المؤلفون: Gharaibeh, Mohammad A.

المصدر: Microelectronics International, 2023, Vol. 41, Issue 3, pp. 121-129.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/MI-02-2023-0014

المؤلفون: Stoukatch, Serguei, Dupont, François, Laurent, Philippe, Redouté, Jean-Michel

المصدر: Materials, 16 (18), 6202 (2023-09-14)

مصطلحات موضوعية: thermal modeling, thermal management of electronic packages, finite element modeling (FEM), MOX sensor packaging, microassembly, Engineering, computing & technology, Electrical & electronics engineering, Ingénierie, informatique & technologie, Ingénierie électrique & électronique

Relation: https://www.mdpi.com/1996-1944/16/18/6202/pdf; urn:issn:1996-1944

URL الوصول: https://orbi.uliege.be/handle/2268/306564

المؤلفون: Chang-Uk Ahn, Seungin Oh, Hwi-Su Kim, Dong Il Park, Jin-Gyun Kim

المصدر: IEEE Access, Vol 10, Pp 50589-50600 (2022)

مصطلحات موضوعية: Electronic packages, finite element method, inverse heat conduction problem, ridge estimator, Tikhonov regularization, virtual thermal sensor, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9772635/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/a5ca0bd451a748abb4ca19649e4f86ed

المؤلفون: Vance Liu, Chien-Ming Chen, Joyce Chen, Min-Hua Chung, Chong Leong Gan

المصدر: Memories - Materials, Devices, Circuits and Systems, Vol 3, Iss , Pp 100018- (2022)

مصطلحات موضوعية: Package strength, Three-point bending, Drop impact test, Memory electronic packages, Mobile application, Probabilistic mechanics, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4, Computer engineering. Computer hardware, TK7885-7895

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2773064622000123; https://doaj.org/toc/2773-0646

URL الوصول: https://doaj.org/article/b32e7b09622248b5b05f948bf42b66d2

المؤلفون: Kamil Maliński, Krzysztof Okarma

المصدر: Journal of Universal Computer Science, Vol 26, Iss 4, Pp 479-495 (2020)

مصطلحات موضوعية: shape analysis, electronic packages, image feature, Electronic computers. Computer science, QA75.5-76.95

وصف الملف: electronic resource

Relation: https://lib.jucs.org/article/24010/download/pdf/; https://lib.jucs.org/article/24010/download/xml/; https://lib.jucs.org/article/24010/; https://doaj.org/toc/0948-6968

URL الوصول: https://doaj.org/article/18f4fa9310ab4db387911a7261b32b67

المؤلفون: Lorenzo Codecasa, Francesca De Viti, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa

المصدر: Energies; Volume 13; Issue 9; Pages: 2252

مصطلحات موضوعية: electronic packages, detailed thermal model, Joint Electron Device Engineering Council (JEDEC) metrics, thermal impedance, thermal simulation

وصف الملف: application/pdf

Relation: E: Thermal Management; https://dx.doi.org/10.3390/en13092252

الاتاحة: https://doi.org/10.3390/en13092252

المؤلفون: Waluyo Adi Siswanto, Krasnopevtsev, A. Yu., Ghazal Feizi Talarpoushti, Andino Maseleno, Kuzichkin, O. R.

مصطلحات موضوعية: physics, electricity, solder joint, AC current, degradation, mechanical properties, electric current, electronic packages

Relation: Role of alternating current shape on microstructure and damage evolution of solder joints / Waluyo Adi Siswanto [et al.] // Journal of Manufacturing Processes. - 2020. - Vol.50.-P. 450-455. - Doi:10.1016/j.jmapro.2019.12.041. - Refer.: p. 454-455.; http://dspace.bsu.edu.ru/handle/123456789/42728

الاتاحة: http://dspace.bsu.edu.ru/handle/123456789/42728

المؤلفون: Chang-uk Ahn (11683576), Hwi-Su Kim (11683781), Seungin Oh (11683793), Jin-Gyun Kim (11683824), Dong Il Park (11683830)

