المؤلفون: Qian, Cheng (author), Fan, Jiajie (author), Fang, Jiayi (author), Yu, Chaohua (author), Ren, Y. (author), Fan, Xuejun (author), Zhang, Kouchi (author)

مصطلحات موضوعية: Accelerated aging, Chip scale package, Light-emitting diode, Reliability qualification, Step stress test

Relation: http://resolver.tudelft.nl/uuid:70bdeffb-22dd-4b9f-bf7c-4a8a24ed902c; http://www.scopus.com/inward/record.url?scp=85032876691&partnerID=8YFLogxK; Materials--1996-1944--2a0ac4c2-b5aa-42cf-8cde-af414a2a130d; https://doi.org/10.3390/ma10101181

الاتاحة: http://resolver.tudelft.nl/uuid:70bdeffb-22dd-4b9f-bf7c-4a8a24ed902c
https://doi.org/10.3390/ma10101181