المؤلفون: Jin, Shuai, Liu, Dazhao, Wang, Yansheng, Chen, Bichen, Fan, Jun

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Ball grid arrays, Cavity resonators, Current density, Electric conductors, Electric impedance, Electronics packaging, Extraction, Frequency modulation, Inductance, Semiconductor device testing, Soldered joints, Cavity method, Equivalent inductance, Finite element method simulation, Modal expansion, Parallel plates, Power Distribution Network Design, Power integrity, Proximity effects, Finite element method, Analytical solution, Application-specified integrated circuit (ASIC) package, Ball grid array (BGA), Equivalent ball inductances, Parallel plate impedance, Electromagnetics and Photonics

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/3554; https://doi.org/10.1109/TEMC.2017.2782713

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/3554
https://doi.org/10.1109/TEMC.2017.2782713