المؤلفون: Shaw, J., Guldi, R., Kim, T., Corum, D., Ritchison, J., Oestreich, S., Lin, J., Weiner, K., Davis, K., Fiordalice, R.

المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ; page 33-35

الاتاحة: http://dx.doi.org/10.1109/iitc.2002.1014878
http://xplorestaging.ieee.org/ielx5/7918/21830/01014878.pdf?arnumber=1014878

المؤلفون: Hayzelden, C., Ygartua, C., Casavant, T., Slessor, M., Srivatsa, A., Guevremont, M., Stevens, P., Young, M., Lu, T., Zhang, R., Treadwell, C., Soltz, D., Lauber, J., Krumbuegel, M., Fiordalice, R., Lange, S., Marella, R., Ashkenaz, S., Monahan, K., Tran, T.K., Jihperng Leu

المصدر: Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) ; page 121-124

الاتاحة: http://dx.doi.org/10.1109/issm.2000.993630
http://xplorestaging.ieee.org/ielx5/7795/21435/00993630.pdf?arnumber=993630

المؤلفون: Zhang, J., Denning, D., Braeckelmann, G., Venkatraman, R., Fiordalice, R., Weitzman, E.

المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) ; page 163-165

الاتاحة: http://dx.doi.org/10.1109/iitc.1998.704780
http://xplorestaging.ieee.org/ielx4/5680/15206/00704780.pdf?arnumber=704780

المؤلفون: Fiordalice, R., Blumenthal, R., Fernandes, M., Garcia, S., Gelatos, J., Kawasaki, H., Klein, J., Marsh, R., Ong, T., Venkatraman, R., Weitzman, E., Pintchovski, F.

المصدر: 1996 Symposium on VLSI Technology. Digest of Technical Papers ; page 42-43

الاتاحة: http://dx.doi.org/10.1109/vlsit.1996.507786
http://xplorestaging.ieee.org/ielx5/3767/11001/00507786.pdf?arnumber=507786

المؤلفون: White, Ted R., Ciosek, W. J., Prinz, E. J., King, Charles F., Blumenthal, R., Stager, Charles W., Somero, B. M., Woo, M. P., Sharma, U., Fiordalice, R. W., Klein, Jeff L.

المساهمون: Hoang, Hoang H., Schutz, Ron, Bernstein, Joseph B., Vasquez, Barbara

المصدر: SPIE Proceedings ; Multilevel Interconnection: Issues That Impact Competitiveness ; ISSN 0277-786X

الاتاحة: http://dx.doi.org/10.1117/12.156513

المؤلفون: Venkatraman, R., Jain, A., Farkas, J., Mendonca, J., Hamilton, G., Capasso, C., Denning, D., Simpson, C., Rogers, B., Frisa, L., Ong, T. P., Herrick, M., Kaushik, V., Gregory, R., Apen, E., Angyal, M., Filipiak, S., Crabtree, P., Sparks, T., Anderson, S., Coronell, D., Islam, R., Smith, B., Fiordalice, R., Kawasaki, H., Klein, J., Venkatesan, S., Weitzman, E.

المصدر: MRS Proceedings ; volume 514 ; ISSN 0272-9172 1946-4274

الاتاحة: http://dx.doi.org/10.1557/proc-514-41
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400256650

المؤلفون: Ong, T. P., Fiordalice, R., Venkatraman, R., Garcia, S., Jain, A., Sparks, T., Farkas, J., Fernandes, M., Gall, M., Jawarani, D., Klein, J., Weitzman, E., Kawasaki, H., Wu, Wei, Blumenthal, R., Pintchovski, F., Marsh, R., Zhang, P., Zhang, H., Guo, T., Mosely, R.

المصدر: Applied Physics Letters ; volume 73, issue 1, page 82-84 ; ISSN 0003-6951 1077-3118

الاتاحة: http://dx.doi.org/10.1063/1.121731
https://pubs.aip.org/aip/apl/article-pdf/73/1/82/18534943/82_1_online.pdf

المؤلفون: Wetzel, J. T., Lii, Y. T., Filipiak, S. M., Nguyen, B.-Y., Travis, E. O., Fiordalice, R. W., Winkler, M. E., Lee, C. C., Peschke, J.

المصدر: MRS Proceedings ; volume 381 ; ISSN 0272-9172 1946-4274

الاتاحة: http://dx.doi.org/10.1557/proc-381-217
https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S194642740030327X

المؤلفون: Henry, T., Price, D.W., Fiordalice, R.

المصدر: 2003 5th International Conference on ASIC. Proceedings (IEEE Cat. No.03TH8690); 2003, p396-399, 4p

المؤلفون: Guldi, R.L., Shaw, J.B., Ritchison, J., Oestreich, S., Davis, K., Fiordalice, R.

المصدر: 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science & Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259); 2002, p351-355, 5p

المؤلفون: Hayzelden, C., Ygartua, C., Casavant, T., Slessor, M., Srivatsa, A., Guevremont, M., Stevens, P., Young, M., Lu, T., Zhang, R., Treadwell, C., Soltz, D., Lauber, J., Krumbuegel, M., Fiordalice, R., Lange, S., Marella, R., Ashkenaz, S., Monahan, K., Tran, T.K.

المصدر: Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130); 2000, p121-124, 4p

المؤلفون: White, Ted R., Ciosek, W. J., Prinz, E. J., King, Charles F., Blumenthal, R., Stager, Charles W., Somero, B. M., Woo, M. P., Sharma, U., Fiordalice, R. W., Klein, Jeff L.

المصدر: Proceedings of SPIE; Nov1993, Issue 1, p93-102, 10p

المؤلفون: Shaw, J., Guldi, R., Kim, T., Corum, D., Ritchison, J., Oestreich, S., Lin, J., Weiner, K., Davis, K., Fiordalice, R.

المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519); 2002, p33-35, 3p

المؤلفون: Kottke, M., Travis, E. O., Rogers, B. R., Pintchovski, F., Fiordalice, R.

المصدر: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1992, Vol. 10 Issue 3, p1124-1132, 9p

المؤلفون: Zhang, J., Denning, D., Braeckelmann, G., Venkatraman, R., Fiordalice, R., Weitzman, E.

المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat No98EX102); 1998, p163-165, 3p

المؤلفون: Fiordalice, R., Blumenthal, R., Fernandes, M., Garcia, S., Gelatos, J., Kawasaki, H., Klein, J., Marsh, R., Ong, T., Venkatraman, R., Weitzman, E., Pintchovski, F.

المصدر: 1996 Symposium on VLSI Technology Digest of Technical Papers; 1996, p42-43, 2p

المؤلفون: Travis, E. O., Fiordalice, R. W.

المصدر: Thin Solid Films; 1993, Vol. 236 Issue: 1 p325-325, 1p