المؤلفون: Christopher M. Gourlay, S.A. Belyakov, J.W. Xian, Z. Q. Li

المساهمون: Nihon Superior Co Ltd, Engineering & Physical Science Research Council (EPSRC)

المصدر: Journal of Electronic Materials. 47:84-95

مصطلحات موضوعية: Technology, Pb-free solder, Materials science, INTERFACIAL MICROSTRUCTURE, Applied physics, Solid-state physics, Materials Science, Intermetallic, Materials Science, Multidisciplinary, Cu6Sn5, 02 engineering and technology, 01 natural sciences, Rod, Physics, Applied, Engineering, Deflection (engineering), Ball grid array, STRENGTH, 0103 physical sciences, Materials Chemistry, Perpendicular, electron backscatter diffraction, INTERMETALLIC COMPOUNDS, Electrical and Electronic Engineering, Composite material, Applied Physics, 010302 applied physics, Science & Technology, Physics, 0906 Electrical And Electronic Engineering, Engineering, Electrical & Electronic, MECHANICAL-PROPERTIES, FRACTURE-BEHAVIOR, Reliability, 021001 nanoscience & nanotechnology, Condensed Matter Physics, AG-CU ALLOYS, ELECTRONIC INTERCONNECTIONS, Electronic, Optical and Magnetic Materials, AG3SN PLATE FORMATION, LEAD-FREE SOLDER, Physical Sciences, GROWTH, 0210 nano-technology, Electron backscatter diffraction

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ca5909b2fb3febe37221aba807464e32
https://doi.org/10.1007/s11664-017-5763-7

المؤلفون: Xian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K., Gourlay, C. M.

مصطلحات موضوعية: Lead-Free Solder, Electronic Interconnections, Phase-Stability, Powder Diffraction, Nisn4 Formation, Tin, Ni, Alloys, Joints, Solidification, 1600 Chemistry, 2210 Mechanical Engineering, 2211 Mechanics of Materials, 2505 Materials Chemistry, 2506 Metals and Alloys

Relation: orcid:0000-0002-0721-6600; Not set; EP/M002241/1; AS132/PD/5784; AS141/PD/7413

الاتاحة: https://espace.library.uq.edu.au/view/UQ:692215

المؤلفون: Cao, Ying S., Jiang, Li Jun, Ruehli, Albert E., Fan, Jun, Drewniak, James L.

المصدر: Electrical and Computer Engineering Faculty Research & Creative Works

مصطلحات موضوعية: Electric Network Analysis, Electromagnetic Pulse, Electronics Packaging, Equivalent Circuits, Partial-Element Equivalent-Circuit Methods, Radiation, Integrated Circuit Modeling, Connectors, Integrated Circuit Interconnections, RLC Circuits, Electric Potential, Mathematical Model, Printed Circuit Interconnections, Electromagnetic Interference, EMI, Electromagnetic Radiations, Parasitic Structures, Electronic Interconnections, Partial Element Equivalent Circuit Method, PEEC Method, Electrical and Computer Engineering

Relation: https://scholarsmine.mst.edu/ele_comeng_facwork/2785; https://doi.org/10.1109/EPEPS.2016.7835454

الاتاحة: https://scholarsmine.mst.edu/ele_comeng_facwork/2785
https://doi.org/10.1109/EPEPS.2016.7835454