مصطلحات موضوعية: Computing and Processing, Virtual thermal sensor, electronic packages, finite element method, Inverse Heat Conduction Problem, Tikhonov regularization, ridge estimator

Relation: https://figshare.com/articles/preprint/Virtual_Thermal_Sensor_for_Real-Time_Monitoring_of_Electronic_Packages_in_a_Totally_Enclosed_System/16992907

الاتاحة: https://doi.org/10.36227/techrxiv.16992907.v1

المؤلفون: Lorenzo Codecasa, Salvatore Race, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa

المصدر: Energies; Volume 12; Issue 6; Pages: 1050

مصطلحات موضوعية: electronic packages, JEDEC metrics, model-order reduction, thermal simulation

وصف الملف: application/pdf

Relation: J: Thermal Management; https://dx.doi.org/10.3390/en12061050

الاتاحة: https://doi.org/10.3390/en12061050

المؤلفون: Jacques, Sebastien

المساهمون: GREMAN (matériaux, microélectronique, acoustique et nanotechnologies) (GREMAN - UMR 7347), Université de Tours (UT)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)

المصدر: System Reliability ; https://univ-tours.hal.science/hal-01678040 ; System Reliability, 2017, ⟨10.5772/intechopen.69611⟩

مصطلحات موضوعية: discrete power electronic packages, bonding techniques, wire and ribbon, thermal cycling, power cycling, reliability, [SPI.NRJ]Engineering Sciences [physics]/Electric power, [SPI.TRON]Engineering Sciences [physics]/Electronics

Relation: hal-01678040; https://univ-tours.hal.science/hal-01678040; https://univ-tours.hal.science/hal-01678040/document; https://univ-tours.hal.science/hal-01678040/file/55975.pdf

الاتاحة: https://univ-tours.hal.science/hal-01678040
https://univ-tours.hal.science/hal-01678040/document
https://univ-tours.hal.science/hal-01678040/file/55975.pdf
https://doi.org/10.5772/intechopen.69611

المؤلفون: Jacob Elias, S. Jayesh

المصدر: Protection of Metals and Physical Chemistry of Surfaces. 57:858-865

مصطلحات موضوعية: Materials science, Organic Chemistry, Metallurgy, Alloy, Metals and Alloys, engineering.material, Microstructure, Surfaces, Coatings and Films, Corrosion, Electrochemical migration, Electronic packages, Soldering, Materials Chemistry, engineering, Lead (electronics), Solder alloy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::33a8ec97e0d7419fff39ac11a6da39c9
https://doi.org/10.1134/s2070205121040110

المؤلفون: Yang, Liyu, Bernstein, Joseph

المصدر: Microelectronics International: An International Journal, 2012, Vol. 29, Issue 1, pp. 15-21.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/13565361211219121

المؤلفون: Pranit Deshmukh, Eli Gurevich

المصدر: Journal of Electronic Testing. 36:445-460

مصطلحات موضوعية: Measurement method, Interconnection, Computer science, Interface (computing), 020208 electrical & electronic engineering, Industry standard, Mechanical engineering, 02 engineering and technology, Solder ball, 020202 computer hardware & architecture, Electronic packages, 0202 electrical engineering, electronic engineering, information engineering, Carrying capacity, Electrical and Electronic Engineering, Current (fluid)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d23b1d210a1a65865fe1fec44a6f64b7
https://doi.org/10.1007/s10836-020-05896-z

المؤلفون: André Zimmermann, Paul B. Matteucci, Adrian Schwenck, Thomas Gunther, R. Leigh, Gregg J. Suaning, Martin Svehla

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:351-359

مصطلحات موضوعية: Nuclear engineering, chemistry.chemical_element, 02 engineering and technology, Microencapsulations, 021001 nanoscience & nanotechnology, Industrial and Manufacturing Engineering, Leak testing, Electronic, Optical and Magnetic Materials, 03 medical and health sciences, Outgassing, Electronic packages, 0302 clinical medicine, chemistry, Electronics, Leak detection, Electrical and Electronic Engineering, 0210 nano-technology, 030217 neurology & neurosurgery, Helium, Leakage (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::844133062b0d57cdabd93e9fff11a9ab
https://doi.org/10.1109/tcpmt.2020.2968126

المؤلفون: Codecasa L., D'Amore D., D'Alessandro V.

