embedding, ultra thin chip package
وصف الملف: application/pdf
Relation: https://biblio.ugent.be/publication/1071525; http://hdl.handle.net/1854/LU-1071525; http://doi.org/10.1109/ESIME.2010.5464566; https://biblio.ugent.be/publication/1071525/file/1071591
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19
المؤلفون: Hansen, K., Klar, H., Kalavakuru, P., Reckleben, C., Venzmer, A., Wustenhagen, E., Schappeit, R., Zeides, O. -C, Okrent, F., Wunderer, C., Lemke, M., Graafsma, H., Schlosser, I., Manghisoni, M., Riceputi, E., Aschauer, S., Struder, L., Soldat, J., Tangl, M., Erdinger, F., Kugel, A., Fischer, P., Andricek, L., Ninkovic, J., Turcato, M., Porro, M.
المصدر: IEEE Transactions on Nuclear Science. 66(8):1966-1975
مصطلحات موضوعية: Adhesive strength, assembly, circuit testing, hybrid integrated circuits, image sensor, metrology, packaging technology, X-ray detector, Adhesives, Flip chip devices, Heating equipment, Image sensors, Integrated circuit testing, Measurement, Pixels, Spreaders, Statistics, Temperature, Experimental investigations, Low temperature co-fired ceramics, On-board temperatures, Packaging technologies, Signal compression, Standard deviation, X ray detectors
وصف الملف: print
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20Conference
المؤلفون: Oralkan, Ömer, Ergün, Arif Sanlı, Cheng, Ching-Hsiang, Johnson, Jeremy A., Karaman, Mustafa, Lee, Thomas H., Khuri-Yakub, Butrus Thomas
مصطلحات موضوعية: 2D capacitive US transducer arrays, 2D CMUT array, Bonding, Capacitive micromachined, Capacitive micromachined ultrasonic transducer, Data acquisition, Dense 2D arrays, Fabrication, Flip chip devices, Flip-chip bonding, Flip-chip devices, Glass fanout chip, Integrated circuit interconnections, Interconnections, Laboratories, Medical imaging, Micromachined ultrasonic transducer arrays, Micromachining, Phased arrays, Photolithography, Polysilicon, Si, Si micromachining processes, Silicon, Silicon wafers, Spatial resolution, Through-wafer via interconnects, Ultrasonic imaging, Ultrasonic transducer arrays, Ultrasonic transducers
وصف الملف: application/pdf
Relation: Proceedings of the IEEE Ultrasonics Symposium; Konferans Öğesi - Uluslararası - Kurum Öğretim Elemanı; Oralkan, O., Ergün, A. S., Cheng, C.-H., Johnson, J. A., Karaman, M., Lee, T. H. & Khuri-Yakub, B. T. (2002). Volumetric imaging using 2D capacitive micromachined ultrasonic transducer arrays (CMUTs): Initial results. Paper presented at the , 2 1083-1086 vol.2. doi:10.1109/ULTSYM.2002.1192483; https://hdl.handle.net/11729/2059; https://dx.doi.org/10.1109/ULTSYM.2002.1192483; 1083; 1086; N/A; WOS:000182111700242; 2-s2.0-0036992266
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