المؤلفون: Ching-Chia Chen, Wen-Yu Teng, Fang Lin Tsai, Jackson Lee, Liang Yih Hung, Don Son Jiang, Yu-Po Wang

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0e5d86c27b5b0d76196804ff9da5535b
https://doi.org/10.1109/eptc56328.2022.10013253

المؤلفون: Jay Lia, Fang-Lin Tsai, Jackson Li, George Pan, Mu-Hsuan Chan, Louise Zheng, Steven Chen, Nicholas Kao, David Lai, Katch Wan, Yu-Po Wang

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ee3b2504cf1b00fd68ef6bf2ae12ad94
https://doi.org/10.1109/eptc53413.2021.9663974

المؤلفون: Don San Jiang, Ivan Chang, Eason Chen, Fang Lin Tsai, Wan Yu Huang, Eve Lee, Yu Po Wang, Roben Huang, James Chiang

المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

مصطلحات موضوعية: Thermal copper pillar bump, Wire bonding, Interconnection, Engineering, business.industry, Hardware_PERFORMANCEANDRELIABILITY, Die (integrated circuit), System in package, Ball grid array, Package on package, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Optoelectronics, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::34df8a0317c19b38b93751b102c61d56
https://doi.org/10.1109/impact.2009.5382160

المؤلفون: Wan Yu Huang, Chen, E., Don San Jiang, Yu Po Wang, Chiang, J., Fang Lin Tsai, Huang, R., Lee, E., Chang, I.

المصدر: 2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p140-143, 4p