المساهمون: Codecasa, L., D'Amore, D., D'Alessandro, V.

مصطلحات موضوعية: Boundary Condition Independent, Electronic Packages, Nonlinear Compact Thermal Model, Nonlinear Model Order Reduction

Relation: info:eu-repo/semantics/altIdentifier/isbn/978-1-6654-1896-6; info:eu-repo/semantics/altIdentifier/wos/WOS:000758722800037; ispartofbook:2021 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021; 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021; firstpage:1; lastpage:6; numberofpages:6; http://hdl.handle.net/11311/1201135; info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-85123601111

الاتاحة: http://hdl.handle.net/11311/1201135
https://doi.org/10.1109/THERMINIC52472.2021.9626527

المؤلفون: Jimmy Chuang, Yuan-Liang Li, Jin Yang, David Shia

المصدر: Journal of Electronic Packaging. 143

مصطلحات موضوعية: Materials science, Computer Science Applications, Electronic, Optical and Magnetic Materials, Metal, Electronic packages, Metal injection molding, Mechanics of Materials, Phase (matter), Boiling, visual_art, Immersion (virtual reality), visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::35ee534020210677a9f16625f52d8037
https://doi.org/10.1115/1.4052711

المؤلفون: Lorenzo Codecasa, Dario D'Amore, Vincenzo d'Alessandro

المساهمون: Codecasa, Lorenzo, D'Amore, Dario, D'Alessandro, Vincenzo

المصدر: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

مصطلحات موضوعية: Nonlinear Compact Thermal Model, Nonlinear Model Order Reduction, Boundary Condition Independent, Electronic Packages

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c88abe9a9a292daf76ef620b29e20c30
https://doi.org/10.1109/therminic52472.2021.9626527

المؤلفون: Shu Ping Lin, Cher Ming Tan, Vivek Sangwan, Ching Hsiang Chen, Jia Yuan Chen, Guan Ling Seow, Udit Narula

المصدر: Journal of Materials Chemistry C. 8:1943-1952

مصطلحات موضوعية: 010407 polymers, Materials science, business.industry, Extrapolation, Humidity, 02 engineering and technology, General Chemistry, Integrated circuit, 021001 nanoscience & nanotechnology, 01 natural sciences, Moisture resistance, 0104 chemical sciences, law.invention, Electronic packages, law, Materials Chemistry, 0210 nano-technology, Process engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f25881fa2353bb5fda445cfa5c9b9383
https://doi.org/10.1039/c9tc04298a

المؤلفون: Prisacaru, A.

المساهمون: Zhang, Kouchi, Gromala, P.J., Delft University of Technology

مصطلحات موضوعية: electronic packages, piezoresitive stress sensor, machine learning, reliability, prognostics, virtual twin, diagnostics

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::01fe355f15f2378443cc0456bd0197a5
http://resolver.tudelft.nl/uuid:a586c76e-ff97-4f24-9b0f-f62417539495

المؤلفون: Sukrut Phansalkar, Changsu Kim, Bongtae Han

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Shadow moire, Spectrum analyzer, Electronic packages, Digital image correlation, Computer science, Computational mechanics, Mechanical engineering, Temperature measurement, Molding (decorative)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::88432bb7823fc1ef37ae66d908c33414
https://doi.org/10.1109/ectc32696.2021.00239